Memory cell with independently-sized elements
Memory cell architectures and methods of forming the same are provided. An example memory cell can include a switch element and a memory element formed in series with the switch element. A smallest lateral dimension of the switch element is different than a smallest lateral dimension of the memory element.
1. A memory cell comprising:
a chalcogenide switch element;
a memory element formed in series with the chalcogenide switch element; and
a first electrode between and in physical contact with the chalcogenide switch element and the memory element, wherein the first electrode comprises a single material;
wherein the chalcogenide switch element comprises inwardly etched sidewalls relative to etched sidewalls of the first electrode;
wherein the memory element comprises inwardly etched sidewalls relative to the etched sidewalls of the first electrode;
wherein a lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element and a lateral dimension between the inwardly etched sidewalls of the memory element are such that a smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element is different than a smallest lateral dimension between the inwardly etched sidewalls of the memory element, and
wherein the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element and the smallest lateral dimension between the inwardly etched sidewalls of the memory element are less than a smallest lateral dimension between the etched sidewalls of the first electrode.
2. The memory cell of claim 1 , wherein the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element is greater than the smallest lateral dimension between the inwardly etched sidewalls of the memory element.
3. The memory cell of claim 1 , wherein the chalcogenide switch element, the memory element, and the first electrode are arranged in a stack.
4. The memory cell of claim 1 , further comprising a second electrode formed between and in contact with a word line and the chalcogenide switch element and a third electrode formed in contact with the memory element.
5. A memory cell comprising:
a chalcogenide switch element;
a memory element formed in series with the chalcogenide switch element; and
a first electrode between the chalcogenide switch element and the memory element,
wherein the chalcogenide switch element comprises inwardly etched sidewalls relative to etched sidewalls of the first electrode; and
wherein the memory element comprises inwardly etched sidewalls relative to the etched sidewalls of the first electrode;
wherein a smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element and a smallest lateral dimension between the inwardly etched sidewalls of the memory element are less than a smallest lateral dimension between the etched sidewalls of the first electrode, and
wherein the chalcogenide switch element and the memory element are in a same memory cell.
6. The memory cell of claim 5 , wherein the chalcogenide switch element, the memory element, and the first electrode are arranged in a stack.
7. The memory cell of claim 5 , wherein the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element is different than the smallest lateral dimension between the inwardly etched sidewalls of the the memory element.
8. The memory cell of claim 5 , wherein the chalcogenide switch element and the memory element are arranged in a stack, and wherein a cross-sectional area of the chalcogenide switch element in a plane perpendicular to a stack length is greater than a cross-sectional area of the memory element in the plane perpendicular to the stack length.
9. A memory cell comprising:
a chalcogenide switch element arranged in a stack;
a chalcogenide memory element formed in series with the chalcogenide switch element; and
a first electrode between and in contact with the chalcogenide switch element and the chalcogenide memory element, wherein the first electrode comprises a single material;
wherein the chalcogenide switch element comprises inwardly etched sidewalls relative to etched sidewalls of the first electrode;
wherein the chalcogenide switch element comprises a single material;
wherein the chalcogenide memory element comprises inwardly etched sidewalls relative to the etched sidewalls of the first electrode;
wherein a lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element and a lateral dimension between the inwardly etched sidewalls of the chalcogenide memory element are such that a smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element is different than a smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide memory element, and
wherein the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element and the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide memory element are less than a smallest lateral dimension between the etched sidewalls of the first electrode, and
wherein the chalcogenide switch element and the chalcogenide memory element are in a same memory cell.
10. The memory cell of claim 9 , wherein the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide switch element is greater than the smallest lateral dimension between the inwardly etched sidewalls of the chalcogenide memory element.
11. The memory cell of claim 9 , wherein a cross-sectional area of the chalcogenide switch element in a plane perpendicular to a stack length is less than a cross-sectional area of the first electrode in the plane perpendicular to the stack length.