Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
View Patent ↗A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation layer, and a conductive structure. The metal layer is over the semiconductor substrate. The passivation layer is over the metal layer and includes an opening. The conductive structure is in contact with the metal layer in a patterned surface structure of the conductive structure through the opening of the passivation layer.
1. A semiconductor structure, comprising:
a semiconductor substrate;
a metal layer over the semiconductor substrate;
a passivation layer over the metal layer, the passivation layer comprising at least one opening;
a patterned surface structure comprising portions of the passivation layer located in the at least one opening of the passivation layer and comprising a supporting portion; and
a conductive structure comprising a solder material located over the patterned surface structure and in direct contact with the metal layer through the at least one opening of the passivation layer, wherein portions of the conductive structure extend at least partially into the at least one opening of the passivation layer and contact substantially entire upper surfaces and sidewalls of the supporting portion of the patterned surface structure.
2. The semiconductor structure of claim 1 , wherein the conductive structure comprises a solder bump or a solder ball.
3. The semiconductor structure of claim 1 , wherein the supporting portion of the patterned surface structure comprises at least one of a mesh, regularly aligned pillars, or a concentric cylinder.
4. The semiconductor structure of claim 3 , wherein the supporting portion of the patterned surface structure comprises the regularly aligned pillars having a cross section comprising at least one of a polygon, a circle, or an oval.
5. The semiconductor structure of claim 1 , wherein the supporting portion of the patterned surface structure is made of at least one inorganic material such as silicon dioxide, silicon nitride, titanium dioxide, aluminum oxide, or at least one organic material such as polyimide, polybenzoxazole (PBO), or a combination thereof.
6. The semiconductor structure of claim 1 , wherein the conductive structure comprises at least one of Sn, Ag, Cu, Au, an alloy thereof or a combination thereof.
7. The semiconductor structure of claim 1 , wherein the opening of the passivation layer has a shape comprising at least one of a polygon, a circle, or an oval.
8. A semiconductor chip, comprising:
a substrate;
metal material over the substrate;
passivation material over the metal material, the passivation material comprising openings, at least some openings exposing a patterned surface structure comprising portions of the passivation material; and
conductive structures comprising a solder material located over the patterned surface structures, extending at least partially into the at least some openings of the passivation material, and in direct contact with the metal material, the conductive structure in contact with substantially entire upper surfaces and sidewalls of the patterned surface structure.
9. The semiconductor chip of claim 8 , wherein each of the passivation material and the patterned surface structures comprises a dielectric material comprising silicon dioxide, silicon nitride, titanium dioxide, or a combination thereof.
10. The semiconductor chip of claim 8 , wherein the patterned surface structures comprise at least one of a mesh, regularly aligned pillars, or at least one concentric cylinder.
11. The semiconductor chip of claim 10 , wherein the patterned surface structures comprise the regularly aligned pillars having a cross section comprising at least one of a polygon, a circle, or an oval.
12. The semiconductor chip of claim 10 , wherein the at least one concentric cylinder comprises two concentric cylinders.
13. The semiconductor chip of claim 8 , wherein the conductive structures comprise a solder bump or a solder ball.
14. The semiconductor chip of claim 8 , wherein the conductive structures comprise at least one of Sn, Ag, Cu, Au, an alloy thereof or a combination thereof.