Method of making split gate non-volatile flash memory cell
A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.
1. A method of forming a non-volatile memory cell comprising:
providing a semiconductor substrate having a memory cell region and a logic circuit region;
forming a pair of conductive floating gates disposed over and insulated from the memory cell region of the substrate;
forming a pair of conductive control gates each disposed over and insulated from one of the floating gates;
forming a pair of insulation blocks each disposed over one of the control gates;
forming a first source region in the substrate between the pair of floating gates;
forming a single conformal polysilicon layer over and insulated from the substrate in the memory cell region and the logic circuit region by performing a single polysilicon deposition process, wherein the single conformal polysilicon layer extends up and over the pair of insulation blocks;
forming an oxide layer over the single conformal polysilicon layer in the memory cell and logic circuit regions;
removing the oxide layer from the memory cell region to expose the single conformal polysilicon layer;
performing a chemical-mechanical polish of the single conformal polysilicon layer in the memory cell area such that a first block of the single conformal polysilicon layer between the floating gates and over the first source region is separated from remaining portions of the single conformal polysilicon layer and has an upper surface even with upper surfaces of the pair of insulation blocks, wherein the chemical-mechanical polish leaves exposed the oxide layer in the logic circuit region;
removing the oxide layer from the logic circuit region;
selectively etching portions of the single conformal polysilicon layer to result in:
a second block of the single conformal polysilicon layer disposed over the substrate with one of the pair of floating gates disposed between the first and second blocks of the single conformal polysilicon layer,
a third block of the single conformal polysilicon layer disposed over the substrate with the other of the pair of floating gates disposed between the first and third blocks of the single conformal polysilicon layer, and
a fourth block of the single conformal polysilicon layer disposed over and insulated from the logic circuit region of the substrate;
forming a first drain region in the substrate adjacent a side of the second block of the single conformal polysilicon layer;
forming a second drain region in the substrate adjacent a side of the third block of the single conformal polysilicon layer;
forming a third drain region in the substrate adjacent a first side of the fourth block of the single conformal polysilicon layer; and
forming a second source region in the substrate adjacent a second side of the fourth block of the single conformal polysilicon layer opposite the first side of the fourth block.