Solid body and multi-component arrangement
A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.
1. A multi-component arrangement, comprising:
a solid-body layer comprising more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications or modification components being amorphized or phase-transformed components of the solid-body layer, the modifications or modification components being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being level; and
a metal layer on the first surface of the solid-body layer,
wherein the pressure tensions cause a bowing deformation of the solid-body layer,
wherein the metal layer at least partly compensates for the pressure tensions.
2. The multi-component arrangement of claim 1 , wherein the metal layer forms an ohmic contact and/or an interface for heat dissipation.
3. The multi-component arrangement of claim 1 , wherein on average, per cm 2 of the first surface, at least 4 electrical components are produced.
4. The multi-component arrangement of claim 1 , further comprising one or a plurality of further layers and/or one or a plurality of other components arranged on the second surface.
5. The multi-component arrangement of claim 4 , wherein the one or a plurality of further layers and/or the one or a plurality of other components arranged on the second surface form vertical or horizontal electrical components.
6. The multi-component arrangement of claim 5 , wherein the metal layer forms an ohmic contact for the vertical or horizontal electrical components.
7. The multi-component arrangement of claim 5 , wherein the metal layer forms a drain connection for the vertical or horizontal electrical components.
8. The multi-component arrangement of claim 4 , wherein the plurality of other components are Schottky diodes and/or transistors.
9. The multi-component arrangement of claim 4 , wherein the second surface of the solid-body layer has a coating and the one or a plurality of further layers and/or the one or a plurality of other components is arranged on the coating.
10. The multi-component arrangement of claim 4 , further comprising a polymer material on the one or a plurality of further layers and/or the one or a plurality of other components.
11. The multi-component arrangement of claim 1 , wherein the metal layer comprises titanium, titanium tungsten, nickel, platinum TaSi 2 and/or gold.
12. The multi-component arrangement of claim 1 , wherein the modifications or modification components are a phase transformation of silicon carbide into silicon and carbon.
13. The multi-component arrangement of claim 1 , wherein the modifications or modification components are a phase transformation of silicon carbide into silicon and diamond-like carbon phases.
14. The multi-component arrangement of claim 1 , wherein the solid-body layer comprises a material or a combination of materials from one of the main groups 3, 4 and 5 of the periodic table of elements.
15. The multi-component arrangement of claim 1 , wherein the solid-body layer comprises SiC, Si, SiGe, Ge, GaAs, InP, GaN, Al 2 O 3 , or AlN.
16. The multi-component arrangement of claim 1 , wherein the solid-body layer comprises a ceramic.