Semiconductor memory device and structure
A 3D semiconductor device, the device including: a first level including first single crystal transistors; and a second level including second single crystal transistors, where the first level is overlaid by the second level, where a vertical distance from the first single crystal transistors to the second single crystal transistors is less than eight microns, where the second level includes a layer transferred and bonded level, where the bonded includes oxide to oxide bonds, where the first level includes a plurality of processors, and where the second level includes a plurality of memory cells.
1. A 3D semiconductor device, comprising:
a first level comprising first single crystal transistors; and
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than eight microns,
wherein said first level comprises a transferred layer and a bonded level,
wherein said second level is bonded to said first level,
wherein said bonded second level comprises oxide to oxide bonds,
wherein said first level comprises a plurality of processors,
wherein said second level comprises a plurality of memory cells;
circuitry which generates a plurality of pairs of complementing signals,
wherein said second level comprises said circuitry,
wherein said plurality of pairs of complementing signals each comprise a signal wire A and a signal wire B; and
one or more converting circuits disposed on said first level,
wherein said one or more converting circuits comprises at least a first transistor and a second transistor.
2. The 3D semiconductor device according to claim 1 ,
wherein said 3D semiconductor device comprises a plurality of memory cells, and
wherein at least one of said plurality of memory cells comprises a charge trap type of memory cell.
3. The 3D semiconductor device according to claim 1 ,
wherein said second level comprises at least four memory arrays, and
wherein each of said at least four memory arrays is independently controlled.
4. The 3D semiconductor device according to claim 1 ,
wherein said second level is customized for a specific application from a generic level.
5. The 3D semiconductor device according to claim 1 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors;
wherein said 3D semiconductor device comprises a plurality of processors,
wherein said plurality of processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
6. The 3D semiconductor device according to claim 1 ,
wherein at least one of said circuits comprises a half-latch circuit.
7. The 3D semiconductor device according to claim 1 ,
wherein said 3D semiconductor device comprises a digital-to-analog converter circuit.
8. A 3D semiconductor device, comprising:
a first level comprising first single crystal transistors; and
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than eight microns;
at least one processor,
wherein said first level comprises said at least one processor;
at least one memory array,
wherein said second level comprises said at least one memory array,
wherein said second level comprises a transferred layer and a bonded level,
wherein said second level is bonded to said first level,
wherein said bonded level comprises oxide to oxide bonds; and
a plurality of half-latch circuits,
wherein said half-latch circuits are disposed on said second level.
9. The 3D semiconductor device according to claim 8 ,
wherein said first level comprises at least four processors.
10. The 3D semiconductor device according to claim 8 ,
wherein said second level comprises at least four memory arrays, and
wherein each of said at least four memory arrays is independently controlled.
11. The 3D semiconductor device according to claim 8 ,
wherein said second level is customized for a specific application from a generic level.
12. The 3D semiconductor device according to claim 8 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors,
wherein said first level comprises at least two processors,
wherein said at least two processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
13. The 3D semiconductor device according to claim 8 , further comprising:
a plurality of pairs of complementing signals,
wherein said 3D semiconductor device comprises one or more converting circuits that convert at least one of said plurality of pairs of complementing signals to a normal logic signal.
14. The 3D semiconductor device according to claim 8 ,
wherein said second single crystal transistors are disposed at a bottom of said second level toward said first level.
15. A 3D semiconductor device, comprising:
a first level comprising first single crystal transistors;
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than eight microns;
an array of at least four processors,
wherein said first level comprises said array of at least four processors;
an array of memory arrays,
wherein said second level comprises said array of memory arrays,
wherein said second level comprises a transferred layer and a bonded level,
wherein said second level is bonded to said first level; and
a plurality of half-latch circuits,
wherein said half-latch circuits are disposed on said second level,
wherein each of said at least four processors comprises a dedicated memory,
wherein said dedicated memory is exclusive to said each of said at least four processors, and
wherein said dedicated memory comprises at least one of said memory arrays.
16. The 3D semiconductor device according to claim 15 ,
wherein said at least one of said plurality of memory cells comprises a charge trap type of memory cell.
17. The 3D semiconductor device according to claim 15 ,
wherein said 3D semiconductor device comprises a plurality of half-latch circuits.
18. The 3D semiconductor device according to claim 15 ,
wherein said second single crystal transistors are disposed at a bottom of said second level toward said first level.
19. The 3D semiconductor device according to claim 15 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors,
wherein said at least four processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
20. The 3D semiconductor device according to claim 15 , further comprising:
a plurality of pairs of complementing signals,
wherein said 3D semiconductor device comprises one or more converting circuits that convert at least one of said plurality of pairs of complementing signals to a normal logic signal.