Package-on-package assembly and method for manufacturing the same
View Patent ↗A package-on-package (PoP) assembly includes a bottom die package and a top die package mounted on the bottom die package. The bottom die package includes an interposer having a first side and a second side opposite to the first side, at least one chip mounted on the first side within a chip mounting area through a plurality of bumps, a molding compound disposed on the first side, the molding compound covering the at least one chip, and a plurality of peripheral bump structures penetrating through the molding compound within the peripheral area. Each of the peripheral bump structures includes conductive pillar and a partial TMV directly stacked on the conductive pillar. A plurality of solder balls is mounted on the second side of the interposer. The top die package is electrically connected to the peripheral bump structures.
1. A package-on-package (PoP) assembly, comprising:
a bottom die package comprising:
an interposer having a first side and a second side opposite to the first side;
at least one chip mounted on the first side within a chip mounting area through a plurality of bumps;
a molding compound disposed on the first side, the molding compound being adjacent to the at least one chip;
a plurality of peripheral bump structures penetrating through the molding compound within the peripheral area, wherein each of the peripheral bump structures comprises a conductive pillar embedded in the molding compound and a partial through-mold-via (partial TMV) directly stacked on the conductive pillar, wherein the conductive pillar comprises a first conductive stud and a second conductive stud stacked on the first conductive stud; and
a plurality of solder balls mounted on the second side;
a top die package mounted on the bottom die package and connected to the peripheral bump structures.
2. The PoP assembly according to claim 1 , wherein the interposer comprises a redistribution layer (RDL).
3. The PoP assembly according to claim 2 , wherein the RDL comprises at least one dielectric layer and at least one metal layer.
4. The PoP assembly according to claim 1 , wherein the top die package comprises at least a molded semiconductor die.
5. The PoP assembly according to claim 1 , wherein a top surface of the conductive pillar is higher than that of the bumps.
6. The PoP assembly according to claim 1 , wherein an undercut is present between the conductive pillar and the partial TMV.
7. The PoP assembly according to claim 1 , wherein the first conductive stud comprises copper, aluminum, tungsten, titanium, or titanium nitride.
8. The PoP assembly according to claim 7 , wherein the second conductive stud comprises copper, aluminum, tungsten, titanium, or titanium nitride.
9. The PoP assembly according to claim 1 , wherein the partial TMV comprises copper, aluminum, tungsten, titanium, or titanium nitride.