Semiconductor structure and method for forming the same
A semiconductor structure includes a substrate, a stacked structure on the substrate, an insulating layer on the stacked structure, a passivation layer on the insulating layer, and a contact structure through the passivation layer and the insulating layer and directly contacting the stacked structure. The insulating layer has an extending portion protruding from a sidewall of the passivation layer and adjacent to a surface of the stacked structure directly contacting the contact structure.
1. A semiconductor structure, comprising:
a substrate;
a stacked structure on the substrate, and comprising:
a buffer layer;
a channel layer on the buffer layer;
a barrier layer on the channel layer;
a semiconductor gate layer on the barrier layer; and
a metal gate layer on the semiconductor gate layer and completely overlapping a top surface of the semiconductor gate layer;
an insulating layer on the stacked structure;
a passivation layer on the insulating layer; and
a contact structure through the passivation layer and the insulating layer and directly contacting a first portion of a top surface of the metal gate layer of the stacked structure, wherein the insulating layer directly contacting a second portion of the top surface of the metal gate layer and comprises an extending portion protruding from a sidewall of the passivation layer and hanging above the first portion of the top surface of the metal gate layer, wherein the first portion of the top surface of the metal gate layer is lower than the second portion of the top surface of the metal gate layer, a top surface and a bottom surface of the extending portion of the insulating layer are directly covered by a liner of the contact structure.
2. The semiconductor structure according to claim 1 , wherein the insulating layer comprises aluminum oxide (Al 2 O 3 ), and the passivation layer comprises silicon oxide (SiO x ) or silicon nitride (SiN).
3. The semiconductor structure according to claim 1 , wherein the buffer layer, the channel layer, and the barrier layer respectively comprise III-V semiconductor materials.
4. The semiconductor structure according to claim 1 , wherein the buffer layer comprises carbon doped gallium nitride (GaN: C), the channel layer comprises gallium nitride (GaN), and the barrier layer comprises aluminum gallium nitride (AlGaN).
5. The semiconductor structure according to claim 1 , wherein the semiconductor gate layer comprises a P-doped III-V semiconductor material, the metal gate layer comprises titanium nitride (TiN).