Granted Patent B2

US 12,284,855 · App. 17/449,058 · Granted Apr 22, 2025

Inventors: Xaiwei Yun (Beijing, CN); Chenchang Chen (Beijing, CN); Wenchieh Huang (Beijing, CN); Bo Gao (Beijing, CN); Xuehai Qian (Beijing, CN); Meiling Jin (Beijing, CN); Wenjia Sun (Beijing, CN); Xiaozhou Liu (Beijing, CN)

Assignees: BOE MLED TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.

H10H20/857H01L25/0753H10H20/01H10H20/851H10H20/0364

Abstract

Claims (43)

1. A miniature light emitting diode chip, comprising:

a substrate, comprising a first side and a second side that are disposed opposite to each other;

a first contact portion and a plurality of second contact portions, arranged on the first side of the substrate; and

a plurality of miniature light emitting diodes, arranged on the first side of the substrate, wherein the plurality of miniature light emitting diodes are located on a side of the first contact portion and the second contact portions away from the substrate, and the miniature light emitting diodes each comprise a first electrode and a second electrode,

wherein the plurality of miniature light emitting diodes are spaced from each other, and an orthographic projection of a combination of the plurality of miniature light emitting diodes and a spacing between any two of the plurality of miniature light emitting diodes falls within the substrate;

wherein the first electrode of each of the plurality of miniature light emitting diodes is electrically connected to the first contact portion, and the second electrode of each of the plurality of miniature light emitting diodes is electrically connected to the plurality of second contact portions, respectively; and

wherein the miniature light emitting diode chip further comprises:

a first terminal and a second terminal that are arranged on the second side of the substrate, and wherein the first terminal accesses a first voltage signal and the second terminal accesses a second voltage signal,

a third terminal and a fourth terminal that are arranged on the second side of the substrate, wherein the third terminal and the fourth terminal access different electrical signals; and

a test terminal arranged on the first side of the substrate, wherein the test terminal accesses a test signal for implementing a light emitting test;

wherein an orthographic projection of at least one of the second terminal or the fourth terminal on the substrate at least partially overlaps with an orthographic projection of the test terminal on the substrate;

wherein an orthographic projection of the first contact portion on the substrate is spaced apart from an orthographic projection of each of the first terminal, the second terminal, the third terminal and the fourth terminal on the substrate, and an orthographic projection of the second contact portion on the substrate is spaced apart from an orthographic projection of each of the first terminal, the second terminal, the third terminal and the fourth terminal on the substrate; and

wherein the orthographic projection of each of the first contact portion and the second contact portion on the substrate is spaced apart from an orthographic projection of the test terminal on the substrate.

2. The miniature light emitting diode chip according to claim 1 , wherein colors of light emitted by the plurality of miniature light emitting diodes are different from each other.

3. The miniature light emitting diode chip according to claim 1 , wherein colors of light emitted by the plurality of miniature light emitting diodes are the same.

4. The miniature light emitting diode chip according to claim 3 , wherein at least one miniature light emitting diode comprises a light conversion layer arranged on the first side of the substrate, and the light conversion layer is configured to convert light in a first wavelength range into light in a second wavelength range, wherein the first wavelength range is different from the second wavelength range.

5. The miniature light emitting diode chip according to claim 1 , wherein the miniature light emitting diode chip further comprises a spacer arranged in the spacing between any two of the plurality of miniature light emitting diodes.

6. A display substrate, comprising:

a base substrate; and

a miniature light emitting diode chip arranged on the base substrate,

wherein the miniature light emitting diode chip is the miniature light emitting diode chip according to claim 1 , the second side of the substrate faces the base substrate, and the first side of the substrate is away from the base substrate;

wherein a driving circuit is arranged on the base substrate and on the second side of the substrate of the miniature light emitting diode chip, wherein the first terminal, the second terminal and the third terminal of the miniature light emitting diode chip are respectively electrically connected to the driving circuit;

wherein the first voltage signal is a power supply voltage signal, the second voltage signal is a reference voltage signal, and the third terminal is configured to receive a data signal; and

wherein the driving circuit comprises a first transistor, a second transistor, and a capacitor, a first terminal of the first transistor is connected to the third terminal, a control terminal of the first transistor is connected to a gate driving signal terminal, and a second terminal of the first transistor is connected to a control terminal of the second transistor; a first terminal of the second transistor is connected to the first terminal, a second terminal of the second transistor is connected to the first electrode of the miniature light emitting diode, the second electrode of the light-emitting diode is connected to the second terminal, and the capacitor is connected between the second terminal of the first transistor and the second terminal of the second transistor; and the test terminal is connected to the miniature light emitting diode in the miniature light emitting diode chip.

7. A display device, comprising the display substrate according to claim 6 .

8. The display substrate according to claim 6 , wherein the miniature light emitting diode is a Micro LED, and a size level of the substrate of the miniature light emitting diode chip is identical to a size level of a mini LED.

9. The display substrate according to claim 6 , wherein the fourth terminal is configured to receive a test signal.

10. The display substrate according to claim 6 , wherein the miniature light emitting diode chip comprises two test terminals arranged on the first side of the substrate, wherein the two test terminals are connected to the first electrode of the miniature light emitting diode and the second electrode of the miniature light emitting diode respectively, in order to apply the test signal to the miniature light emitting diode.

11. A method for manufacturing a display substrate, comprising:

providing a substrate, wherein the substrate comprises a first side and a second side that are disposed opposite to each other;

forming a first contact portion, a plurality of second contact portions, and a test terminal on the first side of the substrate;

forming a first terminal, a second terminal, a third terminal and a fourth terminal on the second side of the substrate; and

transferring a plurality of miniature light emitting diodes to the substrate through a first transfer process, so that the plurality of miniature light emitting diodes are located on a side of the first contact portion and the second contact portion away from the substrate, wherein each of the miniature light emitting diodes comprises a first electrode and a second electrode,

wherein the plurality of miniature light emitting diodes are spaced from each other, and an orthographic projection of a combination of the plurality of miniature light emitting diodes and a spacing between any two of the plurality of miniature light emitting diodes falls within the substrate;

wherein the first electrode of each of the plurality of miniature light emitting diodes is electrically connected to the first contact portion, and the second electrode of each of the plurality of miniature light emitting diodes is electrically connected to the plurality of second contact portions, respectively;

wherein an orthographic projection of at least one of the second terminal or the fourth terminal on the substrate at least partially overlaps with an orthographic projection of the test terminal on the substrate;

wherein an orthographic projection of the first contact portion on the substrate is spaced apart from an orthographic projection of each of the first terminal, the second terminal, the third terminal and the fourth terminal on the substrate, and an orthographic projection of the second contact portion on the substrate is spaced apart from an orthographic projection of each of the first terminal, the second terminal, the third terminal and the fourth terminal on the substrate; and

wherein the orthographic projection of each of the first contact portion and the second contact portion on the substrate is spaced apart from an orthographic projection of the test terminal on the substrate.

12. The method according to claim 11 , further comprising:

transferring a miniature light emitting diode chip carrying the plurality of miniature light emitting diodes to a base substrate through a second transfer process,

wherein an accuracy of the second transfer process is less than an accuracy of the first transfer process.

13. The method according to claim 12 , further comprising:

accessing a test signal via the test terminal to perform a light emitting test on the miniature light emitting diode chip carrying the plurality of miniature light emitting diodes.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (29)