Memory arrays having confined phase change material structures laterally surrounded with silicon nitride
Some embodiments include methods of forming memory cells. Heater structures are formed over an array of electrical nodes, and phase change material is formed across the heater structures. The phase change material is patterned into a plurality of confined structures, with the confined structures being in one-to-one correspondence with the heater structures and being spaced from one another by one or more insulative materials that entirely laterally surround each of the confined structures. Some embodiments include memory arrays having heater structures over an array of electrical nodes. Confined phase change material structures are over the heater structures and in one-to-one correspondence with the heater structures. The confined phase change material structures are spaced from one another by one or more insulative materials that entirely laterally surround each of the confined phase change material structures.
1. The memory array, comprising:
heater structures over an array of electrical nodes; the heater structures being in one-to-one correspondence with the electrical nodes; the array having rows extending along a first direction and having columns extending along a second direction substantially orthogonal to the first direction; wordlines being under the electrical nodes and extending along the first direction;
confined phase change material structures over the heater structures and in one-to-one correspondence with the heater structures;
bitlines across the confined phase change material structures, with the bitlines extending along the second direction;
conductive material caps between and contacting the bitlines and the confined phase change material structures;
the confined phase change material structures having lateral peripheries of phase change material; and
wherein:
the array has x-direction axes extending through the confined phase change material structures along the first direction and has y-direction axes extending through the confined phase change material structures along the second direction;
the confined phase change material structures and conductive material caps are spaced from one another along the x-direction axes by first insulative material regions comprising a first oxide-containing material having a first pair of opposing vertical sidewalls sandwiched between first nitride-containing materials that extend vertically along an entirety of the first pair of opposing vertical sidewalls;
the confined phase change material structures and conductive material caps are spaced from on another along the y-direction axes by second insulative material regions comprising a second oxide-containing material having a second pair of opposing vertically extending sidewalls sandwiched between second nitride-containing materials that extend vertically along an entirety of the second pair of opposing vertically extending sidewalls;
the first and second nitride-containing materials are silicon nitride; and
the lateral peripheries of the confined phase change material structures, the conductive material caps and the heater structures are entirely laterally surrounded by the first and second nitride-containing materials.
2. The memory array of claim 1 wherein the heater structures are configured as angled plates.
3. The memory array of claim 1 wherein the heater structures are configured as solid rods.
4. The memory array of claim 1 wherein the heater structures are configured as hollow tubes.
5. The memory array of claim 1 wherein the second insulative material regions are about a same depth as the first insulative material regions.