Fabrication of a vertical fin field effect transistor with reduced dimensional variations
A method of forming a fin field effect transistor (finFET) having fin(s) with reduced dimensional variations, including forming a dummy fin trench within a perimeter of a fin pattern region on a substrate, forming a dummy fin fill in the dummy fin trench, forming a plurality of vertical fins within the perimeter of the fin pattern region, including border fins at the perimeter of the fin pattern region and interior fins located within the perimeter and inside the bounds of the border fins, wherein the border fins are formed from the dummy fin fill, and removing the border fins, wherein the border fins are dummy fins and the interior fins are active vertical fins.
1. A method of forming a fin field effect transistor (finFET) having fin(s) with reduced dimensional variations, comprising:
forming at least one dummy fin trench in a substrate;
forming a dummy fin fill in the at least one dummy fin trench;
forming one or more dummy fins from the dummy fin fill and one or more vertical fins from the substrate; and
removing the one or more dummy fins by a selective etch, while leaving the one or more vertical fins on the substrate.
2. The method of claim 1 , further comprising forming a gate structure on each of the one or more vertical fins, wherein the gate structure includes a gate dielectric layer on at least a portion of the one or more vertical fins, a work function layer on at least a portion of the gate dielectric layer, and a gate electrode layer on at least a portion of the work function layer.
3. The method of claim 2 , further comprising removing at least a portion of the gate dielectric layer, work function layer, and gate electrode layer to reduce the height of the gate electrode layer, work function layer, and gate dielectric layer below the top surface of the one or more vertical fins.
4. The method of claim 3 , further comprising forming source/drains at opposite ends of the one or more vertical fin(s).
5. A method of forming a fin field effect transistor (finFET) having fin(s) with reduced dimensional variations, comprising:
forming a dummy fin trench within a perimeter of a fin pattern region on a substrate;
forming a dummy fin fill in the dummy fin trench;
forming a plurality of vertical fins within the perimeter of the dummy fin trench and a plurality of dummy fins from the dummy fin fill, wherein the dummy fin trench forms a step in the substrate around the plurality of vertical fins; and
removing the plurality of dummy fins.
6. The method of claim 5 , wherein the step has a height in the range of about 5 nm to about 50 nm.
7. The method of claim 5 , wherein the dummy fin fill and the dummy fins are made of amorphous silicon (a-Si), poly-crystalline silicon (p-Si), amorphous silicon-germanium (a-SiGe), or poly-crystalline silicon-germanium (p-SiGe).
8. The method of claim 5 , further comprising forming a gate structure on each of the plurality of vertical fins, wherein the gated length of each gate structure is in the range of about 10 nm to about 50 nm.
9. The method of claim 5 , wherein the plurality of vertical fins form an M×N array within the perimeter of the fin pattern region.
10. The method of claim 9 , wherein the M×N array is adjacent to a second fin pattern region having a different array of vertical fins.