Semiconductor device and method for manufacturing semiconductor device
A semiconductor device with excellent electric characteristics is provided. The semiconductor device includes an oxide in a channel formation region. The semiconductor device includes the oxide over a substrate, a first insulator over the oxide, a second insulator over the first insulator, a third insulator, and a conductor over the third insulator. The oxide and the first insulator are in contact with each other in a region. An opening exposing the oxide is provided in the first insulator and the second insulator. The third insulator is placed to cover an inner wall and a bottom surface of the opening. The conductor is placed to fill the opening. The conductor has a region overlapping with the oxide with the third insulator between the conductor and the oxide. The first insulator contains an element other than a main component of the oxide.
1. A semiconductor device comprising:
an oxide over a substrate;
a first insulator over the oxide;
a second insulator over the first insulator;
a third insulator; and
a conductor over the third insulator,
wherein the oxide and the first insulator are in contact with each other in a region,
wherein an opening exposing the oxide is provided in the first insulator and the second insulator,
wherein the third insulator is placed to cover an inner wall and a bottom surface of the opening,
wherein the conductor is placed to fill the opening,
wherein the conductor includes a region overlapping with the oxide with the third insulator between the conductor and the oxide, and
wherein the first insulator contains an element other than a main component of the oxide.
2. The semiconductor device according to claim 1 , wherein the oxide comprises an In—Ga—Zn oxide.
3. The semiconductor device according to claim 1 , wherein the element is at least one of hydrogen and nitrogen.
4. The semiconductor device according to claim 1 , wherein the first insulator comprises a silicon nitride film.
5. The semiconductor device according to claim 1 , wherein a first layer comprising aluminum oxide is provided between the first insulator and the second insulator.
6. The semiconductor device according to claim 1 , wherein a second layer comprising aluminum oxide is provided between the second insulator and the third insulator.
7. A semiconductor device comprising:
an oxide over a substrate;
a first insulator over the oxide;
a second insulator over the first insulator;
a third insulator;
a conductor over the third insulator;
a fourth insulator;
a fifth insulator;
a sixth insulator;
a first wiring; and
a second wiring,
wherein the oxide and the first insulator are in contact with each other in a region,
wherein a first opening exposing the oxide is provided in the first insulator and the second insulator,
wherein the third insulator is placed to cover an inner wall and a bottom surface of the first opening,
wherein the conductor is placed to fill the opening,
wherein the conductor includes a region overlapping with the oxide with the third insulator between the conductor and the oxide,
wherein the first insulator contains an element other than a main component of the oxide,
wherein the fourth insulator is placed over the second insulator, the third insulator, and the conductor,
wherein a second opening and a third opening each exposing the oxide are provided in the first insulator, the second insulator, and the fourth insulator,
wherein the fifth insulator is placed to cover an inner wall of the second opening,
wherein the first wiring is placed to fill the second opening,
wherein the sixth insulator is placed to cover an inner wall of the third opening, and
wherein the second wiring is placed to fill the third opening.
8. The semiconductor device according to claim 7 , wherein the oxide comprises an In—Ga—Zn oxide.
9. The semiconductor device according to claim 7 , wherein the element is at least one of hydrogen and nitrogen.
10. The semiconductor device according to claim 7 , wherein the first insulator comprises a silicon nitride film.
11. The semiconductor device according to claim 7 , wherein a first layer comprising aluminum oxide is provided between the first insulator and the second insulator.
12. The semiconductor device according to claim 7 , wherein a second layer comprising aluminum oxide is provided between the second insulator and the third insulator.
13. A method for manufacturing a semiconductor device comprising:
forming an oxide over a substrate;
forming a first insulator over and in contact with the oxide;
forming a second insulator over the first insulator;
forming an opening in the second insulator and the first insulator, the opening reaching the oxide;
forming a third insulator covering an inner wall and a bottom surface of the opening;
depositing a first conductor over the third insulator, a first part of the first conductor filling the opening; and
forming a second conductor embedded in the opening by removing a second part of the first conductor.
14. The method for manufacturing a semiconductor device according to claim 13 , wherein the oxide comprises an In—Ga—Zn oxide.
15. The method for manufacturing a semiconductor device according to claim 13 , wherein the first insulator comprises a silicon nitride film.