Forksheet transistor with asymmetric dielectric spine
Techniques are provided herein to form a forksheet transistor device with a dielectric overhang structure. The dielectric overhang structure includes a dielectric layer that at least partially hangs over the nanoribbons of each semiconductor device in the forksheet transistor and is directly coupled to, or is an integral part of, the dielectric spine between the semiconductor devices. The overhang structure allows for a higher alignment tolerance when forming different work function metals over each of the different semiconductor devices, which in turn allows for narrower dielectric spines to be used. A first gate structure that includes a first work function metal may be formed around the nanoribbons of the n-channel device and a second gate structure that includes a second work function metal may be formed around the nanoribbons of the p-channel device in the forksheet arrangement.
1 . An integrated circuit comprising:
a first semiconductor device having a first semiconductor material extending in a first direction between a first source region and a first drain region;
a second semiconductor device having a second semiconductor material extending in the first direction between a second source region and a second drain region;
a dielectric spine between the first semiconductor material and the second semiconductor material, such that the dielectric spine contacts both the first semiconductor material and the second semiconductor material;
an overhang structure comprising a dielectric material that is an integral part of the dielectric spine, the overhang structure being over an entire width of both the first semiconductor material and the second semiconductor material along a second direction orthogonal to the first direction;
a first gate structure around the first semiconductor material;
a second gate structure around the second semiconductor material;
wherein the first gate structure comprises a first work function metal and the second gate structure comprises a second work function metal elementally different from the first work function metal; and
wherein at least a portion of the first work function metal and at least a portion of the second work function metal contact the overhang structure.
2 . The integrated circuit of claim 1 , wherein the first semiconductor material comprises a first set of one or more semiconductor nanoribbons and the second semiconductor material comprises a second set of one or more semiconductor nanoribbons.
3 . The integrated circuit of claim 1 , wherein the first semiconductor material comprises n-type dopants and the second semiconductor material comprises p-type dopants.
4 . The integrated circuit of claim 1 , wherein the dielectric spine and the overhang structure includes silicon and oxygen.
5 . The integrated circuit of claim 1 , wherein the dielectric spine has a width extending between the first semiconductor material and the second semiconductor material of about 10 nm to about 20 nm.
6 . A printed circuit board comprising the integrated circuit of claim 1 .
7 . An electronic device, comprising:
a chip package comprising one or more dies, at least one of the one or more dies comprising
a first semiconductor device having a first semiconductor material extending in a first direction between a first source region and a first drain region;
a second semiconductor device having a second semiconductor material extending in the first direction between a second source region and a second drain region;
a dielectric spine between the first semiconductor material and the second semiconductor material, such that the dielectric spine contacts both the first semiconductor material and the second semiconductor material;
an overhang structure comprising a dielectric material that is an integral part of the dielectric spine, the overhang structure being over an entire width of both the first semiconductor material and the second semiconductor material along a second direction orthogonal to the first direction;
a first gate structure around the first semiconductor material;
a second gate structure around the second semiconductor material;
wherein the first gate structure comprises a first work function metal and the second gate structure comprises a second work function metal elementally different from the first work function metal; and
wherein at least a portion of the first work function metal and at least a portion of the second work function metal contact the overhang structure.
8 . The electronic device of claim 7 , wherein the first semiconductor material comprises a first plurality of semiconductor nanoribbons and the second semiconductor material comprises a second plurality of semiconductor nanoribbons.
9 . The electronic device of claim 7 , wherein the first semiconductor material comprises n-type dopants and the second semiconductor material comprises p-type dopants.
10 . The electronic device of claim 7 , wherein the dielectric spine and the overhang structure includes silicon and oxygen.
11 . The electronic device of claim 7 , wherein the dielectric spine has a width extending between the first semiconductor material and the second semiconductor material of about 10 nm to about 20 nm.
12 . The electronic device of claim 7 , wherein the overhang structure has a thickness between about 5 nm and about 20 nm, and a lateral width that is at least 1.5 times greater than a lateral width of the dielectric spine.
13 . The electronic device of claim 7 , further comprising a printed circuit board, wherein the chip package is attached to the printed circuit board.
14 . An integrated circuit comprising:
a first semiconductor device having a first semiconductor material extending in a first direction from a first source or drain region;
a second semiconductor device having a second semiconductor material extending in the first direction from a second source or drain region;
a dielectric spine between the first semiconductor material and the second semiconductor material, such that the dielectric spine extends an entire distance along a second direction, orthogonal to the first direction, between the first semiconductor material and the second semiconductor material;
an overhang structure comprising a dielectric material, the overhang structure being over an entire width of both the first semiconductor material and the second semiconductor material along a second direction orthogonal to the first direction;
a first gate structure around the first semiconductor material;
a second gate structure around the second semiconductor material;
wherein the first gate structure comprises a first work function metal and the second gate structure comprises a second work function metal elementally different from the first work function metal; and
wherein at least a portion of the first work function metal and at least a portion of the second work function metal contact the overhang structure.
15 . The integrated circuit of claim 14 , wherein the first semiconductor material comprises a first set of one or more semiconductor nanoribbons and the second semiconductor material comprises a second set of one or more semiconductor nanoribbons.