IP Library › Granted Patent US 10,820,457
Granted Patent B1
US 10,820,457 · App. 16/673,927 · Granted Oct 27, 2020

Electromagnetic wave shielding sheet and printed wiring board

Inventors: Daisuke Kishi (Tokyo, JP); Shota Mori (Tokyo, JP); Takahiro Matsuzawa (Tokyo, JP); Tsutomu Hayasaka (Tokyo, JP)
Assignees: TOYO INK SC HOLDINGS CO., LTD.; TOYOCHEM CO., LTD.
H05K9/0084B32B15/08C09J9/02H05K1/0218H05K9/0022H05K9/0088H05K2201/0335H05K2201/0715
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Quick Facts
Patent No.
US 10,820,457
App. No.
16/673,927
Granted
Oct 27, 2020
Kind
B1
Abstract

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

Claims (18)

1. An electromagnetic wave shielding sheet, comprising:

a protection layer, a metal layer, and a conductive adhesive layer, wherein the metal layer has a plurality of openings, and an aperture ratio of the openings is 0.1%-20%; and

a tensile breaking strength is 10 N/20 mm-80 N/20 mm,

wherein an average value of a circularity factor of the openings of the metal layer obtained by an expression below is 0.5 or more,

circularity factor=(area×4π)/(perimeter) 2

herein, the perimeter is a length of an outer circumference when an image which is obtained by observing the metal layer by any one of an optical microscope, a laser microscope and an electron microscope is read, a plane of the opening becomes a direction perpendicular to an observation viewpoint, the opening capable of being entirely confirmed is extracted, and a extracted opening is projected two-dimensionally; and the area is a breadth of a region defined by the outer circumference when the extracted opening is projected two-dimensionally.

2. The electromagnetic wave shielding sheet according to claim 1 , wherein a thickness of the metal layer is 0.5 μm-5 μm.

3. The electromagnetic wave shielding sheet according to claim 2 , wherein

the conductive adhesive layer contains a thermosetting resin and a conductive filler, and

a content of the conductive filler in the conductive adhesive layer is 35 mass %-90 mass %.

4. The electromagnetic wave shielding sheet according to claim 1 , wherein

the conductive adhesive layer contains a thermosetting resin and a conductive filler, and

a content of the conductive filler in the conductive adhesive layer is 35 mass %-90 mass %.

5. A printed wiring board comprising the electromagnetic wave shielding sheet according to claim 1 , a cover coat layer, and a wiring board having signal wirings and an insulation base material.

6. The printed wiring board according to claim 5 , wherein

the signal wirings have signal circuits and ground circuits;

a via is arranged on the cover coat layer to expose the ground circuits; and

an area of the via is 0.008 mm 2 or more and 0.8 mm 2 or less.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2019
From: KISHI, DAISUKE; MORI, SHOTA; MATSUZAWA, TAKAHIRO; HAYASAKA, TSUTOMU
To: TOYO INK SC HOLDINGS CO., LTD.; TOYOCHEM CO., LTD.
Reel/Frame 050964/0877 →
Priority Claims (1)
JP 2019-101051 · May 30, 2019 · national
Cited By (5)
US 12,232,306 US 12,267,947 US 12,349,271 US 12,382,618 US 12,396,146