Process for hot application of a silylated adhesive composition
The invention relates to a process for hot application of an adhesive composition ( 80 ) on a support ( 96 ), by means of a system comprising: a nozzle ( 50 ) for applying the adhesive composition ( 80 ), a line ( 88 ) for supplying the nozzle ( 50 ) with the adhesive composition ( 80 ) to be applied in fluid form, a mixer ( 30 ) positioned in the line ( 88 ) for the homogeneous mixture of the main components of the adhesive composition before its application; the applied adhesive composition ( 80 ) including as main components: a silylated prepolymer, a compatible tackifying resin; the adhesive composition comprising a cross-linking catalyst; the process comprising: supplying the line ( 88 ) with the silylated prepolymer separated from the cross-linking catalyst, the mixing of the cross-linking catalyst with the main components by means of the mixer ( 30 ), the hot application of the mixed adhesive composition ( 80 ) onto a support ( 96 ).
1. A process for hot application of an adhesive composition on a support comprising employing a hot application system comprising:
an application nozzle applying the adhesive composition,
a supply line supplying the application nozzle with the adhesive composition to be applied in fluid form,
a dynamic mixer positioned in the supply line homogeneously mixing main components of the adhesive composition before its application;
the applied adhesive composition including as main components:
from 20% to 85% by weight of silylated pre-polymer,
from 15 to 80% by weight of compatible tackifying resin;
the adhesive composition further comprising from 0.01 to 3% by weight of cross-linking catalyst;
the process comprising:
supplying the supply line with said at least silylated prepolymer, separate from the cross-linking catalyst,
injecting the cross-linking catalyst into the at least silylated prepolymer at the mixer;
mixing the cross-linking catalyst with the main components in the mixer,
applying the mixed adhesive composition on a support by the application nozzle at a temperature comprised between 50° C. and 140° C.,
wherein the conversion rate of the cross-linking reaction for the adhesive composition in the hot application system is less than or equal to 30%, and
wherein the silylated pre-polymer is heated upstream from its mixing point with the cross-linking catalyst in the mixer.
2. The hot application process according to claim 1 , wherein, upon supplying the supply line, the cross-linking catalyst is separated from the whole of the main components of the adhesive composition.
3. The hot application process according to claim 1 , wherein the mixer includes an electrically conducting material, the hot application system comprising an in-line heating device, upstream from the mixing point of the cross-linking catalyst with the main components and including the mixer and an inductive cable surrounding the mixer, the process comprising, prior to the hot application, heating of the adhesive composition up to the application temperature, by electrically powering the inductive cable of the in-line heating device.
4. The hot application process according to claim 1 , wherein the adhesive composition to be applied comprises a reactive prepolymer which cross-links in a temperature range, the adhesive composition to be applied having an application temperature range included in the cross-linking temperature range.
5. The hot application process according to claim 1 , wherein the adhesive composition to be applied cross-links with humidity.
6. The hot application process according to claim 1 , wherein the system comprises a heater able to be positioned at a storage reservoir comprising at least one of the separate main components for raising said at least one main component to a pumping temperature.
7. The hot application process according to claim 6 , wherein said at least one separate main component is raised to a pumping temperature comprised between 50° C. and 140° C.
8. The hot application process according to claim 6 , wherein said at least one separate main component is raised to a pumping temperature comprised between 80° C. and 120° C.
9. The hot application process according to claim 6 , wherein said at least one separate main component is raised to a pumping temperature comprised between 100° C. and 110° C.
10. The hot application process according to claim 1 , wherein the adhesive composition is applied at a temperature comprised between 80° C. and 120° C.
11. The hot application process according to claim 1 , wherein the adhesive composition is applied at a temperature comprised between 100° C. and 110° C.
12. The hot application process according to claim 1 , wherein the hot application system comprises an in-line heating device.
13. The hot application process according to claim 12 , wherein the flow rate of the adhesive composition in the in-line heating device is between 80 g·s −1 and 170 g·s −1 .
14. The hot application process according to claim 1 , wherein the conversion rate of the cross-linking reaction for the adhesive composition in the hot application system is less than or equal to 10%.