IP Library Granted Patent US 11,592,987
Granted Patent B2
US 11,592,987 · App. 17/238,822 · Granted Feb 28, 2023

Nonvolatile semiconductor memory device

Inventor: Takuya Futatsuyama (Yokohama, JP)
Assignee: Kioxia Corporation
G06F3/061G06F3/0619G06F3/0652G06F3/0656G06F3/0679G06F3/0688G11C11/5628G11C16/045G11C16/0408G11C16/0483G11C16/10G11C16/3418G11C2211/5648
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,592,987
App. No.
17/238,822
Granted
Feb 28, 2023
Kind
B2
Abstract

A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Claims (153)

1. A method for controlling a nonvolatile semiconductor memory device,

the nonvolatile semiconductor memory device comprising:

a memory cell array including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor,

the memory cells including:

a first memory cell connected with a first word line and capable of being programmed in one stage and storing data of one bit,

a second memory cell connected with a second word line and capable of being programmed in multi stages and storing data of three bits, the second memory cell being closer to the first selection gate transistor as compared with the first memory cell,

a third memory cell connected with a third word line and capable of being programmed in the multi stages and storing data of three bits, the third memory cell being closer to the first selection gate transistor as compared with the second memory cell, and

a fourth memory cell connected with a fourth word line and capable of being programmed in the multi stages and storing data of three bits, the fourth memory cell being closer to the first selection gate transistor as compared with the third memory cell,

the method comprising:

performing a first program on the third memory cell as a non-final stage of the multi stages;

performing a second program on the fourth memory cell as a final stage of the multi stages, after performing the first program;

performing a third program on the second memory cell as the non-final stage of the multi stages, after performing the second program;

performing a fourth program on the third memory cell as the final stage of the multi stages, after performing the third program;

performing a fifth program on the first memory cell as the non-final stage of the multi stages, after performing the fourth program; and

performing a sixth program on the second memory cell as the final stage of the multi stages, after performing the fifth program.

2. The method according to claim 1 , wherein

the memory cells further include:

a fifth memory cell connected with a fifth word line and capable of being programmed in the multi stages and storing data of three bits, the fifth memory cell being closer to the first selection gate transistor as compared with the fourth memory cell,

the method further comprising:

performing a seventh program on the fifth memory cell as the final stage of the multi stages, before performing the first program; and

performing an eighth program on the fourth memory cell as the non-final stage of the multi stages, before performing the seventh program.

3. The method according to claim 2 , wherein

the multi stages includes a first stage, a second stage, and a third stage, and

the non-final stage is the second stage, and the final stage is the third stage.

4. The method according to claim 3 , further comprising:

performing a ninth program on the third memory cell as the first stage of the multi stages, before performing the eighth program; and

performing a tenth program on the second memory cell as the first stage of the multi stages, after performing the seventh program and before performing the first program.

5. The method according to claim 1 , wherein

the memory cell array further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fourth memory cell.

6. The method according to claim 1 , wherein

the nonvolatile semiconductor memory device further includes:

a source line connected to a source of the first selection gate transistor, and

a bit line connected to a drain of the second selection gate transistor.

7. A method for controlling a nonvolatile semiconductor memory device,

the nonvolatile semiconductor memory device comprising:

a memory cell array including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor,

the memory cells including:

a first memory cell connected with a first word line and capable of being storing data of two bits,

a second memory cell connected with a second word line and capable of storing data of three bits, the second memory cell being closer to the first selection gate transistor as compared with the first memory cell,

a third memory cell connected with a third word line and capable of storing data of three bits, the third memory cell being closer to the first selection gate transistor as compared with the second memory cell,

a fourth memory cell connected with a fourth word line and capable of storing data of three bits, the fourth memory cell being closer to the first selection gate transistor as compared with the third memory cell, and

a fifth memory cell connected with a fifth word line and capable of storing data of three bits, the fifth memory cell being closer to the first selection gate transistor as compared with the fourth memory cell,

the method comprising:

performing a first program on the fourth memory cell as a non-final one of stages for writing three bits;

performing a second program on the fifth memory cell as a final one of stages for writing three bits, after performing the first program;

performing a third program on the third memory cell as the non-final one of stages for writing three bits, after performing the second program;

performing a fourth program on the fourth memory cell as the final one of stages for writing three bits, after performing the third program;

performing a fifth program on the second memory cell as the non-final one of stages for writing three bits, after performing the fourth program;

performing a sixth program on the first memory cell as a final one of stages for writing two bits, after performing the fifth program; and

performing a seventh program on the second memory cell as the final one of stages for writing three bits, after performing the sixth program.

8. The method according to claim 7 , further comprising:

performing an eighth program on the first memory cell as a non-final one of stages for writing two bits, after performing the fourth program and before performing the fifth program.

9. The method according to claim 8 , wherein

the three bits are written in first to third stages, among which the third stage corresponds to the final one of stages, and the second stage corresponds to the non-final one of stages, and

the two bits are written in first and second stages, among which the second stage corresponds to the final one of stages, and the first stage corresponds to the non-final one of stages.

10. The method according to claim 9 , further comprising:

performing a ninth program on the third memory cell as the first stage for writing three bits, before performing the first program; and

performing a tenth program on the second memory cell as the first stage for writing three bits, after performing the second program before performing the third program.

11. The method according to claim 7 , wherein

the memory cell array further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fifth memory cell.

12. The method according to claim 7 , wherein

the nonvolatile semiconductor memory device further includes:

a source line connected to a source of the first selection gate transistor, and

a bit line connected to a drain of the second selection gate transistor.

13. A method for controlling a nonvolatile semiconductor memory device,

the nonvolatile semiconductor memory device comprising:

a memory cell array including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor,

the memory cells including:

a first memory cell connected with a first word line and capable of being programmable in D1 stages to thereby store data of D1 bits, D1 being an integer of 1 or more,

a second memory cell connected with a second word line and capable of being programmable in D2 stages to thereby store data of D2 bits, D2 being an integer of 3 or more and greater than D1, the second memory cell being closer to the first selection gate transistor than the first memory cell,

a third memory cell connected with a third word line and capable of being programmable in D3 stages to thereby store data of D3 bits, D3 being an integer of 3 or more and greater than D1, the third memory cell being closer to the first selection gate transistor than the second memory cell, and

a fourth memory cell connected with a fourth word line and capable of being programmable in D4 stages to thereby store data of D4 bits, D4 being an integer of 3 or more and greater than D1, the fourth memory cell being closer to the first selection gate transistor than the third memory cell,

the method comprising:

performing a first program on the third memory cell as a first one of the D3 stages;

performing a second program on the fourth memory cell as a second or higher one of the D4 stages, after performing the first program;

performing a third program on the second memory cell as a first one of the D2 stages, after performing the second program,

performing a fourth program on the third memory cell as a second or higher one of the D3 stages, after performing the third program;

performing a fifth program on the first memory cell as a first one of the D1 stages, after performing the fourth program; and

performing a sixth program on the second memory cell as a second or higher one of the D2 stages, after performing the fifth program.

14. The method according to claim 13 , wherein

the sixth program on the second memory cell is performed as the second one of the D2 stages, and

the method further comprises:

performing a seventh program on the second memory cell as a third or higher one of the D2 stages, after performing the sixth program.

15. The method according to claim 14 , wherein

the second program on the fourth memory cell is performed as the second one of the D4 stages,

the fourth program on the third memory cell is performed as the second one of the D3 stages, and

the method further comprises:

performing an eighth program on the fourth memory cell as a third or higher one of the D4 stages, after performing the third program and before performing the fifth program, and

performing a ninth program on the third memory cell as a third or higher one of the D3 stages, after performing the fifth program and before performing the seventh program.

16. The method according to claim 13 , wherein

D1 is 1,

D2 is 3,

D3 is 3, and

D4 is 3.

17. The method according to claim 13 , wherein

the memory cell array further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fourth memory cell.

18. The method according to claim 13 , wherein

the nonvolatile semiconductor memory device further includes:

a source line connected to a source of the first selection gate transistor, and

a bit line connected to a drain of the second selection gate transistor.

19. A method for controlling a nonvolatile semiconductor memory device, comprising:

a memory cell array including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor,

the memory cells including:

a first memory cell connected with a first word line and capable of being programmable in D1 stages to thereby store data of D1 bits, D1 being an integer of 1 or more,

a second memory cell connected with a second word line and capable of being programmable in D2 stages to thereby store data of D2 bits, D2 being an integer of 3 or more and greater than D1, the second memory cell being closer to the first selection gate transistor than the first memory cell,

a third memory cell connected with a third word line and capable of being programmable in D3 stages to thereby store data of D3 bits, D3 being an integer of 3 or more and greater than D1, the third memory cell being closer to the first selection gate transistor than the second memory cell, and

a fourth memory cell connected with a fourth word line and capable of being programmable in D4 stages to thereby store data of D4 bits, D4 being an integer of 3 or more and greater than D1, the fourth memory cell being closer to the first selection gate transistor than the third memory cell,

the method comprising:

performing a first program on the third memory cell as a second or lower one of the D3 stages;

performing a second program on the fourth memory cell as a final one of the D4 stages, after performing the first program;

performing a third program on the second memory cell as a second or lower one of the D2 stages, after performing the second program;

performing a fourth program on the third memory cell as a final one of the D3 stages, after performing the third program;

performing a fifth program on the first memory cell as a first or higher one of the D1 stages, after performing the fourth program, and

performing a sixth program on the second memory cell as a final one of the D2 stages, after performing the fifth program.

20. The method according to claim 19 , wherein

the third program on the second memory cell is performed as the second one of the D2 stages, and

the method further comprises:

performing a seventh program on the second memory cell as a first one of the D2 stages, before performing the first program.

21. The method according to claim 20 , wherein

the first program on the third memory cell is performed as the second one of the D3 stages, and

the method further comprises:

performing an eighth program on the third memory cell as a first one of the D4 stages, before performing the seventh program.

22. The method according to claim 19 , wherein

D1 is 1,

D2 is 3,

D3 is 3, and

D4 is 3.

23. The method according to claim 19 , wherein

the memory cell array further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fourth memory cell.

24. The method according to claim 19 , wherein

the nonvolatile semiconductor memory device further includes:

a source line connected to a source of the first selection gate transistor, and

a bit line connected to a drain of the second selection gate transistor.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jan 14, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058737/0945 →
CHANGE OF NAME Recorded Jan 14, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058738/0001 →
Priority Claims (1)
JP 2009-098416 · Apr 14, 2009 · national
Continuity (10)
Continuation 16775739 · Jan 29, 2020
Continuation 16431789 · Jun 5, 2019
Continuation 15903629 · Feb 23, 2018
Continuation 15462300 · Mar 17, 2017
Continuation 15166895 · May 27, 2016
Continuation 14707908 · May 8, 2015
Continuation 14075400 · Nov 8, 2013
Continuation 13711894 · Dec 12, 2012
Continuation 12724636 · Mar 16, 2010
Related Publication 20210240345A1 · Aug 5, 2021