Filter devices having reduced spurious emissions from lamb waves
View Patent ↗A filter device that reduces spurious emissions generated in a frequency band 1.2 to 1.4 times greater than a center frequency of a passband of a filter. In one example the filter device includes a first filter connected between a common contact and a first signal contact and having a first passband, and a second filter connected between the common contact and a second signal contact and having a second passband with a center frequency in a range of 1.2 to 1.4 times greater than a center frequency of the first passband. The first filter includes a SAW filter formed on a piezoelectric substrate, a SAW resonator formed on the piezoelectric substrate and connected in series between the common contact and the SAW filter, and a dielectric film covering the SAW filter and SAW resonator, the dielectric film having a reduced thickness in a region corresponding to the SAW resonator.
1. A filter device comprising:
a common contact, a first signal contact, and a second signal contact;
a first filter connected between the common contact and the first signal contact and having a first passband, the first filter including a first piezoelectric substrate, a surface acoustic wave (SAW) filter formed on a surface of the first piezoelectric substrate, a SAW resonator formed on the surface of the first piezoelectric substrate and connected in series between the common contact and the SAW filter, and a dielectric film formed over the surface of the piezoelectric substrate and covering the SAW filter and SAW resonator, the dielectric film having a first thickness in a first region corresponding to the SAW filter and a second thickness in a second region corresponding to the SAW resonator, the first thickness being greater than the second thickness; and
a second filter connected between the common contact and the second signal contact and having a second passband different from the first passband, a center frequency of the second passband being in a range of 1.2 to 1.4 times greater than a center frequency of the first passband.
2. The filter device of claim 1 wherein the SAW resonator and the SAW filter together form a first ladder-type filter, the SAW filter including at least one parallel resonator connected to a ground contact.
3. The filter device of claim 1 wherein the SAW filter is a double mode SAW filter.
4. The filter device of claim 1 wherein the center frequency of the second passband is in a range of 1.25 to 1.3 times greater than the center frequency of the first passband.
5. The filter device of claim 1 wherein the dielectric film is made of silicon dioxide.
6. The filter device of claim 1 wherein the second thickness of the dielectric film in the second region corresponding to the SAW resonator is configured to be less than 26% when normalized with a wavelength of an excited surface acoustic wave in the first filter.
7. The filter device of claim 6 wherein the first thickness of the dielectric film in the first region corresponding to the SAW filter is configured to be greater than 29% when normalized with the wavelength of the excited surface acoustic wave in the first filter.
8. The filter device of claim 6 wherein a difference between the first thickness and the second thickness of the dielectric film is configured to be greater than 3% when normalized with the wavelength of the excited surface acoustic wave in the first filter.
9. The filter device of claim 1 wherein the first thickness of the dielectric film in the first region corresponding to the SAW filter is configured to be greater than 29% when normalized with a wavelength of an excited surface acoustic wave in the first filter.
10. The filter device of claim 1 wherein a difference between the first thickness and the second thickness of the dielectric film is configured to be greater than 3% when normalized with a wavelength of an excited surface acoustic wave in the first filter.
11. The filter device of claim 1 wherein the second filter includes a plurality of acoustic wave elements disposed on the first piezoelectric substrate.
12. The filter device of claim 1 wherein the second filter includes a second piezoelectric substrate.
13. The filter device of claim 12 wherein the second filter includes a plurality of acoustic wave elements disposed on the second piezoelectric substrate.
14. The filter device of claim 12 wherein the first piezoelectric substrate is made of a first material and the second piezoelectric substrate is made of a second material different from the first material.
15. The filter device of claim 1 wherein the first piezoelectric substrate is made of lithium niobate.
16. The filter device of claim 1 wherein the first piezoelectric substrate is made of lithium tantalate.
17. A filtering module comprising:
a packaging substrate;
a filter die disposed on the packaging substrate and having a common contact, a first signal contact, and a second signal contact, the filter die including a first filter connected between the common contact and the first signal contact and having a first passband, the first filter including a piezoelectric substrate, a surface acoustic wave (SAW) filter formed on a surface of the piezoelectric substrate, a SAW resonator formed on the surface of the piezoelectric substrate and connected in series between the common contact and the SAW filter, and a dielectric film formed over the surface of the piezoelectric substrate and covering the SAW filter and SAW resonator, the dielectric film having a first thickness in a first region corresponding to the SAW filter and a second thickness in a second region corresponding to the SAW resonator, the first thickness being greater than the second thickness, the filter die further including a second filter connected between the common contact and the second signal contact and having a second passband different from the first passband, a center frequency of the second passband being in a range of 1.2 to 1.4 times greater than a center frequency of the first passband; and
a plurality of connection pads disposed on the packaging substrate, the common contact, the first signal contact, and the second signal contact of the filter die being connected to corresponding ones of the plurality of connection pads by respective electrical connectors.
18. The filtering module of claim 17 wherein the center frequency of the second passband is in a range of 1.25 to 1.3 times greater than the center frequency of the first passband.
19. The filtering module of claim 17 wherein the dielectric film is made of silicon dioxide.
20. The filtering module of claim 17 wherein the electrical connectors are wirebonds.
21. The filtering module of claim 17 wherein the electrical connectors are solder bumps.