IP Library Granted Patent US 9,703,351
Granted Patent B2
US 9,703,351 · App. 14/488,724 · Granted Jul 11, 2017

Method and apparatus for power control

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Quick Facts
Patent No.
US 9,703,351
App. No.
14/488,724
Granted
Jul 11, 2017
Kind
B2
Abstract

Embodiments of the present invention relate to limiting maximum power dissipation occurred in a processor. Therefore, when an application that requires excessive amounts of power is being executed, the execution of the application may be prevented to reduce dissipated or consumed power.

Claims (24)

1. A method comprising:

operatively coupling a temperature sensor chip to a computer chip, the computer chip including multiple processing cores each associated with a field value of a Configuration Status Register (CSR) indicating a maximum power consumption limit for the respective processing core;

tracking the temperature of the computer chip by monitoring temperature sensed by the temperature sensor chip; and

reducing performance in the computer chip to reduce temperature of the computer chip in an event the monitored temperature exceeds a threshold, wherein reducing the performance includes dynamically adjusting the field value of the CSR associated with at least one of the multiple processing cores in the event the monitored temperature exceeds the predetermined threshold.

2. The method of claim 1 wherein the temperature is a junction temperature of the computer chip.

3. The method of claim 1 wherein reducing performance in the computer chip includes preventing events from being processed in the computer chip to reduce temperature of the computer chip.

4. The method of claim 3 wherein preventing events from being processed in the computer chip to reduce temperature of the computer chip includes preventing instructions from being processed.

5. The method of claim 1 wherein reducing performance in the computer chip includes reducing the rate at which further events are processed in the computer chip.

6. An apparatus comprising:

a diode interface operatively coupled to a thermal diode of a computer chip and to a temperature sensor chip external to the computer chip, the computer chip including multiple processing cores each associated with a field value of a Configuration Status Register (CSR) indicating a maximum power consumption limit for the respective processing core;

a temperature monitor module operatively coupled to the temperature sensor chip to track temperature of the computer chip by monitoring temperature sensed by the temperature sensor chip via the diode interface; and

a performance reduction module operatively coupled to the temperature monitor module to receive information to reduce performance in the computer chip to reduce temperature of the computer chip in an event the monitored temperature exceeds a threshold, wherein the performance reduction module dynamically adjusts the field value of the CSR associated with at least one of the multiple processing cores in the event the monitored temperature exceeds the predetermined threshold.

7. The apparatus of claim 6 wherein the temperature is a junction temperature of the computer chip.

8. The apparatus of claim 6 wherein the performance reduction module reduces performance by preventing events from being processed in the computer chip to reduce temperature of the computer chip.

9. The apparatus of claim 8 wherein preventing events from being processed in the computer chip to reduce temperature of the computer chip includes preventing instructions from being processed.

10. The apparatus of claim 6 wherein the performance reduction module reduces performance by reducing the rate at which further events are processed in the computer chip.

11. A method comprising:

operatively coupling a temperature sensor chip to a computer chip, the computer chip including multiple processing cores each associated with a field value of a Configuration Status Register (CSR) indicating a maximum power consumption limit for the respective core;

tracking the temperature of the computer chip by monitoring temperature sensed by the temperature sensor chip; and

reducing power consumption of the chip to reduce temperature of the computer chip in an event the monitored temperature exceeds a threshold, wherein reducing the power consumption includes dynamically adjusting the field value of the CSR associated with at least one of the multiple processing cores in the event the monitored temperature exceeds the predetermined threshold.

12. The method of claim 11 wherein the temperature is a junction temperature of the computer chip.

13. The method of claim 11 wherein reducing power consumption includes preventing events from being processed in the computer chip.

14. The method of claim 11 wherein reducing power consumption includes reducing the rate at which further events are processed in the computer chip.

15. The method of claim 11 further comprising, after reducing power consumption, restoring full power operation to the computer chip upon the monitored temperature falling below the threshold.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053179/0320 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2020
From: CAVIUM, LLC
To: CAVIUM INTERNATIONAL
Reel/Frame 051948/0807 →
CERTIFICATE OF CONVERSION AND CERTIFICATE OF FORMATION Recorded Oct 2, 2018
From: CAVIUM, INC.
To: CAVIUM, LLC
Reel/Frame 047185/0422 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2018
From: JP MORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: CAVIUM, INC; CAVIUM NETWORKS LLC; QLOGIC CORPORATION
Reel/Frame 046496/0001 →
SECURITY AGREEMENT Recorded Aug 17, 2016
From: CAVIUM, INC.; CAVIUM NETWORKS LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039715/0449 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2014
From: CARLSON, DAVID A.; KESSLER, RICHARD E; HAIDER, AMER
To: CAVIUM NETWORKS, INC.
Reel/Frame 034270/0746 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2014
From: CAVIUM NETWORKS, INC.
To: CAVIUM, INC.
Reel/Frame 034270/0772 →