Flexible display panel and manufacturing method thereof
View Patent ↗A flexible display panel and a manufacturing method thereof are disclosed. The method includes: forming a photodeformable layer on a carrier board; forming a flexible substrate on a side of the photodeformable layer away from the carrier board; forming a light-emitting device layer on a side of the flexible substrate away from the photodeformable layer; and irradiating the photodeformable layer with light having a predetermined wavelength until the photodeformable layer is deformed and is separated from the carrier board, thereby obtaining the flexible display panel.
1. A method of manufacturing a flexible display panel, comprising following steps:
forming a photodeformable layer on a carrier board;
pretreating the photodeformable layer with light having a predetermined wavelength until the photodeformable layer is attached to the carrier board, thereby obtaining a pretreated photodeformable layer;
forming a flexible substrate on a side of the pretreated photodeformable layer away from the carrier board;
forming a light-emitting device layer on a side of the flexible substrate away from the pretreated photodeformable layer; and
irradiating the pretreated photodeformable layer with light having a predetermined wavelength until the pretreated photodeformable layer is deformed and is separated from the carrier board, thereby obtaining the flexible display panel.
2. The method of claim 1 , wherein adhesion between the pretreated photodeformable layer and the carrier board is greater than or equal to 0.01 N/cm and is less than or equal to 0.5 N/cm.
3. The method of claim 1 , wherein the predetermined wavelength is greater than or equal to 300 nm and is less than or equal to 400 nm.
4. The method of claim 1 , wherein the photodeformable layer comprises a light-curing material or a light-foaming material.
5. The method of claim 1 , wherein the step of forming the flexible substrate on the side of the pretreated photodeformable layer away from the carrier board comprises following steps:
forming a first inorganic layer on the pretreated photodeformable layer;
forming an organic layer on the first inorganic layer; and
forming a second inorganic layer on the organic layer.
6. The method of claim 1 , wherein the step of irradiating the pretreated photodeformable layer with light having the predetermined wavelength until the pretreated photodeformable layer is deformed and is separated from the carrier board comprises a following step:
irradiating the pretreated photodeformable layer with light having the predetermined wavelength from the side of the pretreated photodeformable layer away from the carrier board.
7. The method of claim 1 , wherein a thickness of the photodeformable layer ranges from 0.5 μm to 1 μm.
8. A flexible display panel, comprising:
a supporting layer,
a release layer disposed on the supporting layer, wherein the release layer is a layer formed from a photodeformable layer being cured by UV light irradiation with a predetermined wavelength, the photodeformable layer comprises a light-curing material or a light-foaming material, the light-curing material comprises a mixture of an epoxy resin and a UV curing initiator, and the light-foaming material comprises a light-foaming polymer and a light-foaming agent;
a flexible substrate disposed on a side of the release layer away from the supporting layer; and
a light-emitting device layer disposed on a side of the flexible substrate away from the release layer.
9. The flexible display panel of claim 8 , wherein the flexible display panel comprises:
a first inorganic layer disposed on the side of the release layer away from the supporting layer;
an organic layer disposed on a side of the first inorganic layer away from the release layer; and
a second inorganic layer disposed on a side of the organic layer away from the first inorganic layer.
10. The flexible display panel of claim 9 , wherein a thickness of the first inorganic layer ranges from 5 nm to 50 nm.
11. The flexible display panel of claim 9 , wherein a material of the first inorganic layer comprises SiO x , SiN x , Al 2 O 3 , or a combination thereof.
12. The flexible display panel of claim 9 , wherein a thickness of the organic layer ranges from 5 μm to 20 μm.
13. The flexible display panel of claim 9 , wherein a material of the organic layer comprises polyimide.
14. The flexible display panel of claim 9 , wherein a thickness of the second inorganic layer ranges from 5 nm to 50 nm.
15. The flexible display panel of claim 9 , wherein a material of the second inorganic layer comprises SiO x , SiN x , Al 2 O 3 , or a combination thereof.
16. The flexible display panel of claim 8 , wherein the flexible display panel comprises:
a thin-film transistor (TFT) array layer, wherein the TFT array layer comprises a plurality of TFTs and is disposed between the flexible substrate and the light-emitting device layer.
17. The flexible display panel of claim 8 , wherein the predetermined wavelength is greater than or equal to 300 nm and is less than or equal to 400 nm.
18. A method of manufacturing a flexible display panel, comprising following steps:
forming a photodeformable layer on a carrier board;
forming a flexible substrate on a side of the photodeformable layer away from the carrier board;
forming a light-emitting device layer on a side of the flexible substrate away from the photodeformable layer; and
irradiating the photodeformable layer with light having a predetermined wavelength until the photodeformable layer is deformed and is separated from the carrier board, thereby obtaining the flexible display panel,
wherein the step of irradiating the pretreated photodeformable layer with light having the predetermined wavelength until the pretreated photodeformable layer is deformed and is separated from the carrier board comprises a following step:
irradiating the pretreated photodeformable layer with light having the predetermined wavelength from the side of the pretreated photodeformable layer away from the carrier board.