Processing apparatus
In accordance with one or more aspects of the disclosed embodiment a semiconductor processing apparatus is provided. The semiconductor processing apparatus includes a frame forming a sealable chamber having a longitudinal axis and lateral sides astride the longitudinal axis, the sealable chamber being configured to hold a sealed environment therein, at least one transport module mounted to the sealable chamber and having a telescoping carriage being configured so that the telescoping carriage is linearly movable relative to another portion of the transport module where the telescoping carriage and the other portion define a telescoping motion along the longitudinal axis, and at least one transfer robot mounted to the carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon.
1. A semiconductor processing apparatus comprising:
a frame forming a sealable chamber having a longitudinal axis and lateral sides astride the longitudinal axis, the sealable chamber being configured to hold a sealed environment therein, and having at least one transport chamber opening disposed on the lateral sides for coupling a substrate holding station to the sealable chamber with a pass-through axis passing through the lateral sides angled relative to the longitudinal axis;
at least one transport module mounted to the sealable chamber and having a telescoping carriage being configured so that the telescoping carriage is linearly movable relative to another portion of the transport module where the telescoping carriage and the another portion define a telescoping motion along the longitudinal axis so that the telescoping motion telescopes, relative to each other, the telescoping carriage and the another portion in a telescoping direction oriented with the longitudinal axis and produces moves of the telescoping carriage along the longitudinal axis relative to the another portion of the at least one transport module; and
at least one transfer robot mounted to the telescoping carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon.
2. The semiconductor processing apparatus of claim 1 , wherein a telescoping travel path of the telescoping carriage crosses an axis of entry/exit through the transport chamber opening through which the substrate holding station is communicably coupled to the transport chamber.
3. The semiconductor processing apparatus of claim 1 , wherein the at least one transport module is removable from the sealable chamber as a unit.
4. The semiconductor processing apparatus of claim 1 , wherein the at least one transfer robot is configured so that the at least one transfer arm is rotatable relative to the telescoping carriage.
5. The semiconductor processing apparatus of claim 1 , wherein the sealed environment is a vacuum environment and the at least one transfer robot includes a sealed drive section disposed within the vacuum environment.
6. The semiconductor processing apparatus of claim 1 , wherein the transport module includes a base member to which the telescoping carriage is movably mounted, the base member being fixedly and stationarily mounted relative to the frame.
7. The semiconductor processing apparatus of claim 1 , wherein the at least one transfer robot and telescoping carriage are configured so that positioning of the telescoping carriage within the sealable chamber is effected substantially independent of positioning of the at least one transfer arm for picking and placing substrates.
8. The semiconductor processing apparatus of claim 1 , the semiconductor processing apparatus further comprising kinematic locating features configured to engage the telescoping carriage for positioning the telescoping carriage within the sealable chamber.
9. The semiconductor processing apparatus of claim 1 , the semiconductor processing apparatus further comprising a controller and one or more sensors connected to the controller, the one or more sensors being located and configured to sense the telescoping carriage within the sealable chamber and the controller being configured to determine a position of the telescoping carriage within the sealable chamber based on signals from the one or more sensors.
10. The semiconductor processing apparatus of claim 1 , the semiconductor processing apparatus further comprising a controller and one or more sensors connected to the controller, the one or more sensors being located and configured to sense a substrate within the sealable chamber that is carried by the at least one transfer robot and the controller being configured to effect automatic wafer centering during transport of the substrate by the at least one transfer robot.
11. The semiconductor processing apparatus of claim 1 , wherein the telescoping carriage spans a width that extends from adjacent one lateral side of the sealable chamber to another lateral side of the sealable chamber.
12. The semiconductor processing apparatus of claim 1 , wherein the at least one transport module includes two telescoping carriages arranged laterally side by side within the sealable chamber.
13. The semiconductor processing apparatus of claim 1 , wherein the at least one transport module includes a multistage telescoping carriage having serially connected telescoping members and a drive system having drive motors distributed on respective telescoping members.
14. The semiconductor processing apparatus of claim 1 , wherein the at least one transfer robot includes at least one SCARA arm, each of the at least one SCARA arm having one or more arm links.
15. The semiconductor processing apparatus of claim 1 , wherein at least one of the at least one transfer robot includes a Z-axis drive.
16. The semiconductor processing apparatus of claim 1 , wherein each of the at least one transfer robot includes a Z-axis drive.
17. The semiconductor processing apparatus of claim 1 , wherein the at least one transport module includes a common Z-axis drive.
18. The semiconductor processing apparatus of claim 1 , wherein the at least one transport robot further comprising a drive section having a common drive spindle and multiple transport arms mounted to the common drive spindle.
19. The semiconductor processing apparatus of claim 1 , wherein the sealable chamber includes slot valves forming sealable ports, the slot valves being arranged to communicably couple one or more of twin process modules and single process modules to the sealable chamber.
20. The semiconductor processing apparatus of claim 19 , wherein the slot valves are arranged in one or more of a common horizontal plane, vertically spaced apart horizontal planes and a combination thereof.
21. The semiconductor processing apparatus of claim 19 , wherein the slot valves are arranged to provide substrate entry at a longitudinal front of the sealable chamber and substrate exit at a longitudinal rear of the sealable chamber or substrate entry at a longitudinal rear of the sealable chamber and substrate exit at a longitudinal front of the sealable chamber.
22. The semiconductor processing apparatus of claim 19 , wherein the slot valves are arranged to provide substrate entry or exit from the sealable chamber at a point disposed between longitudinal ends of the sealable chamber.
23. The semiconductor processing apparatus of claim 1 , wherein the semiconductor processing apparatus further comprising an atmospheric module and a substrate transport tunnel that is separate and distinct from the sealable chamber, the substrate transport tunnel being communicably coupled to the sealable chamber to provide substrate passage from the sealable chamber to the atmospheric module through the substrate transport tunnel.
24. The semiconductor processing apparatus of claim 1 , wherein the sealable chamber includes at least two chamber modules communicably coupled to each other to allow substrate handoffs between the at least two chamber modules.
25. A semiconductor processing apparatus comprising:
a frame forming a sealable chamber having a longitudinal axis and lateral sides, the sealable chamber being configured to hold a vacuum environment therein and having a pass-through axis passing through the lateral sides angled relative to the longitudinal axis,
at least one transport module fixedly mounted to the sealable chamber and having a telescoping carriage being configured so that the telescoping carriage is linearly movable relative to another portion of the transport module where the telescoping carriage and another portion define a telescoping motion along the longitudinal axis so that the telescoping motion telescopes, relative to each other, the telescoping carriage and the another portion in a telescoping direction oriented with the longitudinal axis and produces moves of the telescoping carriage along the longitudinal axis relative to the another portion of the at least one transport module, and
at least one transfer robot mounted to the telescoping carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon and a sealed drive section disposed within the vacuum where the sealed drive section includes power, data communication and cooling connections.
26. A semiconductor processing apparatus comprising:
a frame forming a chamber having a longitudinal axis, lateral sides astride the longitudinal axis and at least one load port, the chamber being configured to hold a controlled environment therein and having a pass-through axis passing through the lateral sides angled relative to the longitudinal axis,
a telescoping carriage disposed at least partly within the chamber and being configured so that the telescoping carriage is linearly movable relative to another portion of the chamber where the telescoping carriage and the another portion define a telescoping motion along the longitudinal axis so that the telescoping motion telescopes, relative to each other, the telescoping carriage and the another portion in a telescoping direction oriented with the longitudinal axis and produces moves of the telescoping carriage along the longitudinal axis relative to the another portion of the at least one transport module, and
at least one transfer robot mounted to the carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon.
27. The semiconductor processing apparatus of claim 26 , further comprising a Z-axis drive connected to the telescoping carriage and being configured to move the telescoping carriage in a direction substantially perpendicular to a direction of extension and retraction of the telescoping carriage.
28. The semiconductor processing apparatus of claim 26 , further comprising a Z-axis drive mounted to the telescoping carriage and being configured to move the at least one transfer robot in a direction substantially perpendicular to a direction of extension and retraction of the telescoping carriage.