Interfaces and die packages, and apparatuses including the same
A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller configured to control the interface with control data received from at least one of the plurality of memory dies. The interface device of the memory device is configured to divide and multiplex an IO channel between the memory die package and the memory controller into more than one channel using the control data receive from the at least one of the plurality of memory dies. The interface device for a memory device includes a control input buffer configured to receive an enable signal through a control pad, a first input buffer configured to receive a first data through a first IO pad in response to a first state of the enable signal, and a second input buffer configured to receive a second data through a second IO pad in response to a second state of the enable signal. The interface device further includes an input multiplexer configured to multiplex the first data and the second data to provide an input data.
1. An interface device, comprising:
a control input buffer configured to receive an enable signal;
a first input buffer configured to receive first data and provide first input data;
a second input buffer configured to receive second data and provide second input data; and
an input multiplexer configured to multiplex the first input data and the second input data to provide integrated data in response to the enable signal.
2. The interface device of claim 1 , wherein the device is configured to alternate receiving the first data through the first input buffer and receiving the second data through the second input buffer.
3. The interface device of claim 1 , further comprising:
a delay unit configured to provide a delay to the integrated data; and
a latch unit configured to store the delayed integrated data.
4. The interface device of claim 1 , wherein the first input buffer is configured to receive a first die enable signal and to provide the first input data in response to receiving the first die enable signal, and the second input buffer is configured to receive a second die enable signal and to provide the second input data in response to receiving the second die enable signal.
5. The interface device of claim 1 , further comprising:
a first input/output (IO) pad configured to receive the first data from a first group of dice in die package; and
a second IO pad configured to receive the second data from a second group of dice in the die package.
6. A memory device, comprising:
a plurality of memory dice; and
an interface device having
a control input buffer configured to receive an enable signal through a control pad from a first group of the plurality of memory dice, each of the first group of memory dice being coupled to the control pad,
a first input buffer configured to receive first data through a first input/output (IO) pad from the first group of memory dice, each of the first group of memory dice being coupled to the first IO pad,
a second input buffer configured to receive second data through a second IO pad from a second group of the plurality of memory dice, each of the second group of memory dice being coupled to the second IO pad, and
an input multiplexer configured to multiplex the first data and the second data to provide integrated data in response to the enable signal.
7. A memory device, comprising:
a plurality of memory dice; and
an interface device having
an output multiplexer configured to divide the output data to provide first data and second data in response to an external control signal, the output multiplexer being further configured to provide a first control signal and a second control signal;
a first pre-driving circuit configured to provide a first pull-up signal and a first pull-down signal in response to the first data and the first control signal;
a first output buffer configured to provide a first output data in response to the first pull-up signal and the first pull-down signal through a first input/output (IO) pad coupled to a first group of the plurality of memory dice;
a second pre-driving circuit configured to provide a second pull-up signal and a second pull-down signal in response to the second data and the second control signal; and
a second output buffer configured to provide a second output data in response to the second pull-up signal and the second pull-down signal through a second IO pad coupled to a second group of the plurality of memory dice.
8. A memory apparatus, comprising:
a controller interfaced to a plurality of dice divided into groups of dice; and
respective input/output (IO) buses to couple the controller to each of the groups of dice, each IO bus being decoupled from other groups of dice, the memory apparatus being configured to multiplex information exchanged with selected ones of the groups of dice on the respective IO bus in response to a control signal.
9. An interface device couplable between a controller and a plurality of groups of circuits, the interface device comprising:
a control input buffer configured to receive an enable signal from the controller, the controller having a channel to couple with the interface device;
a first input buffer configured to receive first data and provide first input data;
a second input buffer configured to receive second data and provide second input data; and
an input multiplexer configured to multiplex the first input data and the second input data to provide integrated data in response to the enable signal, the input multiplexer being further configured to select one channel from a number of channels, the number of channels corresponding to a respective one of the plurality of groups of circuits, the input multiplexer to couple the selected one channel to the controller at a time.