High yield substrate assembly
High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.
1. An article of manufacture comprising:
a reusable substrate assembly configured for formation of integrated circuit device structures thereon, said reusable substrate assembly comprising:
a plurality of substrates bonded indirectly to one another only on edges of the plurality of substrates,
crystalline layers formed on the plurality of substrates; and
trenches formed in the plurality of substrates defining bordered regions of the crystalline layers that are formed on the plurality of substrates;
wherein said reusable substrate assembly is configured for use with integrated circuit manufacturing equipment designed to process wafers larger than individual instances of the plurality of substrates, wherein bonds between the plurality of substrates are operable to relieve thermal stress across the reusable substrate assembly during integrated circuit processing manufacturing, and wherein said reusable substrate assembly is in contact with bottoms of the plurality of substrates and is configured to be removed from said plurality of substrates.
2. The article of manufacture of claim 1 wherein said reusable substrate assembly has a width or diameter of 200 mm to 300 mm.
3. The article of manufacture of claim 1 wherein said reusable substrate assembly is rectangular.
4. The article of manufacture of claim 1 wherein instances of said plurality of substrates have a generally rectangular shape.
5. The article of manufacture of claim 1 wherein instances of said plurality of substrates have a generally non-rectangular shape.
6. The article of manufacture of claim 1 wherein the plurality of substrates are bonded with nanoparticles between the plurality of substrates.
7. The article of manufacture of claim 1 wherein the plurality of substrates are bonded with alumina between the plurality of substrates.
8. The article of manufacture of claim 1 wherein at least one edge of one substrate of said plurality of substrates is not perpendicular to a face of said one substrate.
9. The article of manufacture of claim 8 wherein said at least one edge enhances bonding of said one substrate in comparison to an edge that is perpendicular to a said face of said one substrate.
10. The article of manufacture of claim 1 wherein said plurality of substrates are from the set of substrates comprising sapphire, Gallium Nitride (GaN), Gallium Arsenide (GaAs), Gallium Phosphide (GaP), Lithium Tantalate (LiTaO 3 ), Lithium Niobate (LiNbO 3 ), Indium Arsenide (InAs), Indium Phosphide (InP), Silicon Carbide (SiC), and Germanium (Ge).