INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE
An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.
1 . An integrated circuit package system comprising:
providing a mountable structure having a contact pad and an inner pad;
mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and
connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.
2 . The system as claimed in claim 1 wherein providing the mountable structure includes providing an insulation layer or a semiconductor die
3 . The system as claimed in claim 1 further comprising forming the integrated circuit device includes:
providing a first integrated circuit; and
mounting a second integrated circuit over the first integrated circuit.
4 . The system as claimed in claim 1 further comprising:
mounting the mountable structure over a carrier; and
connecting the contact pad and the carrier; and
encapsulating the carrier and the mountable structure with the linear through channel exposed.
5 . The system as claimed in claim 1 further comprising forming an encapsulation over the mountable structure with the linear through channel exposed and with the encapsulation planar with the integrated circuit device first side.
6 . An integrated circuit package system comprising:
providing a mountable structure having a contact pad and an inner pad;
mounting an integrated circuit device having a linear through channel over the mountable structure with the contact pad exposed and with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and
connecting a mounting interconnect between the linear through channel exposed on the integrated circuit device second side and the inner pad.
7 . The system as claimed in claim 6 further comprising forming an underfill around the mounting interconnect.
8 . The system as claimed in claim 6 wherein providing the mountable structure includes providing the mountable structure having the protective layer with the contact pad exposed from the protective layer.
9 . The system as claimed in claim 6 wherein mounting the integrated circuit device having the linear through channel over the mountable structure includes mounting the integrated circuit device over the inner pad.
10 . The system as claimed in claim 6 further comprising:
mounting a packaged module over a carrier;
mounting the mountable structure over the packaged module;
connecting the contact pad and the carrier; and
encapsulating the carrier, the packaged module, the mountable structure, and the integrated circuit device with the linear through channel exposed; and
mounting a device over the linear through channel.