Semiconductor device and method of forming inductor over insulating material filled trench in substrate
View Patent ↗A semiconductor device has a trench formed in a substrate. The trench has tapered sidewalls and depth of 10-120 micrometers. A first insulating layer is conformally applied over the substrate and into the trench. An insulating material, such as polymer, is deposited over the first insulating layer in the trench. A first conductive layer is formed over the insulating material. A second insulating layer is formed over the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and electrically contacts the first conductive layer. The first and second conductive layers are isolated from the substrate by the insulating material in the trench. A third insulating layer is formed over the second insulating layer and second conductive layer. The first and second conductive layers are coiled over the substrate to exhibit inductive properties.
1. A method of making a semiconductor device, comprising:
providing a substrate;
forming a trench in the substrate to follow a coiled path;
conformally applying a first insulating layer into the trench;
depositing an insulating material in contact with the first insulating layer to fill the trench;
forming a first conductive layer over a surface of the insulating material opposite the first insulating layer; and
forming a second conductive layer over the first conductive layer as a coil to exhibit an inductive property, the insulating material in the trench isolating the first conductive layer and second conductive layer from the substrate.
2. The method of claim 1 , wherein a depth of the trench is 10-120 micrometers.
3. The method of claim 1 , wherein the insulating material includes a polymer material.
4. The method of claim 1 , wherein the trench includes tapered sidewalls.
5. The method of claim 1 , further including forming a second insulating layer over the first conductive layer.
6. The method of claim 5 , further including forming a third insulating layer over the second insulating layer and the second conductive layer.
7. A method of making a semiconductor device, comprising:
providing a substrate;
forming a trench in the substrate to follow a coiled path;
conformally applying a first insulating layer into the trench;
depositing an insulating material in contact with the first insulating layer to fill the trench; and
forming a first conductive layer over a surface of the insulating material as a coil to exhibit an inductive property.
8. The method of claim 7 , wherein a depth of the trench is 10-120 micrometers.
9. The method of claim 7 , wherein the insulating material includes a polymer material.
10. The method of claim 7 , wherein the trench includes tapered sidewalls.
11. The method of claim 7 , further including forming a second insulating layer over the first conductive layer.
12. The method of claim 11 , further including forming a second conductive layer over the first conductive layer as a coil to exhibit an inductive property.
13. The method of claim 12 , further including forming a third insulating layer over the second insulating layer and the second conductive layer.
14. A method of making a semiconductor device, comprising:
providing a substrate;
forming a trench in the substrate to follow a coiled path;
forming a first insulating layer into the trench;
depositing an insulating material in contact with the first insulating layer; and
forming a first conductive layer over a surface of the insulating material as a coil to exhibit an inductive property.
15. The method of claim 14 , wherein the trench includes tapered sidewalls.
16. The method of claim 14 , wherein a depth of the trench is 10-120 micrometers.
17. The method of claim 14 , further including forming a second insulating layer over the first conductive layer.
18. The method of claim 17 , further including forming a second conductive layer over the first conductive layer as a coil to exhibit an inductive property.
19. The method of claim 18 , further including forming a third insulating layer over the second insulating layer and the second conductive layer.