Microstructure enhanced absorption photosensitive devices
Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.
1. A lateral microstructure-enhanced photodetector comprising:
one or more laterally extending, non-doped or low-doped I-layers of silicon and/or germanium;
interdigitated electrodes that are laterally spaced from each other and are electrically coupled with said one or more I-layers and configured to produce a laterally extending electrical field therein;
a microstructure comprising a laterally extending multiplicity of deliberately formed holes in said photodetector;
wherein:
said one or more I-layers are continuous and planar except for any penetration thereof by said holes;
said holes have heights in a direction transverse to said I-layers;
said photodetector is configured to respond to illumination with spatially continuous light at each of one or more regions each encompassing a multiplicity of said holes, in a direction transverse to said one or more I-layers, by producing an electrical output that depends on said illumination; and
said holes enhance a desirable electrical response of said photodetector to said light in one or more selected wavelength ranges compared to an electrical response of an otherwise same photodetector without said holes said photodetector being configured to operate in the frequency of 1-100 Giga bits per second range.
2. The lateral microstructure-enhanced photodetector of claim 1 , further including a monolithic chip and one or more active electronic circuits monolithically integrated with said photodetector on or in said chip and electrically coupled with said electrodes to receive and process said electrical output.
3. The lateral microstructure-enhanced photodetector of claim 1 , further including a monolithic chip and plural active electronic circuits monolithically integrated with said photodetector on or in said cup and electrically coupled with said electrodes to receive and process said electrical output.
4. The lateral microstructure-enhanced photodetector of claim 1 , further including a monolithic chip and plural electronic circuits monolithically integrated with said photodetector on or in a said chip and electrically coupled with said electrodes to receive and process said electrical output, and one or more light emitting devices mounted to said chip and coupled to one or more active electronic circuits to be driven thereby.
5. The lateral microstructure-enhanced photodetector of claim 1 , in which at least some of said holes are laterally between said electrodes.
6. The lateral microstructure-enhanced photodetector of claim 1 , in which said electrodes overlie at least some of said holes.
7. The lateral microstructure-enhanced photodetector of claim 1 , further including a cover layer over said one of more I-layers, and wherein said holes are only in said cover layer.
8. The lateral microstructure-enhanced photodetector of claim 1 , in which said holes extend only partway down from a top surface of said one of more I-layers.
9. The lateral microstructure-enhanced photodetector of claim 1 , in which said one or more I-layers have a top surface and a bottom surface and said holes extend down from said top to said bottom surface.
10. The lateral microstructure-enhanced photodetector of claim 1 , in which said holes comprise islands of dielectric material laterally spaced from each other by said semiconductor material of said I-layers, formed by selective area growth.
11. The lateral microstructure-enhanced photodetector of claim 1 , in which said one or more I-layers have a bottom surface and at least some of said holes extend from said bottom surface up into said one or more I-layers and comprise material with electrical and/or optical properties different from those of said one or more I-layers.
12. The lateral microstructure-enhanced photodetector of claim 1 , in which said one or more I-layers have a top surface and a bottom surface and some of said holes extend into said one or more I-layers down from said top surface and some of said holes extend into said one or more I-layers up from said bottom surface.
13. The lateral microstructure-enhanced photodetector of claim 1 , in which said holes comprise a solid dielectric material.
14. The lateral microstructure-enhanced photodetector of claim 1 , in which said holes comprise a semiconductor material that is different from the semiconductor material of said one or more I-layers.
15. The lateral microstructure-enhanced photodetector of claim 1 , in which said electrodes comprise laterally extending conductors and doped semiconductor material regions thereunder, laterally spaced by said one or more I-layers and forming one or more PN junctions in said photoconductor, where the materials forming each of the one or more PN junctions are touching.
16. The lateral microstructure-enhanced photodetector of claim 1 , further comprising at least one doped semiconductor region and in which said electrodes comprise laterally extending conductors and additional doped semiconductor material regions under one or more of said conductors and in ohmic contact therewith, said doped regions being laterally spaced by said one or more I-layers and forming one or more PN junctions in said photoconductor, where the materials forming each of the one or more PN junctions are touching.
17. The lateral microstructure-enhanced photodetector of claim 1 , in which said electrodes comprise laterally extending conductors forming Schottky junctions in said photodetector.
18. The lateral microstructure-enhanced photodetector of claim 1 , in which at least two of said electrodes differ from each other in vertical position relative to a top surface of said one or more I-layers.
19. The lateral microstructure-enhanced photodetector of claim 1 , in which at least one of said electrodes has a bottom surface that is below a top surface of said one or more I-layers.
20. The lateral microstructure-enhanced photodetector of claim 1 , in which said electrodes and said one or more I-layers have at least one of (i) top surfaces that are substantially at the same level and (ii) bottom surfaces that substantially at the same level.
21. The lateral microstructure-enhanced photodetector of claim 1 , further including a layer of a light-absorbing material over at least portions of said electrodes.
22. The lateral microstructure-enhanced photodetector of claim 1 , further including a light-absorbing layer that is over at least portions of said electrodes and has a nano-structured top surface.
23. The lateral microstructure-enhanced photodetector of claim 1 , further including a light-absorbing layer that is over at least portions of said electrodes and said one or more I-layers and has a nano-structured top surface.
24. The lateral microstructure-enhanced photodetector of claim 1 , further including a layer of doped semiconductor over at least a portion of said one or more I-layers, forming one or more PN junctions in said photodetector, where the material forming each of the one or more PN junctions are touching.
25. A method of manufacturing a lateral microstructure-enhanced photodetector comprising:
providing one or more laterally extending, non-doped or low-doped 1-layers of silicon and/or germanium, plural electrodes electrically coupled with said one or more 1-layers and configured to produce an electrical field therein, and interdigitated electrodes that are laterally spaced from each other and are electrically coupled with said one or more i-layers and configured to produce a laterally extending electrical field therein;
a microstructure comprising a laterally extending multiplicity of deliberately formed holes in said photodetector; said providing step further comprising:
forming said one or more I-layers as continuous and planar except for any penetration thereof by said holes;
configuring said photodetector to respond to illumination with spatially continuous light at each of one or more regions each encompassing a multiplicity of said holes, in a direction transverse to said one or more 1-layers, by producing an electrical output that depends on said illumination;
configuring said holes to enhance a desirable electrical response of said photodetector to said light in one or more selected wavelength ranges compared to an electrical response of an otherwise same photodetector without said holes; and
monolithically integrating said photoconductor on or in a single chip with one or more active electronic circuits and electrically connecting said photodetector and said active electronic circuits for transfer of said electrical output to said circuits for processing thereby;
said photodetector being configured to operate in the frequency of 1-100 Giga bits per second range.
26. The method of claim 25 , further including providing one or more additional photodetectors each comprising a laterally extending multiplicity of holes that enhance desirable electrical responses of said one or more additional photodetectors to light having selected wavelengths compared to otherwise same photodetectors without said holes and assembling said photodetectors on or in said chip and electrically connecting them with said one or more active electronic circuits.
27. The method of claim 25 , further including providing plural additional photodetectors each comprising a laterally extending multiplicity of holes that enhance desirable electrical responses of said one or more additional photodetectors to light having selected wavelengths compared to otherwise same photodetectors without said holes and fluidically assembling said photodetectors on or in said chip and electrically connecting them with said active electronic circuits.
28. The method of claim 25 , further including providing one or more additional photodetectors each comprising a laterally extending multiplicity of holes that enhance desirable electrical responses of said one or more additional photodetectors to light having selected wavelengths compared to otherwise same photodetectors without said holes and one or more light emitting devices and assembling said photodetectors and said light emitting devices on or in said chip, and electrically connecting said photodetectors and light emitting devices with said active electronic circuits.
29. The method of claim 25 , comprising forming at least some of said holes as island of a solid material that differs in electrical and/or optical properties from said one or more I-layers and forming at least some of said holes involves etching or deposition and forming at least some of the material of said one or more I-layers employs epitaxial layer growth over said islands.