Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof
View Patent ↗A semiconductor package includes a redistributed layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a molding compound disposed on the first side and covering the at least one semiconductor die and the vertical sidewall of the RDL interposer; and a plurality of solder bumps or solder balls mounted on the second side.
1. A method for fabricating a semiconductor package, comprising:
providing a carrier;
forming a redistributed layer (RDL) interposer on the carrier;
mounting at least one semiconductor die on a first side of the RDL interposer;
cutting at least one cut trench penetrating through the RDL interposer, wherein the cut trench exposes a vertical sidewall of the RDL interposer;
molding the semiconductor die with a molding compound on the first side, wherein the molding compound fills into the cut trench and covers the vertical sidewall of the RDL interposer;
removing the carrier to expose a second side of the RDL interposer; and
forming a plurality of solder bumps or solder balls on the second side.
2. The method for fabricating a semiconductor package according to claim 1 , wherein the cut trench is cut along a dicing line.
3. The method for fabricating a semiconductor package according to claim 1 , wherein after removing the carrier, at least one protrudent feature is formed, wherein the protrudent feature protrudes from a surface on the second side.
4. The method for fabricating a semiconductor package according to claim 3 further comprising:
performing a planarization process to remove the protrudent feature.
5. The method for fabricating a semiconductor package according to claim 1 further comprising:
performing a wafer dicing process to separate individual semiconductor packages from one another.