Methods of cooling packaged semiconductor devices
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions.
1. A method of cooling a packaged semiconductor device, the method comprising:
providing a package, wherein the package includes a substrate, a cover coupled to a perimeter of the substrate, a plurality of members disposed between the substrate and the cover, and a plurality of outer partitions, wherein each of the plurality of outer partitions is disposed between two adjacent members of the plurality of members and extends between the substrate and the cover, wherein the package further includes an inlet port coupled to the cover and an outlet port coupled to one of the plurality of outer partitions and further includes a ring member that allows fluid flow between an inner partition that defines a device mounting region and a first one of the plurality of outer partitions and a second portion that prevents fluid flow between the inner partition and a second one of the plurality of outer partitions;
coupling a semiconductor device to the device mounting region of the substrate of the package; and
passing a fluid from the inlet port of the package and over a top surface of the semiconductor device, through at least one of the plurality of outer partitions, under a bottom surface of the semiconductor device, and to the outlet port of the package.
2. The method according to claim 1 , wherein the fluid comprises a non-electrically conductive liquid during the passing of the fluid.
3. The method according to claim 1 , wherein the fluid comprises a liquid selected from the group consisting of Polyalphaolefin (PAO) liquid, R-134a working fluid, thermal fluid FC-72, HFE-7100, refrigerant R-123, perfluoropolyether, a fluorinated refrigerant, a nanofluid comprising nanoparticles comprised of SiC, CuO, or Al 2 O 3 , and combinations thereof.
4. The method according to claim 1 , further comprising coupling a pump to the inlet port, coupling a heat exchanger to the outlet port, and coupling the heat exchanger to the pump, and wherein passing the fluid comprises flowing the fluid from the pump to the inlet port, flowing the fluid from the outlet port to the heat exchanger, and flowing the fluid from the heat exchanger to the pump.
5. The method according to claim 1 , wherein the package includes a plurality of outlet ports, and wherein passing the fluid comprises flowing the fluid from the inlet port of the package to the plurality of outlet ports of the package.
6. The method according to claim 1 , wherein the semiconductor device comprises one or more integrated circuit dies coupled vertically or horizontally over an interposer substrate, and wherein passing the fluid comprises flowing the fluid from the inlet port through an upper-most one of the integrated circuit dies, and circulating the fluid through each of the vertically or horizontally coupled integrated circuit dies.
7. The method according to claim 6 , wherein an upper-most one of the integrated circuit dies comprises a plurality of fins disposed on a top surface thereof, and wherein passing the fluid comprises flowing a portion of the fluid between the plurality of fins.
8. The method according to claim 6 , wherein the interposer substrate is coupled to the substrate of the package by a plurality of conductive bumps, and wherein passing the fluid comprises flowing a portion of the fluid between the plurality of conductive bumps.
9. A method of cooling a packaged semiconductor device, the method comprising:
flowing a fluid through an inlet port into a package;
causing the fluid to flow:
radially outward from the inlet port across a top surface of a semiconductor device mounted within an inner partition defined by an inner ring member,
thence to flow through apertures in the inner partition into respective first outer partitions, the respective first outer partitions defined at least in part by the inner ring member, an outer ring member, and respective elongated members disposed between a substrate and a cover,
thence to flow underneath the semiconductor device,
thence to flow from underneath the semiconductor device to respective second outer partitions, and
flowing the fluid from the respective second outer partitions through an outlet port.
10. The method according to claim 9 , further comprising causing the fluid to flow through fins mounted on a top surface of the semiconductor device.
11. The method according to claim 9 , further comprising causing the fluid to flow between conductive bumps mounted on a bottom surface of the semiconductor device.
12. The method according to claim 9 , further comprising flowing the fluid from each respective second outer partition through a respective outlet port.
13. The method according to claim 9 , further comprising mounting the semiconductor device to the substrate.
14. The method according to claim 9 , wherein the semiconductor device comprises a plurality of integrated circuit dies coupled vertically over an interposer substrate, and further comprising flowing the fluid from the inlet port to an upper-most one of the integrated circuit dies, and thence circulating the fluid through each of the vertically coupled integrated circuit dies.
15. The method of claim 9 , further comprising coupling a pump to the inlet port, coupling a heat exchanger to the outlet port, and coupling the heat exchanger to the pump, and flowing the fluid from the pump to the inlet port, flowing the fluid from the outlet port to the heat exchanger, and flowing the fluid from the heat exchanger to the pump.
16. The method of claim 9 , further comprising mounting the inner ring member to the semiconductor device.
17. A method comprising:
coupling a fluid source to a package;
flowing fluid from the fluid source to an inlet port of the package; then
flowing the fluid from the inlet port to an inner partition in which is mounted a semiconductor device and flowing the fluid across cooling fins on a top major surface of the semiconductor device; then
flowing the fluid from the inner partition through an aperture to a first outer partition; then
flowing the fluid across conductive bumps on a bottom major surface of the semiconductor device; then
flowing the fluid into a second outer partition; and
flowing the fluid from the second outer partition to an outlet port.
18. The method according to claim 17 , further comprising flowing the fluid from the outlet port to a heat exchanger.
19. The method according to claim 18 , further comprising:
flowing the fluid from the inner partition through a second aperture to a third outer partition simultaneously with flowing the fluid from the inner partition through the aperture to the first outer partition; and
flowing the fluid into a fourth outer partition and flowing the fluid from the fourth outer partition to a second outlet port simultaneously with flowing the fluid into the second outer partition and flowing the fluid from the second outer partition to the outlet port.
20. The method according to claim 18 , further comprising coupling a pump to the inlet port, coupling a heat exchanger to the outlet port, and coupling the heat exchanger to the pump, and flowing the fluid from the pump to the inlet port, flowing the fluid from the outlet port to the heat exchanger, and flowing the fluid from the heat exchanger to the pump.