Fabrication of a vertical fin field effect transistor with reduced dimensional variations
A method of forming a fin field effect transistor (finFET) having fin(s) with reduced dimensional variations, including forming a dummy fin trench within a perimeter of a fin pattern region on a substrate, forming a dummy fin fill in the dummy fin trench, forming a plurality of vertical fins within the perimeter of the fin pattern region, including border fins at the perimeter of the fin pattern region and interior fins located within the perimeter and inside the bounds of the border fins, wherein the border fins are formed from the dummy fin fill, and removing the border fins, wherein the border fins are dummy fins and the interior fins are active vertical fins.
1. A method of forming arrays of fin field effect transistors (finFETs) having fin(s) with reduced dimensional variations, comprising:
forming a dummy fin trench in a substrate;
forming a dummy fin fill in the dummy fin trench;
forming a first array of vertical fins on a first side of the dummy fin fill, a second array of vertical fins on a second side of the dummy fin fill, and one or more dummy fins from the dummy fin fill between the first array of vertical fins and second array of vertical fins; and
removing the one or more dummy fins to form a gap between the neighboring arrays of vertical fins.
2. The method of claim 1 , wherein a depth of the dummy fin trench is greater than the height of the vertical fins in the first array and the second array.
3. The method of claim 1 , wherein the width of the dummy fin trench is sufficient to form two columns of dummy fins.
4. The method of claim 1 , wherein the dummy fin fill and the one or more dummy fins are made of amorphous silicon (a-Si), poly-crystalline silicon (p-Si), amorphous silicon-germanium (a-SiGe), or poly-crystalline silicon-germanium (p-SiGe).
5. The method of claim 4 , wherein the vertical fins are single crystal silicon, and the one or more dummy fins are removed by a selective HCl etch.
6. The method of claim 1 , wherein the first array of vertical fins is an N column by M row arrangement of vertical fins, and the second array of vertical fins is an X column by Y row arrangement of vertical fins, where X is different than N and Y is different from M.
7. The method of claim 6 , wherein the one or more dummy fins are located the same pitch distance from an adjacent vertical fin, as the pitch between adjacent vertical fins in the first array.
8. The method of claim 7 , further comprising forming a first doped region in the substrate below the first array of vertical fins, and a second doped region in the substrate below the second array of vertical fins.
9. The method of claim 8 , further comprising forming a punch-through stop in a lower portion of the vertical fins in the first array.
10. The method of claim 9 , further comprising forming a top source/drain on the vertical fins in the first array.
11. A method of forming arrays of fin field effect transistors (finFETs) having fin(s) with reduced dimensional variations, comprising:
forming a dummy fin trench in a substrate;
forming a dummy fin fill in the dummy fin trench;
forming a first array of vertical fins on a first side of the dummy fin fill, wherein the first array of vertical fins is an N column by M row pattern;
forming a second array of vertical fins on a second side of the dummy fin fill, wherein the second array of vertical fins is an X column by Y row pattern;
forming M dummy fins from the dummy fin fill between the first array of vertical fins and second array of vertical fins; and
removing the M dummy fins to form a gap between the neighboring arrays of vertical fins.
12. The method of claim 11 , wherein the depth of the dummy fin trench is in a range of about 20 nm to about 200 nm.
13. The method of claim 12 , wherein the width of the dummy fin trench is in a range of about 30 nm to about 300 nm.
14. The method of claim 13 , wherein the dummy fin trench forms a form step with a ledge adjacent to the M vertical fins adjacent to the M dummy fins.
15. The method of claim 14 , wherein the step has a height in the range of about 5 nm to about 50 nm.
16. The method of claim 15 , wherein the dummy fin fill and the dummy fins are made of amorphous silicon (a-Si), poly-crystalline silicon (p-Si), amorphous silicon-germanium (a-SiGe), or poly-crystalline silicon-germanium (p-SiGe).
17. A method of forming arrays of fin field effect transistors (finFETs) having fin(s) with reduced dimensional variations, comprising:
forming a dummy fin trench in a substrate;
forming a dummy fin fill in the dummy fin trench;
forming a first array of vertical fins on a first side of the dummy fin fill, wherein the first array of vertical fins is an N column by M row pattern;
forming a second array of vertical fins on a second side of the dummy fin fill, wherein the second array of vertical fins is an X column by Y row pattern;
forming M dummy fins from the dummy fin fill between the first array of vertical fins and second array of vertical fins;
forming a first doped region in the substrate below the first array of vertical fins;
forming a second doped region in the substrate below the second array of vertical fins; and
removing the M dummy fins to form a gap between the neighboring arrays of vertical fins.
18. The method of claim 17 , wherein the vertical fins of the first array are electrically coupled to the first doped region.
19. The method of claim 18 , further comprising forming a top source/drain on each of the vertical fins in the first array.
20. The method of claim 19 , further comprising forming a gate structure on the vertical fins in the first array to form a multi-fin vertical field effect transistor.