IP Library Granted Patent US 9,018,733
Granted Patent B1
US 9,018,733 · App. 14/201,932 · Granted Apr 28, 2015

Capacitor, storage node of the capacitor, and method of forming the same

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Quick Facts
Patent No.
US 9,018,733
App. No.
14/201,932
Granted
Apr 28, 2015
Kind
B1
Abstract

A semiconductor structure includes a substrate having thereon at least one conductive region; a plurality of cylinder-shaped electrodes disposed on the substrate, wherein each of the cylinder-shaped electrodes has a horizontal portion that is in direct contact with the at least one conductive region and a vertical sidewall portion connecting the horizontal portion; an upper support structure comprising a first lattice structure that is situated in a first horizontal level that is lower than a tip portion of each of the cylinder-shaped electrodes; and a lower support structure comprising a second lattice structure that interlocks middle portions of the cylinder-shaped electrodes.

Claims (15)

1. A semiconductor structure, comprising:

a substrate having thereon at least one conductive region;

a plurality of cylinder-shaped electrodes disposed on the substrate, wherein each of the cylinder-shaped electrodes has a horizontal portion that is in direct contact with the at least one conductive region and a vertical sidewall portion connecting the horizontal portion;

an upper support structure comprising a first lattice structure that is situated in a first horizontal level that is lower than a tip portion of each of the cylinder-shaped electrodes, wherein the upper support structure further comprises an annular spacer around the tip portion of each of the cylinder-shaped electrodes; and

a lower support structure comprising a second lattice structure that interlocks middle portions of the cylinder-shaped electrodes.

2. The semiconductor structure according to claim 1 wherein the annular spacer comprises silicon oxide or polysilicon.

3. The semiconductor structure according to claim 1 wherein the annular spacer, the upper support structure, and the lower support structure have substantially the same pattern.

4. The semiconductor structure according to claim 1 wherein the upper support structure and the lower support structure have substantially the same pattern.

5. The semiconductor structure according to claim 1 wherein the upper support structure and the lower support structure prevent the cylinder-shaped electrodes from toppling.

6. The semiconductor structure according to claim 1 further comprising a stop layer covering a top surface of the substrate.

7. The semiconductor structure according to claim 6 wherein the stop layer comprises silicon nitride.

8. The semiconductor structure according to claim 1 wherein the first lattice structure and the second lattice structure comprise silicon nitride.

9. The semiconductor structure according to claim 1 wherein a plurality of discontinuous gaps are dispersed around each of the cylinder-shaped electrodes.

10. The semiconductor structure according to claim 1 further comprising a capacitor dielectric layer conformally covers the cylinder-shaped electrodes, the upper support structure, and the lower support structure.

11. The semiconductor structure according to claim 10 further comprising a capacitor electrode on the capacitor dielectric layer.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2014
From: LEE, TZUNG-HAN; HU, YAW-WEN
To: INOTERA MEMORIES, INC.
Reel/Frame 032387/0638 →