IP Library Granted Patent US 12,243,797
Granted Patent B1
US 12,243,797 · App. 17/478,843 · Granted Mar 4, 2025

3D stack of split graphics processing logic dies

Inventors: Amrita Mathuriya (Portland, OR); Christopher B. Wilkerson (Portland, OR); Rajeev Kumar Dokania (Beaverton, OR); Debo Olaosebikan (San Francisco, CA); Sasikanth Manipatruni (Portland, OR)
Assignee: Kepler Computing Inc.
H01L23/3675H01L23/481H01L23/49816H01L23/49833H01L23/49838H01L23/5385H01L23/5386H01L25/105G06N20/00H01L2924/14335H01L2924/1438H01L2924/1441
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Quick Facts
Patent No.
US 12,243,797
App. No.
17/478,843
Granted
Mar 4, 2025
Kind
B1
Abstract

A packaging technology to improve performance of an AI processing system resulting in an ultra-high bandwidth system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die can be a first logic die (e.g., a compute chip, CPU, GPU, etc.) while the second die can be a compute chiplet comprising ferroelectric or paraelectric logic. Both dies can include ferroelectric or paraelectric logic. The ferroelectric/paraelectric logic may include AND gates, OR gates, complex gates, majority, minority, and/or threshold gates, sequential logic, etc. The IC package can be in a 3D or 2.5D configuration that implements logic-on-logic stacking configuration. The 3D or 2.5D packaging configurations have chips or chiplets designed to have time distributed or spatially distributed processing. The logic of chips or chiplets is segregated so that one chip in a 3D or 2.5D stacking arrangement is hot at a time.

Claims (39)

1. An apparatus comprising:

a first die comprising a load and store unit; and

a second die stacked on the first die, wherein the second die includes a vector math unit and a matrix math unit, wherein the load and store unit is to store data generated by the vector math unit and the matrix math unit.

2. The apparatus of claim 1 , wherein the first die consumes less power than the second die.

3. The apparatus of claim 1 , comprising a heat sink to manage thermals of the first die and the second die.

4. The apparatus of claim 1 , wherein the first die includes a scaler unit which works with the vector math unit of the second die.

5. The apparatus of claim 1 , wherein the first die includes a cache unit, a scheduler, a control logic unit, and a scalar matrix unit.

6. The apparatus of claim 1 , wherein the second die includes a first interconnect fabric, wherein the first die includes a second interconnect fabric, wherein the first interconnect fabric is coupled to the second interconnect fabric.

7. The apparatus of claim 6 , wherein the first interconnect fabric of the second interconnect fabric includes one of: a network on chip, a mesh fabric, or a ring fabric.

8. The apparatus of claim 6 , wherein the first interconnect fabric is coupled to the second interconnect fabric via copper-to-copper bonding.

9. The apparatus of claim 1 , wherein the second die includes a majority gate, a minority gate, or a threshold gate.

10. The apparatus of claim 1 , wherein the second die includes ferroelectric logic or paraelectric logic.

11. The apparatus of claim 9 , wherein the majority gate, the minority gate, or the threshold gate include non-linear polar material which include one of: a ferroelectric material, a paraelectric material, or a non-linear dielectric.

12. The apparatus of claim 11 , wherein the ferroelectric material includes one of:

bismuth ferrite (BFO) or BFO with a first doping material wherein the first doping material is one of lanthanum, or elements from lanthanide series of periodic table;

lead zirconium titanate (PZT) or PZT with a second doping material, wherein the second doping material is one of La or Nb;

a relaxor ferroelectric which includes one of: lead magnesium niobate (PMN), lead magnesium niobate-lead titanate (PMN-PT), lead lanthanum zirconate titanate (PLZT), lead scandium niobate (PSN), barium titanium-bismuth zinc niobium tantalum (BT-BZNT), or barium titanium-barium strontium titanium (BT-BST);

a perovskite which includes one of: BaTiO 3 , PbTiO 3 , KNbO 3 , or NaTaO 3;

a hexagonal ferroelectric which includes one of: YMnO 3 , or LuFeO 3;

hexagonal ferroelectrics of a type h-RMnO 3 , where R is a rare earth element which includes one of: cerium (Ce), dysprosium (Dy), erbium (Er), europium (Eu), gadolinium (Gd), holmium (Ho), lanthanum (La), lutetium (Lu), neodymium (Nd), praseodymium (Pr), promethium (Pm), samarium (Sm), scandium (Sc), terbium (Tb), thulium (Tm), ytterbium (Yb), or yttrium (Y);

hafnium (Hf), zirconium (Zr), aluminum (Al), silicon (Si), their oxides, or their alloyed oxides;

hafnium oxides as Hf ( 1-x)E x O y , where E can be Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, Zr, or Y;

Al ( 1-x)Sc (x) N, Ga ( 1-x)Sc (x) N, Al ( 1-x)Y (x) N or Al ( 1-x-y)Mg (x) Nb (y) N, y doped HfO 2 , where x includes one of: Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, or Y, wherein ‘x’ is a fraction;

niobate type compounds LiNbO 3 , LiTaO 3 , lithium iron tantalum oxy fluoride, barium strontium niobate, sodium barium niobate, or potassium strontium niobate; or

an improper ferroelectric which includes one of: [PTO/STO]n or [LAO/STO]n, where ‘n’ is between 1 and 100.

13. The apparatus of claim 11 , wherein the paraelectric material includes: SrTiO 3 , Ba (x) Sr (y) TiO 3 (where x is −0.05, and y is 0.95), HfZrO 2 , Hf—Si—O, La-substituted PbTiO 3 , or PMN-PT based relaxor ferroelectrics.

14. A system comprising:

a memory;

a first die comprising a load and store unit, wherein the first die is coupled to the memory;

a second die stacked on the first die, wherein the second die includes a vector math unit and a matrix math unit, wherein the load and store unit comprises registers to store data generated by the vector math unit and the matrix math unit, wherein the second die includes a majority gate, a minority gate, or a threshold gate; and

a communication interface to allow the first die to communicate with another device.

15. The system of claim 14 , wherein the first die consumes less power than the second die.

16. The system of claim 14 , comprising a heat sink on the second die.

17. The system of claim 14 , wherein the first die includes a scaler unit which works with the vector math unit of the second die.

18. An apparatus comprising:

a first die comprising a load and store unit and a vector math unit coupled to the load and store unit; and

a second die stacked on the first die, wherein the second die includes a matrix math unit and a scheduler and control logic coupled to the matrix math unit, wherein the load and store unit comprises registers to store data generated by the matrix math unit.

19. The apparatus of claim 18 , wherein the second die comprises a majority gate, a minority gate, or a threshold gate.

20. The apparatus of claim 19 , wherein the second die consumes more power than the first die, wherein the apparatus comprises a heat sink on the second die.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2022
From: MATHURIYA, AMRITA; WILKERSON, CHRISTOPHER B.; DOKANIA, RAJEEV KUMAR; OLAOSEBIKAN, DEBO; MANIPATRUNI, SASIKANTH
To: KEPLER COMPUTING INC.
Reel/Frame 059533/0009 →
Continuity (1)
Continuation 17396585 · Aug 6, 2021
References Cited (279)
US 5834162A · Malba · 1998 [cited by applicant]
US 6256248B1 · Leung · 2001 [cited by applicant]
US 6487135B2 · Watanabe et al. · 2002 [cited by applicant]
US 6890798B2 · McMahon · 2005 [cited by applicant]
US 7146454B1 · Li et al. · 2006 [cited by applicant]
US 7217596B2 · Cobbley et al. · 2007 [cited by applicant]
US 7683459B2 · Ma et al. · 2010 [cited by applicant]
US 7992017B2 · Safford et al. · 2011 [cited by applicant]
US 8143710B2 · Cho · 2012 [cited by applicant]
US 8198716B2 · Periaman et al. · 2012 [cited by applicant]
US 8245065B2 · Niggemeier et al. · 2012 [cited by applicant]
US 8525342B2 · Chandrasekaran et al. · 2013 [cited by applicant]
US 8546955B1 · Wu · 2013 [cited by applicant]
US 8547769B2 · Saraswat et al. · 2013 [cited by applicant]
US 8612809B2 · Casper et al. · 2013 [cited by applicant]
US 8701073B1 · Fu et al. · 2014 [cited by applicant]
US 8759899B1 · Ue et al. · 2014 [cited by applicant]
US 8896126B2 · Setardja · 2014 [cited by applicant]
US 8947931B1 · d'Abreu · 2015 [cited by applicant]
US 9165968B2 · Chao et al. · 2015 [cited by applicant]
US 9379078B2 · Yu et al. · 2016 [cited by applicant]
US 9627365B1 · Yu et al. · 2017 [cited by applicant]
US 9748190B2 · Chen et al. · 2017 [cited by applicant]
US 10074423B1 · Hermesh et al. · 2018 [cited by applicant]
US 10461076B1 · Brewer · 2019 [cited by applicant]
US 10741525B2 · Takishita et al. · 2020 [cited by applicant]
US 11009938B1 · Law et al. · 2021 [cited by applicant]
US 11043472B1 · Dokania et al. · 2021 [cited by applicant]
US 11139270B2 · Manipatruni et al. · 2021 [cited by applicant]
US 11152343B1 · Dokania et al. · 2021 [cited by applicant]
US 11171115B2 · Manipatruni et al. · 2021 [cited by applicant]
US 11238206B1 · Sivaswamy et al. · 2022 [cited by applicant]
US 11309895B2 · Dabral et al. · 2022 [cited by applicant]
US 11436402B1 · Liu et al. · 2022 [cited by applicant]
US 11488935B1 · Zaman et al. · 2022 [cited by applicant]
US 11694940B1 · Mathuriya et al. · 2023 [cited by applicant]
US 20030097543A1 · Wishneusky · 2003 [cited by applicant]
US 20060179329A1 · Terechko et al. · 2006 [cited by applicant]
US 20070208902A1 · Park et al. · 2007 [cited by applicant]
US 20070234094A1 · Samra et al. · 2007 [cited by applicant]
US 20080126611A1 · Tu et al. · 2008 [cited by applicant]
US 20090019411A1 · Chandra et al. · 2009 [cited by applicant]
US 20090103854A1 · Beausoleil et al. · 2009 [cited by applicant]
US 20100008058A1 · Saen et al. · 2010 [cited by applicant]
US 20100057404A1 · Dittmann et al. · 2010 [cited by applicant]
US 20100077179A1 · Stillwell, Jr. et al. · 2010 [cited by applicant]
US 20100167467A1 · Aoi · 2010 [cited by applicant]
US 20100228955A1 · Niggemeier et al. · 2010 [cited by applicant]
US 20100321993A1 · Nikonov et al. · 2010 [cited by applicant]
US 20110222540A1 · Mital et al. · 2011 [cited by applicant]
US 20120098140A1 · Bartley et al. · 2012 [cited by applicant]
US 20120106117A1 · Sundaram et al. · 2012 [cited by applicant]
US 20120146207A1 · Chou et al. · 2012 [cited by applicant]
US 20120239904A1 · Ekanadham et al. · 2012 [cited by applicant]
US 20130086395A1 · Liu · 2013 [cited by applicant]
US 20130141858A1 · Pyeon · 2013 [cited by applicant]
US 20130175686A1 · Meyer et al. · 2013 [cited by applicant]
US 20130205143A1 · Eastlack · 2013 [cited by applicant]
US 20130320560A1 · Secker et al. · 2013 [cited by applicant]
US 20130346781A1 · Chung et al. · 2013 [cited by applicant]
US 20140006817A1 · Bonen et al. · 2014 [cited by applicant]
US 20140026146A1 · Jahagirdar et al. · 2014 [cited by applicant]
US 20140208041A1 · Hyde et al. · 2014 [cited by applicant]
US 20140217604A1 · Chou et al. · 2014 [cited by applicant]
US 20140217616A1 · Choi · 2014 [cited by applicant]
US 20140371109A1 · McMillen et al. · 2014 [cited by applicant]
US 20150091131A1 · Lamorey et al. · 2015 [cited by applicant]
US 20150277532A1 · Mishaeli et al. · 2015 [cited by applicant]
US 20150279431A1 · Li et al. · 2015 [cited by applicant]
US 20160126291A1 · Lu et al. · 2016 [cited by applicant]
US 20160218081A1 · Kim · 2016 [cited by applicant]
US 20160357630A1 · Kang et al. · 2016 [cited by applicant]
US 20170018301A1 · Kilmer et al. · 2017 [cited by applicant]
US 20170062383A1 · Yee et al. · 2017 [cited by applicant]
US 20170077387A1 · Kan et al. · 2017 [cited by applicant]
US 20170084312A1 · Kim · 2017 [cited by applicant]
US 20170084596A1 · Scanlan · 2017 [cited by applicant]
US 20170139635A1 · Jayasena et al. · 2017 [cited by applicant]
US 20170178711A1 · Morris et al. · 2017 [cited by applicant]
US 20170300269A1 · Um · 2017 [cited by applicant]
US 20180082981A1 · Gowda et al. · 2018 [cited by applicant]
US 20180095750A1 · Drysdale et al. · 2018 [cited by applicant]
US 20180107630A1 · Zhou et al. · 2018 [cited by applicant]
US 20180240964A1 · Nikonov et al. · 2018 [cited by applicant]
US 20180254073A1 · Frans · 2018 [cited by applicant]
US 20180277695A1 · Garten et al. · 2018 [cited by applicant]
US 20180330236A1 · Hou et al. · 2018 [cited by applicant]
US 20180350773A1 · Saito · 2018 [cited by applicant]
US 20190042251A1 · Nurvitadhi et al. · 2019 [cited by applicant]
US 20190050040A1 · Baskaran et al. · 2019 [cited by applicant]
US 20190051642A1 · Hyde et al. · 2019 [cited by applicant]
US 20190065204A1 · Jean · 2019 [cited by applicant]
US 20190065956A1 · Qian et al. · 2019 [cited by applicant]
US 20190096453A1 · Shin et al. · 2019 [cited by applicant]
US 20190102330A1 · Hasbun et al. · 2019 [cited by applicant]
US 20190103143A1 · Hasbun et al. · 2019 [cited by applicant]
US 20190103148A1 · Hasbun et al. · 2019 [cited by applicant]
US 20190114535A1 · Ng et al. · 2019 [cited by applicant]
US 20190164834A1 · Or-Bach et al. · 2019 [cited by applicant]
US 20190187898A1 · Gu et al. · 2019 [cited by applicant]
US 20190189564A1 · Guzek · 2019 [cited by applicant]
US 20190198083A1 · Biswas et al. · 2019 [cited by applicant]
US 20190205244A1 · Smith · 2019 [cited by applicant]
US 20190220434A1 · Dai et al. · 2019 [cited by applicant]
US 20190229101A1 · Lee · 2019 [cited by applicant]
US 20190259732A1 · Choo et al. · 2019 [cited by applicant]
US 20190267074A1 · Fishburn et al. · 2019 [cited by applicant]
US 20190279697A1 · Karpov et al. · 2019 [cited by applicant]
US 20190317585A1 · Bhandaru et al. · 2019 [cited by applicant]
US 20190318975A1 · Shi et al. · 2019 [cited by applicant]
US 20190334010A1 · Avci et al. · 2019 [cited by applicant]
US 20200006324A1 · Chen et al. · 2020 [cited by applicant]
US 20200075567A1 · Collins · 2020 [cited by applicant]
US 20200076424A1 · Dubey et al. · 2020 [cited by applicant]
US 20200098725A1 · Liff et al. · 2020 [cited by applicant]
US 20200107444A1 · Hoe et al. · 2020 [cited by applicant]
US 20200126995A1 · Ge et al. · 2020 [cited by applicant]
US 20200135697A1 · Brewer · 2020 [cited by applicant]
US 20200159568A1 · Goyal et al. · 2020 [cited by applicant]
US 20200161230A1 · Knickerbocker et al. · 2020 [cited by applicant]
US 20200168528A1 · Cheah et al. · 2020 [cited by applicant]
US 20200168550A1 · Ryu et al. · 2020 [cited by applicant]
US 20200168554A1 · Fay et al. · 2020 [cited by applicant]
US 20200279793A1 · Xie et al. · 2020 [cited by applicant]
US 20200303343A1 · Manipatruni et al. · 2020 [cited by applicant]
US 20200303344A1 · Manipatruni et al. · 2020 [cited by applicant]
US 20200334082A1 · Zhao et al. · 2020 [cited by applicant]
US 20200365593A1 · Chen et al. · 2020 [cited by applicant]
US 20210134724A1 · Rubin et al. · 2021 [cited by applicant]
US 20210160061A1 · Liu et al. · 2021 [cited by applicant]
US 20210166740A1 · Shin et al. · 2021 [cited by applicant]
US 20210311629A1 · Pappachan et al. · 2021 [cited by applicant]
US 20210335718A1 · Cheah et al. · 2021 [cited by applicant]
US 20210391469A1 · Doornbos et al. · 2021 [cited by applicant]
US 20220367400A1 · Li · 2022 [cited by applicant]
US 20230004324A1 · Lim et al. · 2023 [cited by applicant]
US 20230086010A1 · Gonzalez et al. · 2023 [cited by applicant]
CN 104081516A · 2014 [cited by applicant]
CN 104081516B · 2017 [cited by applicant]
GB 2323188A · 1998 [cited by applicant]
JP H11168185A · 1999 [cited by applicant]
JP 2000196008A · 2000 [cited by applicant]
JP 2004315268A · 2004 [cited by applicant]
JP 2006324430A · 2006 [cited by applicant]
JP 2007150154 · 2009 [cited by applicant]
JP 2010053399A · 2010 [cited by applicant]
JP 2018160490A · 2018 [cited by applicant]
KR 20100081272A · 2010 [cited by applicant]
KR 20200066538A · 2020 [cited by applicant]
TW 201327740A · 2013 [cited by applicant]
TW 201430968A · 2014 [cited by applicant]
TW 201523827A · 2015 [cited by applicant]
TW 201843782A · 2018 [cited by applicant]
WO 2018126073A1 · 2018 [cited by applicant]
WO 2018220846A1 · 2018 [cited by applicant]
WO 2019023253A1 · 2019 [cited by applicant]
WO 2020062312A1 · 2020 [cited by applicant]
AMD CDNA whitepaper. Retrieved from https://www.amd.com/system/files/documents/amd-cdna-whitepaper.pdf [Sep. 14, 2021]. [cited by applicant]
AMD's V-cache product announcement. Retrieved from https://www.pcworld.com/article/3620871/amd-v-cache-for-ryzen-everything-you-need-to-know.html [Sep. 14, 2021]. [cited by applicant]
Chen et al. “System on integrated chips (SoIC (TM) for 3D heterogeneous integration.” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. [cited by applicant]
Chen et al. “Ultra high density SoIC with sub-micron bond pitch.” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, 2020. [cited by applicant]
Herbert et al., “Analysis of dynamic voltage/frequency scaling in chip-multiprocessors.” Proceedings of the 2007 International symposium on Low power electronics and design (ISLPED'07). IEEE, 2007. [cited by applicant]
Ingerly et al. “Foveros: 3D integration and the use of face-to-face chip stacking for logic devices.” 2019 IEEE International Electron Devices Meeting (IEDM). IEEE, 2019. [cited by applicant]
Leblebici, Y., et al. “A compact high-speed (31, 5) parallel counter circuit based on capacitive threshold-logic gates.” IEEE Journal of Solid-State Circuits 31.8 (1996): 1177-1183. [cited by applicant]
Lee et al. “Heterogeneous System-Level Package Integration-Trends and Challenges.” 2020 IEEE Symposium on VLSI Technology. IEEE, 2020. [cited by applicant]
Lent et al. “Quantum cellular automata.” Nanotechnology 4.1 (1993): 49. [cited by applicant]
Manipatruni et al. “Scalable energy-efficient magnetoelectric spin-orbit logic.” Nature 565.7737 (2019): 35-42. [cited by applicant]
Prasad et al. “Buried power rails and back-side power grids: Arm® CPU power delivery network design beyond 5nm.” 2019 IEEE International Electron Devices Meeting (IEDM). IEEE, 2019. [cited by applicant]
Rotem et al. “Power-management architecture of the intel microarchitecture code-named sandy bridge.” IEEE micro 32.2 (2012): 20-27. [cited by applicant]
Notice of Allowance notified Jul. 12, 2023 for U.S. Appl. No. 17/499,241. [cited by applicant]
Notice of Allowance notified Jul. 18, 2023 for Japanese Patent Application No. 2021-546863. [cited by applicant]
Notice of Allowance notified Jul. 27, 2023 for U.S. Appl. No. 17/229,750. [cited by applicant]
Notice of Allowance notified Jun. 6, 2023 for U.S. Appl. No. 17/472,308. [cited by applicant]
Notice of Allowance notified Jun. 6, 2023 for U.S. Appl. No. 17/472,325. [cited by applicant]
Notice of Allowance notified Jun. 29, 2023 for U.S. Appl. No. 17/407,094. [cited by applicant]
Notice of Allowance notified May 10, 2023 for U.S. Appl. No. 17/396,585. [cited by applicant]
Notice of Allowance notified Nov. 23, 2022 for U.S. Appl. No. 17/390,829. [cited by applicant]
Notice of Allowance notified Sep. 11, 2023 for Taiwan Patent Application No. 111129893. [cited by applicant]
Notice of Allowance notified Sep. 21, 2022 for Taiwan Patent Application No. 109106755. [cited by applicant]
Notice of Allowance notified Sep. 28, 2022 for U.S. Appl. No. 17/390,799. [cited by applicant]
Notice of Allowance notified Sep. 29, 2023 for U.S. Appl. No. 17/408,251. [cited by applicant]
Notice of Reasons for Rejection notified Nov. 8, 2022 for Japanese Patent Application No. 2021-546863. [cited by applicant]
Office Action notified Feb. 21, 2023 for Japanese Patent Application No. 2021-546863. [cited by applicant]
Office Action notified May 8, 2023 for Taiwan Patent Application No. 111129893. [cited by applicant]
Oya et al., “A Majority-Logic Device Using an Irreversible Single-Electron Box,” IEEE Transaction on Nanotechnology, vol. 2, No. I, Mar. 2003, pp. 15-22 (9 pages). [cited by applicant]
Restriction Requirement notified Feb. 8, 2023 for U.S. Appl. No. 17/229/750. [cited by applicant]
Restriction Requirement notified May 1, 2023 for U.S. Appl. No. 17/230,889. [cited by applicant]
Wikipedia. Ferroelectric RAM, retrieved from the Internet by USPTO Feb. 21, 2023, https://en.wikipedia.org/wiki/Ferroelectric_RAM, 8 pages. [cited by applicant]
First Office Action in Re-Examination notified Jul. 11, 2022 for Taiwan Patent Application No. 109106755. [cited by applicant]
Kim et al., “A 1.2 V 12.8 GB/s 2 GB Mobile Wide-I/O DRAM With 4$\times$128 I/Os Using TSV Based Stacking”, IEEE Journal of Solid-State Circuits, vol. 47, No. 1, pp. 107-116, Jan. 2012. [cited by applicant]
Lee et al., “25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV”, 2014 IEEE International Solid-State Circuits Conference Dige… [cited by applicant]
Non-Final Office Action notified May 24, 2022 for U.S. Appl. No. 16/823,209. [cited by applicant]
2nd Office Action notified Apr. 10, 2024 for Taiwan Patent Application No. 112147200. [cited by applicant]
Advisory Action notified Feb. 14, 2024 for U.S. Appl. No. 17/230,890. [cited by applicant]
Advisory Action notified Jan. 5, 2023 for U.S. Appl. No. 16/823,209. [cited by applicant]
Advisory Action notified Jan. 25, 2024 for U.S. Appl. No. 17/408,323. [cited by applicant]
Advisory Action notified Jan. 25, 2024 for U.S. Appl. No. 17/472,330. [cited by applicant]
Advisory Action notified Jun. 14, 2023 for U.S. Appl. No. 16/823,209. [cited by applicant]
Advisory Action notified Mar. 6, 2024 for U.S. Appl. No. 17/230,889. [cited by applicant]
Advisory Action notified Mar. 15, 2023 for U.S. Appl. No. 17/472,308. [cited by applicant]
Advisory Action notified Mar. 15, 2023 for U.S. Appl. No. 17/472,325. [cited by applicant]
Coskun et al., “Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures,” 2009 12th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, Patras, Greece, 2009, pp. 183-190, doi: … [cited by applicant]
Ex Parte Quayle Action notified Aug. 24, 2023 for U.S. Appl. No. 17/408,251. [cited by applicant]
Final Office Action notified Apr. 19, 2023 for U.S. Appl. No. 16/823,209. [cited by applicant]
Final Office Action notified Dec. 22, 2023 for U.S. Appl. No. 17/230,889. [cited by applicant]
Final Office Action notified Feb. 14, 2023 for U.S. Appl. No. 17/472,308. [cited by applicant]
Final Office Action notified Feb. 14, 2023 for U.S. Appl. No. 17/472,325. [cited by applicant]
Final Office Action notified Nov. 29, 2023 for U.S. Appl. No. 17/230,890. [cited by applicant]
Final Office Action notified Oct. 17, 2022 for U.S. Appl. No. 16/823,209. [cited by applicant]
Final Office Action notified Oct. 24, 2023 for U.S. Appl. No. 17/472,330. [cited by applicant]
Final Office Action notified Oct. 27, 2023 for U.S. Appl. No. 17/408,323. [cited by applicant]
First Office Action notified Jan. 9, 2024 for Taiwan Patent Application No. 112147200. [cited by applicant]
Koob et al., “Design of a 3-D fully depleted SOI computational RAM,” in IEEE Transactions on Very Large Scale Integration ( VLSI) Systems, vol. 13, No. 3, pp. 358-369, Mar. 2005, doi: 10.1109/TVLSI.2004.842890 (12 pages… [cited by applicant]
Lewis et al., “Testing Circuit-Partitioned 3D IC Designs,” 2009 IEEE Computer Society Annual Symposium on VLSI, Tampa, FL, USA, 2009, pp. 139-144, doi: 10.1109/ISVLSI.2009.48 (6 pages). [cited by applicant]
Lexinnova, 3D Stacked Memory, retrieved from the Internet by USPTO 2017, 23 pages. [cited by applicant]
Non-Final Office Action notified Apr. 3, 2024 for U.S. Appl. No. 18/358,552. [cited by applicant]
Non-Final Office Action notified Apr. 20, 2023 for U.S. Appl. No. 17/472,308. [cited by applicant]
Non-Final Office Action notified Apr. 20, 2023 for U.S. Appl. No. 17/472,325. [cited by applicant]
Non-Final Office Action notified Aug. 30, 2023 for U.S. Appl. No. 17/230,889. [cited by applicant]
Non-Final Office Action notified Dec. 15, 2023 for U.S. Appl. No. 17/229,743. [cited by applicant]
Non-Final Office Action notified Jan. 31, 2023 for U.S. Appl. No. 16/823,209. [cited by applicant]
Non-Final Office Action notified Jul. 6, 2023 for U.S. Appl. No. 17/229,50. [cited by applicant]
Non-Final Office Action notified Jul. 26, 2023 for U.S. Appl. No. 7/230,890. [cited by applicant]
Non-Final Office Action notified Mar. 3, 2023 for U.S. Appl. No. 17/449,240. [cited by applicant]
Non-Final Office Action notified Mar. 24, 2023 for U.S. Appl. No. 17/408,326. [cited by applicant]
Non-Final Office Action Notified Mar. 27, 2024 for U.S. Appl. No. 17/230,890. [cited by applicant]
Non-Final Office Action notified May 9, 2023 for U.S. Appl. No. 17/408,323. [cited by applicant]
Non-Final Office Action notified May 15, 2023 for U.S. Appl. No. 17/472,330. [cited by applicant]
Non-Final Office Action notified Oct. 5, 2022 for U.S. Appl. No. 17/472,308. [cited by applicant]
Non-Final Office Action notified Oct. 5, 2023 for U.S. Appl. No. 17/229,754. [cited by applicant]
Non-Final Office Action notified Oct. 6, 2022 for U.S. Appl. No. 17/472,325. [cited by applicant]
Non-Final Office Action notified Sep. 6, 2023 for Taiwan Patent Application No. 112127062 [cited by applicant]
Non-Final Office Action notified Sep. 15, 2023 for U.S. Appl. No. 17/408,326. [cited by applicant]
Non-Final Office Action notified Sep. 26, 2022 for U.S. Appl. No. 17/390,829. [cited by applicant]
Notice of Allowance notified Apr. 13, 2023 for U.S. Appl. No. 17/478,841. [cited by applicant]
Notice of Allowance notified Apr. 24, 2024 for U.S. Appl. No. 17/229,743. [cited by applicant]
Notice of Allowance notified Apr. 24, 2024 for U.S. Appl. No. 17/229,754. [cited by applicant]
Notice of Allowance notified Feb. 7, 2024 for U.S. Appl. No. 17/408,323. [cited by applicant]
Notice of Allowance notified Feb. 22, 2024 for U.S. Appl. No. 17/472,330. [cited by applicant]
Notice of Allowance notified Feb. 29, 2024 for U.S. Appl. No. 17/408,326. [cited by applicant]
Notice of Allowance notified Jan. 8, 2024 for Taiwan Patent Application No. 112127062. [cited by applicant]
Notice of Allowance notified Jul. 12, 2023 for U.S. Appl. No. 16/823,209. [cited by applicant]
1st Office Action & Search Report notified Dec. 9, 2020, for Taiwan Patent Application No. 109106755. [cited by applicant]
Advisory Action notified Mar. 3, 2021 for U.S. Appl. No. 16/357,265. [cited by applicant]
Advisory Action notified Mar. 3, 2021 for U.S. Appl. No. 16/357,272. [cited by applicant]
Application and Figures as filed for U.S. Appl. No. 17/129,842, filed Dec. 21, 2020. [cited by applicant]
Application and Figures as filed for U.S. Appl. No. 17/327,614, filed May 21, 2021. [cited by applicant]
Application and Figures as filed for U.S. Appl. No. 17/327,648, filed May 21, 2021. [cited by applicant]
Application and Figures as filed for U.S. Appl. No. 17/384,626, filed Jul. 28, 2021. [cited by applicant]
Decision of Rejection notified May 18, 2021 for Taiwan Patent Application No. 109106755. [cited by applicant]
Final Office Action notified Dec. 28, 2020 for U.S. Appl. No. 16/357,265. [cited by applicant]
Final Office Action notified Dec. 31, 2020 for U.S. Appl. No. 16/357,272. [cited by applicant]
International Preliminary Report on Patentability notified Dec. 9, 2021 for PCT Patent Application No. PCT/US2020/032974. [cited by applicant]
International Preliminary Report on Patentability notified Sep. 30, 2021 for PCT Patent Application No. PCT/US2020/018875. [cited by applicant]
International Search Report & Written Opinion notified Jun. 11, 2020 for PCT Patent Application No. PCT/US2020/018875. [cited by applicant]
International Search Report & Written Opinion notified Sep. 1, 2020 for PCT Patent Application No. PCT/US2020/032974. [cited by applicant]
Jun, H. et al., “HBM (High Bandwidth Memory) DRAM Technology and Architecture,” 2017 IEEE International Memory Workshop (IMW), Monterey, CA, 2017, pp. 1-4. [cited by applicant]
Kim, J. et al., “A 1.2 V 12.8 GB/s 2 GB Mobile Wide-I/O DRAM With 4$\times$128 I/Os Using TSV Based Stacking”, IEEE Journal of Solid-State Circuits, vol. 47, No. 1, pp. 107-116, Jan. 2012. [cited by applicant]
Lee, D et al., “A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV”, 2014 IEEE International Solid-State Circuits Conference Digest… [cited by applicant]
Macri, “AMD's next generation GPU and high bandwidth memory architecture: FURY”, 2015 IEEE Hot Chips 27 Symposium (HCS), Cupertino, CA, 2015, pp. 1-26. [cited by applicant]
Non-Final Office Action notified Jul. 20, 2020 for U.S. Appl. No. 16/357,272. [cited by applicant]
Non-Final Office Action notified Jul. 22, 2020 for U.S. Appl. No. 16/357,265. [cited by applicant]
Non-Final Office Action notified Mar. 22, 2021 for U.S. Appl. No. 16/357,265. [cited by applicant]
Non-Final Office Action notified Mar. 23, 2021 for U.S. Appl. No. 16/357,272. [cited by applicant]
Non-Final Office Action notified Sep. 3, 2020 for U.S. Appl. No. 16/428,885. [cited by applicant]
Non-Final Office Action notified Sep. 3, 2020 for U.S. Appl. No. 16/428,893. [cited by applicant]
Notice of Allowance notified Feb. 22, 2021 for U.S. Appl. No. 16/428,885. [cited by applicant]
Notice of Allowance notified Jul. 9, 2021 for U.S. Appl. No. 16/428,893. [cited by applicant]
Notice of Allowance notified Jul. 22, 2021 for U.S. Appl. No. 16/357,265. [cited by applicant]
Notice of Allowance notified Jul. 22, 2021 for U.S. Appl. No. 16/357,272. [cited by applicant]
Pugsley et al., “NDC: Analyzing the impact of 3D-stacked memory+logic devices on MapReduce workloads”, 2014 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS), Monterey, CA, 2014, pp. … [cited by applicant]
Restriction Requirement notified Apr. 3, 2020 for U.S. Appl. No. 16/428,885. [cited by applicant]
Restriction Requirement notified Apr. 3, 2020 for U.S. Appl. No. 16/428,893. [cited by applicant]
Restriction Requirement notified Dec. 13, 2019 for U.S. Appl. No. 16/357,265. [cited by applicant]
Restriction Requirement notified Jan. 2, 2020 for U.S. Appl. No. 16/357,272. [cited by applicant]
Shulaker et al., “Monolithic 3D integration of logic and memory: Carbon nanotube FETs, resistive RAM, and silicon FETs”, 2014 IEEE International Electron Devices Meeting, San Francisco, CA, 2014, pp. 27.4.1-27.4.4. [cited by applicant]
Sun et al., “A novel architecture of the 3D stacked MRAM L2 cache for CMPs”, 2009 IEEE 15th International Symposium on High Performance Computer Architecture, Raleigh, NC, 2009, pp. 239-249. [cited by applicant]
Woo et al., “An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth”, HPCA—16 2010 The Sixteenth International Symposium on High-Performance Computer Architecture, Bangalore, 201… [cited by applicant]
Yu, “Wafer level system integration for SiP”, 2014 IEEE International Electron Devices Meeting, San Francisco, CA, 2014, pp. 27.1.1-27.1.4. [cited by applicant]
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