Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.
1. An apparatus, comprising:
an optical element comprising an optical trace and a first dielectric bonding surface;
a first die comprising a second dielectric bonding surface bonded to the first dielectric bonding surface, and wherein the first die is made at least in part of a semiconductor material;
a second die comprising a third dielectric bonding surface bonded to the first dielectric bonding surface, the optical trace providing optical communication between the first and second dies;
a first dielectric direct bond between the first dielectric bonding surface and the first die; and
a second dielectric direct bond between the first dielectric bonding surface and the second die.
2. The apparatus of claim 1 , wherein the first dielectric direct bond comprises an oxide-to-oxide bond formed at room temperature or at a temperature near or below room temperature.
3. The apparatus of claim 1 , wherein the optical trace comprises one of an optically transparent material, a photonic material, or a semiconductor material, and the first dielectric direct bond is optically transparent, at least in part.
4. The apparatus of claim 1 , wherein the optical trace transmits a light or an electromagnetic radiation between the first die and the second die.
5. The apparatus of claim 4 , wherein the optical trace is direct oxide bonded to the first die and to the second die.
6. The apparatus of claim 4 , wherein the optical trace provides an optical path between the first die and the second die in an absence of an optical coupler.
7. The apparatus of claim 1 , wherein the optical trace comprises a rib member of an optical waveguide, the rib member direct bonded to the first die to make the optical waveguide, wherein the optical waveguide comprises the rib member, the first dielectric direct bond, and the semiconductor material of the first die.
8. The apparatus of claim 1 , wherein the optical trace comprises a rib member of an optical waveguide, the rib member direct bonded to a substrate, wherein the substrate is at least partly optically transparent, and wherein the optical waveguide comprises the rib member, the first dielectric direct bond, and the substrate.
9. The apparatus of claim 1 , wherein the optical trace is direct bonded to a substrate and to multiple dies, and wherein the optical trace provides a continuous waveguide, an optical bus, and an unbroken optical pathway between the multiple dies.
10. The apparatus of claim 1 , wherein the optical trace is bonded to the first die, and the first die comprises an optoelectronic chip comprising an optical conduit.
11. The apparatus of claim 10 , wherein a composition of an inner core of the optical conduit is selected from a group consisting of Si, ZrO 2 , HfO 2 , TiO 2 , LiNbO 3 , Nb 2 O 5 , SrTiO 3 , and ZnS.
12. The apparatus of claim 1 , further comprising a second optical trace bonded to the first die.
13. The apparatus of claim 1 , wherein the optical trace is formed in an optically-enabled interposer.
14. The apparatus of claim 1 , wherein the optical trace comprises a rectangular waveguide.
15. The apparatus of claim 1 , wherein the optical element is an interposer.
16. The apparatus of claim 1 , wherein the first die is bonded to the optical trace at a first side of the optical element, and wherein the second die is bonded to the optical trace at the first side of the optical element.
17. The apparatus of claim 1 , further comprising a first set of electrical contacts at a first side of the optical element, a second set of electrical contacts at a second side of the first die, and at least one direct bond between the first set of electrical contacts and the second set of electrical contacts.