IP Library Granted Patent US 9,465,048
Granted Patent B1
US 9,465,048 · App. 14/667,676 · Granted Oct 11, 2016

Probe unit for test tools and method of manufacturing the same

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Quick Facts
Patent No.
US 9,465,048
App. No.
14/667,676
Granted
Oct 11, 2016
Kind
B1
Abstract

The present invention provides a novel method of manufacturing the probe unit and a tip assemble and disassemble procedure for test tools, which includes a body with a joint portion and a base portion and a probe tip extending from one side of the base portion opposite to the joint portion, where the probe tip and the base portion are integrally made of same material different from the material of the joint portion.

Claims (20)

1. A method of manufacturing probe units for test tools, comprising:

providing a substrate;

forming a plurality of recesses with the shape of desired probe tip in said substrate;

depositing a first material layer on said substrate and filling up said recesses to form a probe tip in each said recess;

depositing a second material layer on said first material layer; and

patterning said first material layer and said second material layer into a plurality of probe units, wherein said second material layer forms a joint portion of said probe unit for jointing a test tool, and each said probe unit comprises one said probe tip;

pressing a probe arm on said joint portion of one said probe unit;

assembling said probe arm and said joint portion of said probe unit;

changing the temperature of said substrate to expand said recesses and release said probe tip from said substrate; and

pulling out said probe unit with said probe arm.

2. The method of manufacturing probe units for test tools of claim 1 , wherein the coefficient of thermal expansion of said substrate is different from the coefficient of thermal expansion of said first material layer.

3. The method of manufacturing probe units for test tools of claim 1 , wherein said probe arm and said joint portion of said probe unit are assembled by melting and welding.

4. The method of manufacturing probe units for test tools of claim 3 , wherein said probe arm and said joint portion are melted and welded by pulse laser heating or high voltage heating.

5. The method of manufacturing probe units for test tools of claim 3 , further comprising the disassembly steps of:

placing said probe tip into said recess;

changing the temperature of said substrate to contract said recesses and clamp said probe tip;

melting and debonding said probe arm and said probe tip; and

removing said probe arm from said clamped probe tip.

6. The method of manufacturing probe units for test tools of claim 1 , wherein said probe arm and said joint portion of said probe unit are assembled by vacuum absorption.

7. The method of manufacturing probe units for test tools of claim 6 , further comprising the disassembly steps of gas purging said probe arm to release said probe unit.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2015
From: WANG, WEI-CHIH
To: INOTERA MEMORIES, INC.
Reel/Frame 035246/0696 →