IP Library › Granted Patent US 12,300,674
Granted Patent B2
US 12,300,674 · App. 17/615,446 · Granted May 13, 2025

Optoelectronic device

Inventors: Michael Brandl (Mintraching, DE); Andreas Dobner (Wenzenbach, DE); Matthias Goldbach (Pentling, DE); Sebastian Wittmann (Regenstauf, DE); Uli Hiller (Bad Abbach, DE); Markus Klein (Tegernheim, DE); Thomas Schwarz (Regensburg, DE); Andreas Waldschik (Wolmirstedt OT Elbeu, DE); Michael Wittmann (Alteglofsheim, DE); Matthias Bruckschloegl (Regensburg, DE); Stefan Groetsch (Bad Abbach, DE); Rainer Huber (Bad Abbach, DE); Peter Brick (Regensburg, DE); Ludwig Hofbauer (Regenstauf, DE)
Assignee: OSRAM Opto Semiconductors GmbH
H01L25/0756H10H20/856B60K35/00H10H20/882
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,300,674
App. No.
17/615,446
Granted
May 13, 2025
Kind
B2
Abstract

An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

Claims (45)

1. An optoelectronic device, in particular an at least semi-transparent pane for a vehicle, comprising:

a cover layer;

a carrier layer; and

an intermediate layer between the cover layer and the carrier layer;

wherein at least one and preferably a plurality of optoelectronic light sources is arranged on the intermediate layer and is at least partially exposed through at least one surface of the intermediate layer;

wherein the intermediate layer is adapted such that at least a portion of light emitted by the optoelectronic light sources spreads into and along the intermediate layer and exits the intermediate layer within a pre-set distance to the respective optoelectronic light source in one or more of a first direction through the cover layer or a second direction through the carrier layer;

wherein a first refractive index of the intermediate layer is larger than a second refractive index of the cover layer and of the carrier layer, or of an adhesive covering the intermediate layer; and

wherein one or more of dispersive structures, scattering structures, or reflective structures are arranged on the intermediate layer and are at least partially exposed through at least one surface of the intermediate layer.

2. The optoelectronic device according to claim 1 , wherein the light which spreads in and along the intermediate layer exits the intermediate layer within a pre-set angle of view, in particular almost perpendicular to the intermediate layer.

3. The optoelectronic device according to claim 1 , wherein the intermediate layer comprises or consists of a foil, which is laminated or fixed by an adhesive at the cover layer and/or at the carrier layer.

4. The optoelectronic device according to claim 1 , wherein the refractive index of the intermediate layer is larger than the refractive index of material adjacent to the intermediate layer.

5. The optoelectronic device according to claim 1 , wherein the dispersive or scattering structures are diffusion and/or scattering centers.

6. The optoelectronic device according to claim 5 , wherein a diffusion concentration of the diffusion centers is pre-set such that the mean free path length of light is larger than the thickness of the intermediate layer.

7. The optoelectronic device according to claim 1 , wherein the dispersive or scattering structures are formed in the intermediate layer as transparent particles, white particles, holes, density modifications, or air bubbles, in particular comprising sizes smaller than the emitted light wavelengths, in particular around or smaller than 2 μm.

8. The optoelectronic device according to claim 1 , wherein the dispersive or scattering structures are formed at the intermediate layer as structured areas, in particularly structured by stamping, printing, and/or by applying laser light.

9. The optoelectronic device according to claim 1 , wherein the reflective structures are formed close to a respective optoelectronic light source.

10. The optoelectronic device according to claim 1 , wherein the reflective structures are formed at a surface of the cover layer and/or at a surface of the carrier layer.

11. The optoelectronic device according to claim 1 , wherein the reflective structures are formed outside of the cover layer and/or outside of the carrier layer.

12. The optoelectronic device according to claim 1 , wherein the reflective structures are mirrors and/or metal coatings and/or dielectric coatings.

13. The optoelectronic device according to claim 1 , wherein the reflective structures directly cover at least one of the main surfaces of an optoelectronic light source.

14. The optoelectronic device according to claim 1 , wherein the device comprises, between the cover layer and the carrier layer, one or more combinations of an inside cover layer and an inside intermediate layer.

15. The optoelectronic device according to claim 14 , wherein optoelectronic light sources of each combination emits a selected colour, in particular at least one of red, green, and blue.

16. The optoelectronic device according to claim 14 , wherein light emitted by each optoelectronic light source at least partially spreads in and along the intermediate layer and exits the intermediate layer at a pre-set distance to the respective optoelectronic light source, wherein a dispersive or scattering structure, in particular with diffusion centers, transparent particles and/or white particles, is arranged on the inside of each intermediate layer.

17. The optoelectronic device according to claim 16 , wherein the dispersive or scattering structures form different two-dimensional indicator areas, in particular uniform symbols, colors, and/or animations.

18. The optoelectronic device according to claim 16 , wherein the dispersive structures of the intermediate layers are staggered along the intermediate layers.

19. The optoelectronic device according to claim 1 , wherein for light spreading and/or light extraction a converter material is integrated into the intermediate layer.

20. The optoelectronic device according to claim 1 , wherein the optoelectronic light sources are smaller than 300 μm, in particular smaller than 150 μm and/or the device includes electrical conductor paths which are made of at least one transparent material and/or which comprise widths smaller than 300 μm, in particular smaller than 150 μm.

21. The optoelectronic device according to claim 1 ,

wherein the device is a vehicle window, a cover of a vehicle lamp, a cover of a vehicle signal light, a mirror glass or an element of a car body lighting; and/or

the cover layer and/or the carrier layer and/or the intermediate layer is made of glass or another transparent material including methacrylate (PMMA) or polycarbonate (PC) or polyvinyl butyral (PVB) or polyvinyl acetate (PVA) or polyethylene terephthalate (PET).

22. An optoelectronic device, in particular an at least semi-transparent pane for a vehicle, comprising:

a cover layer;

a carrier layer; and

an intermediate layer between the cover layer and the carrier layer;

wherein at least one and preferably a plurality of optoelectronic light sources, is arranged on the intermediate layer and is at least partially exposed through at least one surface of the intermediate layer;

wherein the intermediate layer is adapted such that at least a portion of light emitted by the optoelectronic light sources spreads into and along the intermediate layer and exits the intermediate layer within a pre-set distance to the respective optoelectronic light source in one or more of a first direction through the cover layer or a second direction through the carrier layer;

wherein, for one or more of light spreading or light extraction, a converter material is integrated into the intermediate layer;

wherein a first refractive index of the intermediate layer is larger than a second refractive index of the cover layer and of the carrier layer, or of an adhesive covering the intermediate layer; and

wherein one or more of dispersive structures, scattering structures, or reflective structures are arranged on the intermediate layer and are at least partially exposed through at embedded in the intermediate layer.

23. A method of manufacturing of an optoelectronic device, in particular an at least semi-transparent pane, comprising:

arranging at least one and preferably a plurality of optoelectronic light sources on an intermediate layer;

exposing, at least partially, the at least one and preferably the plurality of optoelectronic light sources through at least one surface of the intermediate layer; and

arranging the intermediate layer between a cover layer and a carrier layer;

wherein a first refractive index of the intermediate layer is larger than a second refractive index of the cover layer and of the carrier layer, or of an adhesive covering the intermediate layer; and

wherein one or more of dispersive structures, scattering structures, or reflective structures are arranged on the intermediate layer and are at least partially exposed through at least one surface of the intermediate layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2022
From: BRANDL, MICHAEL; DOBNER, ANDREAS; GOLDBACH, MATTHIAS; WITTMANN, SEBASTIAN; HILLER, ULI; KLEIN, MARKUS; SCHWARZ, THOMAS; WALDSCHIK, ANDREAS; WITTMANN, MICHAEL; BRUCKSCHLOEGL, MATTHIAS; GROETSCH, STEFAN; HUBER, RAINER; BRICK, PETER; HOFBAUER, LUDWIG
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 059372/0632 →
Priority Claims (12)
DE 10 2019 133 451.9 · Dec 6, 2019 · national
DK PA202070103 · Feb 21, 2020 · national
DE 10 2020 114 478.4 · May 29, 2020 · national
DE 10 2020 114 482.2 · May 29, 2020 · national
DE 10 2020 114 483.0 · May 29, 2020 · national
DE 10 2020 114 670.1 · Jun 2, 2020 · national
DE 10 2020 116 479.3 · Jun 23, 2020 · national
DE 10 2020 117 104.8 · Jun 29, 2020 · national
DE 10 2020 125 429.6 · Sep 29, 2020 · national
DE 10 2020 125 433.4 · Sep 29, 2020 · national
DE 10 2020 127 194.8 · Oct 15, 2020 · national
DE 10 2020 127 204.9 · Oct 15, 2020 · national
Continuity (1)
Related Publication 20220238497A1 · Jul 28, 2022
References Cited (128)
US 8474860B2 · Ohoka et al. · 2013 [cited by applicant]
US 8924076B2 · Boote et al. · 2014 [cited by applicant]
US 9806281B2 · Domercq et al. · 2017 [cited by applicant]
US 10395589B1 · Vahid Far et al. · 2019 [cited by applicant]
US 11479023B2 · Berard · 2022 [cited by examiner]
US 11569411B2 · Volpert · 2023 [cited by applicant]
US 11682607B2 · We et al. · 2023 [cited by applicant]
US 12040317B2 · Brandl et al. · 2024 [cited by applicant]
US 20020118321A1 · Ge · 2002 [cited by applicant]
US 20020140629A1 · Sundahl · 2002 [cited by applicant]
US 20020149312A1 · Roberts et al. · 2002 [cited by applicant]
US 20040185195A1 · Anderson et al. · 2004 [cited by applicant]
US 20050238857A1 · Day · 2005 [cited by applicant]
US 20050253244A1 · Chang · 2005 [cited by applicant]
US 20060116046A1 · Morley et al. · 2006 [cited by applicant]
US 20060275599A1 · Lefevre · 2006 [cited by applicant]
US 20070014469A1 · Paillet et al. · 2007 [cited by applicant]
US 20090021181A1 · Brune et al. · 2009 [cited by applicant]
US 20090103298A1 · Boonekamp et al. · 2009 [cited by applicant]
US 20090114928A1 · Messere et al. · 2009 [cited by applicant]
US 20090231882A1 · Lin et al. · 2009 [cited by applicant]
US 20090279295A1 · Van Der Poel · 2009 [cited by applicant]
US 20100060821A1 · Petersen et al. · 2010 [cited by applicant]
US 20100140655A1 · Shi · 2010 [cited by applicant]
US 20100176705A1 · Van Herpen et al. · 2010 [cited by applicant]
US 20110006316A1 · Ing et al. · 2011 [cited by applicant]
US 20110127552A1 · Van Herpen et al. · 2011 [cited by applicant]
US 20110317417A1 · Gourlay · 2011 [cited by examiner]
US 20130016494A1 · Speier et al. · 2013 [cited by applicant]
US 20140091326A1 · Tran et al. · 2014 [cited by applicant]
US 20140096893A1 · Veerasamy · 2014 [cited by applicant]
US 20140234578A1 · Decraye et al. · 2014 [cited by applicant]
US 20150239399A1 · Tonar · 2015 [cited by examiner]
US 20150253486A1 · Verger et al. · 2015 [cited by applicant]
US 20150301175A1 · Rao et al. · 2015 [cited by applicant]
US 20150308639A1 · Keranen et al. · 2015 [cited by applicant]
US 20160154170A1 · Thompson et al. · 2016 [cited by applicant]
US 20160313587A1 · Linthout et al. · 2016 [cited by applicant]
US 20170005077A1 · Kim et al. · 2017 [cited by applicant]
US 20170212633A1 · You et al. · 2017 [cited by applicant]
US 20170301282A1 · Rotzoll et al. · 2017 [cited by applicant]
US 20170309698A1 · Bower et al. · 2017 [cited by applicant]
US 20170373268A1 · Takahashi et al. · 2017 [cited by applicant]
US 20180141487A1 · Osumi et al. · 2018 [cited by applicant]
US 20180301594A1 · Bouvier et al. · 2018 [cited by applicant]
US 20180311935A1 · Sahyoun et al. · 2018 [cited by applicant]
US 20180323180A1 · Cok · 2018 [cited by applicant]
US 20180343741A1 · Williams et al. · 2018 [cited by applicant]
US 20180345631A1 · Klein et al. · 2018 [cited by applicant]
US 20180370195A1 · Laluet · 2018 [cited by examiner]
US 20180374834A1 · Tada et al. · 2018 [cited by applicant]
US 20190001629A1 · Laluet · 2019 [cited by applicant]
US 20190016095A1 · Labrot et al. · 2019 [cited by applicant]
US 20190019968A1 · He et al. · 2019 [cited by applicant]
US 20190096864A1 · Huitema et al. · 2019 [cited by applicant]
US 20190134952A1 · Varanasi · 2019 [cited by examiner]
US 20190160792A1 · Weber · 2019 [cited by applicant]
US 20190172970A1 · Dupont et al. · 2019 [cited by applicant]
US 20190179458A1 · Weber et al. · 2019 [cited by applicant]
US 20190193376A1 · Bauerle · 2019 [cited by examiner]
US 20190248122A1 · Gillessen et al. · 2019 [cited by applicant]
US 20190255813A1 · Bauerle et al. · 2019 [cited by applicant]
US 20190279558A1 · Monestier et al. · 2019 [cited by applicant]
US 20190299852A1 · Bauerle · 2019 [cited by examiner]
US 20190377125A1 · Liu et al. · 2019 [cited by applicant]
US 20200006456A1 · Zhang et al. · 2020 [cited by applicant]
US 20200012848A1 · Goto · 2020 [cited by applicant]
US 20200144228A1 · Brick et al. · 2020 [cited by applicant]
US 20200269815A1 · Day · 2020 [cited by applicant]
US 20200350361A1 · Tao et al. · 2020 [cited by applicant]
US 20220238497A1 · Brandl et al. · 2022 [cited by applicant]
CN 1675446A · 2005 [cited by applicant]
CN 108877521A · 2018 [cited by applicant]
CN 109801568A · 2019 [cited by applicant]
DE 102007039416A1 · 2009 [cited by applicant]
DE 102012213343A1 · 2014 [cited by applicant]
DE 102013102003A1 · 2014 [cited by applicant]
DE 202015009229U1 · 2017 [cited by applicant]
DE 102017122852A · 2019 [cited by applicant]
DE 102018119376A1 · 2020 [cited by applicant]
DE 112018003398T5 · 2020 [cited by applicant]
EP 1760784A2 · 2007 [cited by applicant]
EP 1886804A1 · 2008 [cited by applicant]
EP 2412521A1 · 2012 [cited by applicant]
EP 2760108A1 · 2014 [cited by applicant]
EP 3264241A1 · 2018 [cited by applicant]
EP 3264242A1 · 2018 [cited by applicant]
FR 3044972A1 · 2017 [cited by applicant]
JP 08130330A · 1996 [cited by applicant]
JP 10240172A · 1998 [cited by applicant]
JP 2001022300A · 2001 [cited by applicant]
JP 2003337556A · 2003 [cited by applicant]
JP 2004327955A · 2004 [cited by applicant]
JP 2005310751A · 2005 [cited by applicant]
JP 2005534612A · 2005 [cited by applicant]
JP 2007073734A · 2007 [cited by applicant]
JP 2009512977A · 2009 [cited by applicant]
JP 2009535798A · 2009 [cited by applicant]
JP 2010520627A · 2010 [cited by applicant]
JP 2010170969A · 2010 [cited by applicant]
JP 2012195404A · 2012 [cited by applicant]
JP 2014060320A · 2014 [cited by applicant]
JP 2015084374A · 2015 [cited by applicant]
JP 2016167451A · 2016 [cited by applicant]
JP 2017212384A · 2017 [cited by applicant]
JP 2019009192A · 2019 [cited by applicant]
JP 2019134025A · 2019 [cited by applicant]
JP 2020017730A · 2020 [cited by applicant]
KR 1020140071796A · 2014 [cited by applicant]
WO 2007093823A1 · 2007 [cited by applicant]
WO 2008058881A1 · 2008 [cited by applicant]
WO 2009087584A1 · 2009 [cited by applicant]
WO 2009125918A2 · 2009 [cited by applicant]
WO 2011158185A1 · 2011 [cited by applicant]
WO 2012036081A1 · 2012 [cited by applicant]
WO 2014141019A1 · 2014 [cited by applicant]
WO 201478942A1 · 2014 [cited by applicant]
WO 2016095117A1 · 2016 [cited by applicant]
WO 2018025051A1 · 2018 [cited by applicant]
WO 2019008493A1 · 2019 [cited by applicant]
WO 2019146634A1 · 2019 [cited by applicant]
WO 2019026858A1 · 2019 [cited by applicant]
WO 2019091728A1 · 2019 [cited by applicant]
WO 2019160199A1 · 2019 [cited by applicant]
WO 2019186513A1 · 2019 [cited by applicant]
WO 2020050062A1 · 2020 [cited by applicant]
WO 2020071815A1 · 2020 [cited by applicant]
International Search Report and Written Opinion issued in International Patent Application No. PCT/EP2020/080474 on Apr. 13, 2021. [cited by applicant]
Cited By (1)
US 12,736,733