Methods of operating power semiconductor devices and structures
Power semiconductor devices, and related methods, where majority carrier flow is divided into paralleled flows through two drift regions of opposite conductivity types.
1. A method of operating a power semiconductor device, comprising:
passing majority carriers from a first-conductivity-type semiconductor source, through a portion of a second-conductivity-type semiconductor body region which has been inverted by the applied voltage on a gate electrode, into a first-conductivity-type intermediate region;
passing some ones of said majority carriers, from said first-conductivity-type intermediate region, through first-conductivity-type drift region portions, and passing others of said majority carriers through parts of second-conductivity-type drift region portions which have been inverted by immobile electrostatic charge, to a first-conductivity-type semiconductor drain region;
wherein said first-conductivity-type intermediate region has a higher doping than said first-conductivity-type drift region portions, and connects said channel to both said first-conductivity-type and said second-conductivity-type drift region portions;
whereby, in the ON state, majority carriers flow both through said first-conductivity-type and said second-conductivity-type drift region portions in parallel.
2. The method of claim 1 , wherein said first-conductivity-type source region is n-type, and said majority carriers are electrons.
3. The method of claim 1 , wherein said source, body, intermediate, and drain regions are silicon.
4. The method of claim 1 , wherein said immobile electrostatic charge is provided by cesium ions.
5. The method of claim 1 , wherein said immobile electrostatic charge consists of point charges.
6. The method of claim 1 , wherein said immobile electrostatic charge is provided by ions in dielectric material and/or by ions at a dielectric/semiconductor interface.
7. The method of claim 1 , wherein said immobile electrostatic charge is provided by ions in dielectric material in a trench.
8. The method of claim 1 , wherein said second-conductivity-type drift region portions have inhomogeneous doping, such that less heavily doped portions thereof are inverted by said immobile electrostatic charge.
9. A method of operating a power semiconductor device, comprising, in the ON state:
passing majority carriers from a first-conductivity-type semiconductor source, through a portion of a second-conductivity-type semiconductor body region which has been inverted by the applied voltage on a gate electrode, into a semiconductor drift region which includes both first-conductivity-type and second-conductivity-type drift region portions in parallel; and
passing some ones of said majority carriers through said first-conductivity-type drift region portions, and passing others of said majority carriers through parts of said second-conductivity-type drift region portions which have been inverted by immobile electrostatic charge, to a first-conductivity-type semiconductor drain region.
10. The method of claim 9 , wherein said first-conductivity-type source region is n-type, and said majority carriers are electrons.
11. The method of claim 9 , wherein said source, body, intermediate, and drain regions are silicon.
12. The method of claim 9 , wherein said immobile electrostatic charge is provided by cesium ions.
13. The method of claim 9 , wherein said immobile electrostatic charge consists of point charges.
14. The method of claim 9 , wherein said immobile electrostatic charge is provided by ions in dielectric material and/or by ions at a dielectric/semiconductor interface.
15. The method of claim 9 , wherein said immobile electrostatic charge is provided by ions in dielectric material in a trench.
16. The method of claim 9 , wherein said second-conductivity-type drift region portions have inhomogeneous doping, such that less heavily doped portions thereof are inverted by said immobile electrostatic charge.
17. A method of operating a power semiconductor device, comprising, in the ON state:
passing majority carriers from a first-conductivity-type semiconductor source, through a portion of a second-conductivity-type semiconductor body region which has been inverted by the applied voltage on a gate electrode, into a semiconductor drift region which includes both first-conductivity-type and second-conductivity-type semiconductor drift region portions in parallel; and
passing some ones of said majority carriers through said first-conductivity-type drift region portions, and passing others of said majority carriers through parts of said second-conductivity-type drift region portions which have been inverted by immobile electrostatic charge, through a first-conductivity-type semiconductor buffer region, to a second-conductivity-type minority-carrier-emitter region; and
passing minority carriers from said minority-carrier-emitter region through parts of said second-conductivity-type drift region portions which have not been inverted, and through additional second-conductivity-type regions, to a contact which is also electrically connected to said source region.
18. The method of claim 17 , wherein said first-conductivity-type source region is n-type, and said majority carriers are electrons.
19. The method of claim 17 , wherein said source, body, intermediate, and drain regions are silicon.
20. The method of claim 17 , wherein said immobile electrostatic charge is provided by cesium ions.