Package-on-package assembly and method for manufacturing the same
View Patent ↗A package-on-package (PoP) assembly includes a bottom die package and a top die package. The bottom die package includes an interposer having a first side and a second side, an active chip mounted on the first side within a chip mounting area through first bumps, and a dummy chip mounted on the first side within a peripheral area. The dummy chip is directly mounted on a passivation layer of the interposer. A dielectric layer covers the active chip and the dummy chip. At least one TSV connecter penetrates through the dielectric layer and the dummy chip. A molding compound is disposed on the first side. The molding compound covers the active chip and the TSV chip. Solder bumps are mounted on the second side.
1. A package-on-package (PoP) assembly, comprising:
a bottom die package comprising
an interposer having a first side and a second side opposite to the first side;
at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps;
at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, wherein the dummy chip is directly mounted on a passivation layer of the interposer;
a dielectric layer covering the at least one active chip and the at least one dummy chip;
at least one TSV connecter penetrating through the dielectric layer and the dummy chip;
a molding compound disposed on the first side, the molding compound covering the at least one active chip and the at least one TSV chip; and
a plurality of solder bumps mounted on the second side;
a top die package mounted on the bottom die package.
2. The PoP assembly according to claim 1 , wherein the dummy chip is directly mounted on the passivation layer by using an adhesive.
3. The PoP assembly according to claim 1 , wherein TSV connecter is electrically connected to a metal trace pattern on the dielectric layer.
4. The PoP assembly according to claim 3 , wherein the top die package is mounted on the bottom die package through a plurality of second bumps disposed on the metal trace pattern.