Method for packaging circuits
A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
1. A method, comprising:
providing a plurality of integrated circuit dice;
providing a substrate having electrical signal terminals thereon with at least two of the electrical signal terminals being interconnected;
fixing a first die on the substrate over a first group of the electrical signal terminals;
fixing a second die on the substrate over a second group of the electrical signal terminals;
forming electrical connections from first die to first group of electrical signal terminals;
forming electrical connections from second die to second group of electrical signal terminals;
removing a backside of the substrate to expose the terminals; and
separating the first and second dice from a remainder of the substrate with the first and second dice being adapted to electrically communicate through at least the interconnected electric signal terminals.
2. The method of claim 1 , wherein separating the first and second dice includes filling the gap between the first die and the second die with an insulative material.
3. The method of claim 2 , wherein filling the gap includes filling the gap with an encapsulant.
4. The method of claim 2 , wherein filling the gap includes filling the gap with a benzocyclobutene material.
5. The method of claim 2 , wherein separating the first and second die includes forming a memory module.
6. The method of claim 1 , wherein the electrical connections from the first die includes forming metal traces from the first die.
7. The method of claim 1 , wherein forming the electrical connections from the second die includes forming metal traces from the second die.
8. The method of claim 1 , wherein providing the substrate includes providing a substrate having an integrated circuit memory device.
9. The method of claim 1 , wherein providing the substrate includes providing a substrate having I/O pads on a top surface of the substrate.
10. The method of claim 1 , wherein removing the backside of the substrate to expose the terminals includes backgrinding the backside of the substrate.
11. The method of claim 1 , wherein removing the backside of the substrate to expose the terminals includes etching the backside of the substrate.
12. The method of claim 1 , wherein removing the backside of the substrate to expose the terminals includes singulating the first and second die from a remainder of the substrate.
13. The method of claim 1 , wherein forming the electrical connections from the first die to the first group of electrical signal terminals includes forming a metal trace from I/O pads on a top surface of the first die down the side of the first die to the first group of electrical signal terminals.
14. The method of claim 1 , wherein forming the electrical connections from second die to the second group of electrical signal terminals includes forming a metal trace from I/O pads on a top surface of the second die down the side of the second die to the second group of electrical signal terminals.