Silicon interposer and fabrication method thereof
View Patent ↗A silicon interposer includes a silicon substrate having a front side and a rear side opposite to the front side; a first integrated circuit chip disposed in the front side of the silicon substrate; a second integrated circuit chip disposed in the front side of the silicon substrate and being in close proximity to the first integrated circuit chip; a dummy kerf region between the first integrated circuit chip and the second integrated circuit chip; and at least a circuit device disposed in the front side of the silicon substrate within the kerf region.
1. A silicon interposer, comprising:
a silicon substrate having a front side and a rear side opposite to the front side;
a first integrated circuit chip disposed in the front side of the silicon substrate, wherein the first integrated circuit chip comprises a first memory array;
a second integrated circuit chip disposed in the front side of the silicon substrate and being in close proximity to the first integrated circuit chip, wherein the second integrated circuit chip comprises a second memory array;
a dummy kerf region between the first integrated circuit chip and the second integrated circuit chip; and
at least a circuit device disposed in the front side of the silicon substrate within the kerf region.
2. The silicon interposer according to claim 1 , wherein the dummy kerf region separates the first integrated circuit chip from the second integrated circuit chip.
3. The silicon interposer according to claim 1 , wherein the circuit device comprises a MOS, a transistor, a capacitor, a resistor, an inductor, a fuse circuit, or an electrostatic discharge (ESD) device.
4. The silicon interposer according to claim 1 further comprising a redistribution layer (RDL) on the front side and wherein the RDL covers the first integrated circuit chip, the second integrated circuit chip, and the dummy kerf region.
5. The silicon interposer according to claim 4 , wherein the RDL comprises at least a dielectric layer, metal traces, and bump pads for further connections.
6. The silicon interposer according to claim 4 further comprising through-substrate vias (TSVs) in the silicon substrate to electrically connect the RDL.
7. The silicon interposer according to claim 4 further comprising at least a semiconductor die mounted on the RDL, wherein the RDL is disposed between the semiconductor die and the first integrated circuit chip.
8. The silicon interposer according to claim 7 , wherein the semiconductor die is electrically connected to the RDL through micro-bumps.
9. The silicon interposer according to claim 7 further comprising a mold compound on the front side, wherein the mold compound covers the semiconductor die and top surface of the RDL, wherein the mold compound is in direct contact with the semiconductor die.