Semiconductor package with multiple coplanar interposers
View Patent ↗A semiconductor package includes a first interposer, a second interposer, and a gap between the first interposer and the second interposer. The first interposer and the second interposer are coplanar. A first die is mounted on the first interposer and the second interposer. The first die includes first connection elements connecting the first die to the first interposer or the second interposer. A redistribution layer (RDL) structure is disposed on bottom surfaces of the first and second interposers for connecting the first interposer with the second interposer. The RDL structure includes at least one bridge trace traversing the gap to electrically connect the first interposer with the second interposer.
1. A semiconductor package, comprising:
a first interposer;
a second interposer, wherein the first interposer and the second interposer are coplanar;
a gap between the first interposer and the second interposer;
a first die mounted on the first interposer and the second interposer, wherein the first die comprises a plurality of first connection elements connecting the first die to the first interposer or the second interposer;
a second die mounted on the first interposer and the second interposer, wherein the second die comprises a plurality of second connection elements electrically connecting the second die to the first interposer or the second interposer; and
a redistribution layer (RDL) structure disposed on bottom surfaces of the first interposer and the second interposer for electrically connecting the first interposer with the second interposer.
2. The semiconductor package according to claim 1 , wherein the RDL structure comprises at least one bridge trace traversing the gap to electrically connect the first interposer with the second interposer.
3. The semiconductor package according to claim 2 , wherein the RDL structure comprises at least one metal layer and at least one dielectric layer, wherein the metal layer comprises the at least one bridge trace.
4. The semiconductor package according to claim 3 , further comprising a plurality of connectors on a lower surface of the RDL structure to electrically connect to the metal layer.
5. The semiconductor package according to claim 4 , wherein the connectors comprise a ball grid array, C4 bumps, metal bumps, or metal pillars.
6. The semiconductor package according to claim 1 , wherein the first connection elements and the second connection elements comprise solder bumps or metal bumps.
7. The semiconductor package according to claim 1 , further comprising a first molding compound surrounding the first die and the second die.
8. The semiconductor package according to claim 7 , further comprising a second molding compound encapsulating the first connection elements, the second connection elements, the first interposer, and the second interposer.
9. The semiconductor package according to claim 8 , wherein the first molding compound and the second molding compound have different compositions.
10. The semiconductor package according to claim 8 , wherein the gap is filled up with the second molding compound.
11. The semiconductor package according to claim 8 , wherein an interface between the first molding compound and the second compound is flush with active surfaces of the first die and the second die.