Thermal-conductive silicone composition
A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm 2 /s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.
1. A thermal-conductive silicone composition comprising:
(A) a crosslinked silicone gel comprising the following component (a) and component (b), wherein the component (A) is contained in an amount of 0.5 to 2.5 mass % relative to a total amount of the composition,
(a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm 2/ s or more, and
(b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule in such an amount that a ratio of the number of the SiH groups to a total number of the aliphatic unsaturated hydrocarbon groups in the component (a) ranges from 1 to 3;
(B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) and contained in an amount of 12.5 to 19.5 mass % relative to the total amount of the composition,
wherein R 1, s are identical to or different from one another, and each represent a monovalent hydrocarbon group having 1 to 10 carbon atoms but having no aliphatic unsaturated bond and optionally having a substituent, and “m” represents an integer of 5 to 100; and
(C) aluminum nitride particles having an average particle size of 0.5 μm or more and 1.5 μm or less and contained in an amount of 80 to 85 mass % relative to the total amount of the composition, wherein a content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more in a particle size distribution by laser diffraction.
2. The thermal-conductive silicone composition according to claim 1 , wherein “m” in the general formula (1) of the hydrolysable organopolysiloxane compound is in a range from 10 to 60.
3. The thermal-conductive silicone composition according to claim 2 , wherein the aluminum nitride particles have an oxygen content of 1.0 mass % or less.
4. The thermal-conductive silicone composition according to claim 3 , wherein the thermal-conductive silicone composition has an absolute viscosity of 500 Pa·S or less at 25° C.
5. The thermal-conductive silicone composition according to claim 2 , wherein the thermal-conductive silicone composition has an absolute viscosity of 500 Pa·S or less at 25° C.
6. The thermal-conductive silicone composition according to claim 1 , wherein the aluminum nitride particles have an oxygen content of 1.0 mass % or less.
7. The thermal-conductive silicone composition according to claim 6 , wherein the thermal-conductive silicone composition has an absolute viscosity of 500 Pa·S or less at 25° C.
8. The thermal-conductive silicone composition according to claim 1 , wherein the thermal-conductive silicone composition has an absolute viscosity of 500 Pa·S or less at 25° C.