Lid cover spring design
A module package can include a substrate; at least one device component configured to be positioned on the substrate; a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component. Each mounting spring can include a middle portion; an end portion having a mounting hole; and a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion are secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid.
1. A module package, comprising: a substrate;
at least one device component configured to be positioned on the substrate;
a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and
at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component, each mounting spring having:
a middle portion;
an end portion having a mounting hole; and
a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion is secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid,
the first corner portion of the module package lid being curved to prevent engagement with the at least one mounting spring.
2. The module package of claim 1 , further comprising a cover configured to be positioned over the package lid and the at least one mounting spring.
3. The module package of claim 1 , wherein the at least one mounting spring is made of stainless steel, titanium, or a non-metallic material.
4. The module package of claim 1 , further comprising a mounting screw configured to secure the at least one mounting spring to the mounting surface via the mounting hole.
5. The module package of claim 1 , wherein the mounting surface is a heat sink.
6. The module package of claim 1 , wherein the package lid plateau includes at least one positioning lid configured to engage with a corresponding positioning hole on each mounting spring.
7. The module package of claim 1 , wherein the module package is a radio frequency (RF) power module package.