3D semiconductor memory device and structure
A 3D memory device, the device including: a first horizontal bit-line; a second horizontal bit-line disposed above the first horizontal bit-line, where the first horizontal bit-line and the second horizontal bit-line function as a source or a drain for a plurality of parallel vertically-oriented memory transistors, where the first horizontal bit-line and the second horizontal bit-line are self-aligned being formed following the same lithography step; and conductive memory control lines, where a first portion of the conductive memory control lines are disposed at least partially directly underneath the plurality of parallel vertically-oriented memory transistors, and where a second portion of the conductive memory control lines are disposed at least partially directly above the plurality of parallel vertically-oriented memory transistors.
1. A 3D memory device, the device comprising:
a first horizontal bit-line;
a second horizontal bit-line disposed above said first horizontal bit-line,
wherein said first horizontal bit-line and said second horizontal bit-line function as a source or a drain for a plurality of parallel vertically-oriented memory transistors,
wherein said first horizontal bit-line and said second horizontal bit-line are self-aligned being formed following the same lithography step; and
conductive memory control lines,
wherein a first portion of said conductive memory control lines are disposed at least partially directly underneath said plurality of parallel vertically-oriented memory transistors, and
wherein a second portion of said conductive memory control lines are disposed at least partially directly above said plurality of parallel vertically-oriented memory transistors.
2. The 3D memory device according to claim 1 ,
wherein said plurality of parallel vertically-oriented memory transistors each comprise a tunneling oxide region and a charge trap region, and
wherein said tunneling oxide region is thinner than 1 nm or does not exist.
3. The 3D memory device according to claim 1 , further comprising:
a third horizontal bit-line disposed above said second horizontal bit-line,
wherein said third horizontal bit-line and said second horizontal bit-line function as a source or a drain for a second plurality of parallel vertically-oriented memory transistors.
4. The 3D memory device according to claim 1 , further comprising:
memory control circuits,
wherein said memory control circuits are structured to provide a periodic memory refresh operation to said plurality of parallel vertically-oriented memory transistors.
5. The 3D memory device according to claim 1 ,
wherein said first horizontal bit-line comprises metal.
6. The 3D memory device according to claim 1 ,
wherein said plurality of parallel vertically-oriented memory transistors comprise first memory transistors and second memory transistors,
wherein between a pair of said first memory transistors is disposed at least one of said second memory transistors,
wherein said pair of said first memory transistors are controlled by a first gate-line and said second memory transistors are controlled by second gate-lines,
wherein said first gate-line is isolated from said second gate-lines by isolation structures, and
wherein said isolation structures each comprise two oxide layers and a nitride layer, said nitride layer is disposed between said two oxide layers.
7. The 3D memory device according to claim 1 ,
wherein each of said plurality of parallel vertically-oriented memory transistors comprises a unique channel region, and
wherein said channel regions are isolated from each other.
8. A 3D memory device, the device comprising:
a first horizontal bit-line; and
a second horizontal bit-line disposed above said first horizontal bit-line,
wherein said first horizontal bit-line and said second horizontal bit-line function as a source or a drain for a plurality of parallel vertically-oriented memory transistors,
wherein said first horizontal bit-line and said second horizontal bit-line are self-aligned being formed following the same lithography step; and
conductive memory control lines,
wherein a first portion of said conductive memory control lines are disposed at least partially directly underneath said plurality of parallel vertically-oriented memory transistors,
wherein a second portion of said conductive memory control lines are disposed at least partially directly above said plurality of parallel vertically-oriented memory transistors,
wherein said plurality of parallel vertically-oriented memory transistors each comprise a tunneling oxide region and a charge trap region, and
wherein said tunneling oxide region is thinner than 1 nm or does not exist.
9. The 3D memory device according to claim 8 , further comprising:
a third horizontal bit-line disposed above said second horizontal bit-line,
wherein said third horizontal bit-line and said second horizontal bit-line function as a source or a drain for a second plurality of parallel vertically-oriented memory transistors.
10. The 3D memory device according to claim 8 , further comprising:
memory control circuits,
wherein said memory control circuits are structured to provide a periodic memory refresh operation to said plurality of parallel vertically-oriented memory transistors.
11. The 3D memory device according to claim 8 ,
wherein said first horizontal bit-line comprises metal.
12. The 3D memory device according to claim 8 ,
wherein said plurality of parallel vertically-oriented memory transistors comprise first memory transistors and second memory transistors,
wherein between a pair of said first memory transistors is disposed at least one of said second memory transistors,
wherein said pair of said first memory transistors are controlled by a first gate-line and said second memory transistors are controlled by second gate-lines,
wherein said first gate-line is isolated from said second gate-lines by isolation structures, and
wherein said isolation structures each comprise two oxide layers and a nitride layer, said nitride layer is disposed between said two oxide layers.
13. The 3D memory device according to claim 8 ,
wherein each of said plurality of parallel vertically-oriented memory transistors comprises a unique channel region, and
wherein said channel regions are isolated from each other.
14. The 3D memory device according to claim 8 ,
wherein said plurality of parallel vertically-oriented memory transistors each comprise a tunneling oxide region and a charge trap region, and
wherein said tunneling oxide region is thinner than 1 nm or does not exist.
15. A 3D memory device, the device comprising:
a first horizontal bit-line;
a second horizontal bit-line disposed above said first horizontal bit-line,
wherein said first horizontal bit-line and said second horizontal bit-line function as a source or a drain for a plurality of parallel vertically-oriented memory transistors,
wherein said first horizontal bit-line and said second horizontal bit-line are self-aligned being formed following the same lithography step; and
conductive memory control lines,
wherein a first portion of said conductive memory control lines are disposed at least partially directly underneath said plurality of parallel vertically-oriented memory transistors,
wherein a second portion of said conductive memory control lines are disposed at least partially directly above said plurality of parallel vertically-oriented memory transistors,
wherein said plurality of parallel vertically-oriented memory transistors comprise first memory transistors and second memory transistors,
wherein between a pair of said first memory transistors is disposed at least one of said second memory transistors,
wherein said pair of said first memory transistors are controlled by a first gate-line and said second memory transistors are controlled by second gate-lines,
wherein said first gate-line is isolated from said second gate-lines by isolation structures, and
wherein said isolation structures each comprise two oxide layers and a nitride layer, said nitride layer is disposed between said two oxide layers.
16. The 3D memory device according to claim 15 , further comprising:
a third horizontal bit-line disposed above said second horizontal bit-line,
wherein said third horizontal bit-line and said second horizontal bit-line function as a source or a drain for a second plurality of parallel vertically-oriented memory transistors.
17. The 3D memory device according to claim 15 , further comprising:
memory control circuits,
wherein said memory control circuits are structured to provide a periodic memory refresh operation to said plurality of parallel vertically-oriented memory transistors.
18. The 3D memory device according to claim 15 ,
wherein said first horizontal bit-line comprises metal.
19. The 3D memory device according to claim 15 ,
wherein each of said plurality of parallel vertically-oriented memory transistors comprises a unique channel region, and
wherein said channel regions are isolated from each other.
20. The 3D memory device according to claim 15 ,
wherein said plurality of parallel vertically-oriented memory transistors each comprise a tunneling oxide region and a charge trap region, and
wherein said tunneling oxide region is thinner than 1 nm or does not exist.