Logic circuit and semiconductor device
To reduce a leakage current of a transistor so that malfunction of a logic circuit can be suppressed. The logic circuit includes a transistor which includes an oxide semiconductor layer having a function of a channel formation layer and in which an off current is 1×10 −13 A or less per micrometer in channel width. A first signal, a second signal, and a third signal that is a clock signal are input as input signals. A fourth signal and a fifth signal whose voltage states are set in accordance with the first to third signals which have been input are output as output signals.
1. A method for manufacturing a semiconductor device comprising:
the semiconductor device comprising:
a scan line driver circuit comprising a transistor; and
a pixel portion electrically connected to the scan line driver circuit,
the transistor comprising:
a gate electrode layer;
a gate insulating layer over the gate electrode layer;
an oxide semiconductor layer over the gate insulating layer;
a source electrode layer and a drain electrode layer over the oxide semiconductor layer; and
an oxide insulating layer over the oxide semiconductor layer, the source electrode layer, and the drain electrode layer,
wherein the oxide insulating layer is in contact with the oxide semiconductor layer between the source electrode layer and the drain electrode layer,
wherein the oxide semiconductor layer comprises a crystal, and
wherein the oxide semiconductor layer comprises In, Ga, and Zn,
the method comprising:
performing a first heat treatment on the oxide semiconductor layer to reduce a hydrogen concentration of the oxide semiconductor layer;
forming the source electrode layer and the drain electrode layer after performing the first heat treatment;
forming the oxide insulating layer after forming the source electrode layer and the drain electrode layer; and
performing a second heat treatment to supply oxygen to the oxide semiconductor layer after forming the oxide insulating layer.
2. The method for manufacturing a semiconductor device according to claim 1 ,
wherein an off current per micrometer in a channel width of the transistor is less than or equal to 1×10 −13 A when a source-drain voltage Vd is 10 V and a source-gate voltage Vg is −5 V.
3. The method for manufacturing a semiconductor device according to claim 1 ,
wherein an off current per micrometer in a channel width of the transistor is less than or equal to 1×10 −17 A when a source-drain voltage Vd is 10 V and a source-gate voltage Vg is −5 V.
4. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the oxide insulating layer is a silicon oxide layer.