Granted Patent B2

US 12,518,948 · App. 17/840,500 · Granted Jan 6, 2026

Inventors: Hanh Nguyen (San Jose, CA); Thai Cheng Chua (Cupertino, CA); Philip Allan Kraus (San Jose, CA)

Assignee: Applied Materials, Inc.

H01J37/32238H01J37/32201H01J37/32311H01J37/3244H01J37/32724H01J37/32935H01J2237/3321H01J2237/3323H01J2237/334H01J2237/335H01L21/6831

Abstract

Claims (13)

1 . A processing tool, comprising:

a processing chamber;

a chuck for supporting a substrate in the processing chamber, the chuck having a lateral width;

a dielectric window forming a portion of the processing chamber, the dielectric window continuous across an entirety of the lateral width of the chuck, and the dielectric window having a plurality of recesses therein; and

a plurality of modular high-frequency emission sources, each modular high-frequency emission source comprising:

an oscillator module;

an amplification module, wherein the amplification module is coupled to the oscillator module; and

an applicator, wherein the applicator is coupled to the amplification module, wherein the applicator is in a corresponding one of the plurality of recesses in the dielectric window, and wherein the applicator comprises:

a dielectric resonant cavity, wherein the dielectric resonant cavity is in contact with the dielectric window; and

a monopole antenna extending into the dielectric resonant cavity.

2 . The processing tool of claim 1 , wherein the dielectric window is planar.

3 . The processing tool of claim 1 , wherein the dielectric window is non-planar.

4 . The processing tool of claim 3 , wherein the dielectric window is domed shaped.

Assignments (1)

Continuity (2)

References Cited (116)