IP Library Granted Patent US 10,825,528
Granted Patent B2
US 10,825,528 · App. 15/985,973 · Granted Nov 3, 2020

Memory devices having source lines directly coupled to body regions and methods

Inventor: Akira Goda (Boise, ID)
Assignee: Micron Technology, Inc.
G11C16/14G11C16/0483G11C16/10H01L27/11524H01L27/11556
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Quick Facts
Patent No.
US 10,825,528
App. No.
15/985,973
Granted
Nov 3, 2020
Kind
B2
Abstract

Memory devices, memory cell strings and methods of operating memory devices are shown. Configurations described include directly coupling an elongated body region to a source line. Configurations and methods shown should provide a reliable bias to a body region for memory operations such as erasing.

Claims (30)

1. A memory device, comprising:

a continuous elongated body region of the same conductivity type, having a source region coupled to a first end, and a drain region coupled to a second end;

a plurality of gates along a length of the elongated body region, each of the plurality of gates being separated from the elongated body region by at least a charge storage structure; and

a source line coupled to the body region by a via passing though the source region.

2. The memory device of claim 1 , wherein the elongated body region is oriented vertically.

3. The memory device of claim 1 , wherein the elongated body region is oriented horizontally.

4. The memory device of claim 1 , wherein the elongated body region forms a “U” shape.

5. The memory device of claim 1 , further including a first select gate adjacent to a first end of the elongated body region and a second select gate adjacent to a second end of the elongated body region.

6. A memory device, comprising:

a continuous p type elongated body region, having an n type source region coupled to a first end, and an n type drain region coupled to a second end;

a plurality of gates along a length of the p type elongated body region, each of the plurality of gates being separated from the continuous p type body region by at least a respective charge storage structure;

a source line directly coupled to the continuous p type elongated body region at an end of the body region;

wherein the n type source region substantially surrounds a cross section of an end of the continuous p type elongated body region and is also coupled to the source line.

7. The memory device of claim 6 , wherein at least the end of the p type elongated body region is formed from p+ doped polysilicon.

8. The memory device of claim 6 , wherein the n type source region is formed from n+ polysilicon.

9. The memory device of claim 6 , wherein the n type drain region is formed from n+ polysilicon.

10. The memory device of claim 6 , wherein the continuous p type elongated body region forms a “U” shape.

11. The memory device of claim 10 , wherein the source line is stacked on op of the n type source region.

12. A memory device, comprising:

a U shaped memory cell string, including:

an elongated body region, having a first and second upward facing end;

a drain region coupled to the first upward facing end;

a source region coupled to the second upward facing end;

a plurality of gates along a length of the elongated body region;

a data line coupled to the drain region; and

a source line coupled to the second upward facing end of the elongated body region by a via passing though the source region.

13. The memory device of claim 12 , wherein the source line and the source region are shared with an adjacent memory cell string.

14. The memory device of claim 12 , wherein the source region substantially surrounds a cross section of the second upward facing end of the elongated body region.

15. The memory device of claim 2 , wherein the gates are shared with an adjacent memory cell string.

16. The memory device of claim 14 , wherein a first portion of the gates are shared with a first adjacent memory cell string and wherein a second portion of the gates are shared with a second adjacent memory cell string.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2023
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP, LLC
Reel/Frame 064986/0353 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Continuity (4)
Continuation 15339374 · Oct 31, 2016
Division 14299813 · Jun 9, 2014
Division 13011223 · Jan 21, 2011
Related Publication 20180268909A1 · Sep 20, 2018