Vertical semiconductor device with improved ruggedness
A vertical semiconductor device includes one or more of a substrate, a buffer layer over the substrate, one or more drift layers over the buffer layer, and a spreading layer over the one or more drift layers.
1. A vertical semiconductor device comprising:
a substrate having a first doping type;
a drift layer on the substrate and having the first doping type and a graded doping profile; and
a spreading layer on the drift layer and having the first doping type, wherein the substrate, the spreading layer, and the drift layer comprise silicon carbide.
2. The vertical semiconductor device of claim 1 wherein the graded doping profile increases continuously through the drift layer from the spreading layer to the substrate.
3. The vertical semiconductor device of claim 2 wherein a doping profile of the spreading layer is uniform throughout the spreading layer.
4. The vertical semiconductor device of claim 3 wherein a maximum doping concentration of the spreading layer is higher than a maximum doping concentration of the drift layer.
5. The vertical semiconductor device of claim 1 wherein a doping concentration of the substrate is higher than a maximum doping concentration of the drift layer.
6. The vertical semiconductor device of claim 5 wherein a range of doping concentrations for the graded doping profile falls between 1×10 13 cm −3 and 1×10 18 cm −3 .
7. The vertical semiconductor device of claim 5 wherein a thickness of the drift layer is between 3 and 50 micrometers.
8. The vertical semiconductor device of claim 5 wherein there is no buffer layer between the substrate and the drift layer.
9. The vertical semiconductor device of claim 5 wherein:
the graded doping profile increases continuously through the drift layer from the spreading layer to the substrate;
a doping concentration of the spreading layer is uniform throughout the spreading layer;
a maximum doping concentration of the spreading layer is higher than the maximum doping concentration of the drift layer; and
there is no buffer layer between the substrate and the drift layer.
10. The vertical semiconductor device of claim 5 wherein a range of doping concentrations for the graded doping profile falls between 1×10 13 cm −3 and 5×10 18 cm −3 .
11. A vertical semiconductor device comprising:
a substrate having a first doping type;
a buffer layer on the substrate and having the first doping type;
a drift layer on the buffer layer and having the first doping type and a graded doping profile; and
a spreading layer on the drift layer and having the first doping type, wherein the substrate, the buffer layer, the spreading layer, and the drift layer comprise silicon carbide.
12. The vertical semiconductor device of claim 11 wherein the graded doping profile increases continuously through the drift layer from the spreading layer to the substrate.
13. The vertical semiconductor device of claim 12 wherein a doping concentration of the spreading layer is uniform throughout the spreading layer.
14. A vertical semiconductor device comprising:
a substrate having a first doping type;
a buffer layer on the substrate and having the first doping type;
a drift layer on the buffer layer and having the first doping type and a graded doping profile; and
a spreading layer on the drift layer and having the first doping type, wherein the substrate, the buffer layer, and the drift layer comprise silicon carbide,
wherein a maximum doping concentration of the spreading layer is higher than a maximum doping concentration of the drift layer, and
wherein a doping concentration of the substrate is higher than a doping concentration of the drift layer.
15. The vertical semiconductor device of claim 11 wherein a range of doping concentrations for the graded doping profile falls between 1×10 13 cm −3 and 1×10 17 cm −3 .
16. The vertical semiconductor device of claim 15 wherein a thickness of the drift layer is between 3 and 50 micrometers.
17. The vertical semiconductor device of claim 11 wherein:
the graded doping profile increases continuously through the drift layer from the spreading layer to the substrate;
a doping concentration of the spreading layer is uniform throughout the spreading layer; and
a maximum doping concentration of the spreading layer is higher than a maximum doping concentration of the drift layer.
18. The vertical semiconductor device of claim 11 wherein a doping concentration of the buffer layer is at least ten times an average doping concentration of the drift layer.
19. The vertical semiconductor device of claim 11 wherein a doping concentration of the buffer layer is between ten and thirty times an average doping concentration of the drift layer.
20. The vertical semiconductor device of claim 11 wherein a doping concentration of the buffer layer is between fifteen and twenty-five times an average doping concentration of the drift layer.
21. The vertical semiconductor device of claim 11 wherein a thickness of the buffer layer is between ten and thirty percent of a thickness of the drift layer.
22. The vertical semiconductor device of claim 11 wherein a thickness of the buffer layer is between fifteen and twenty-five percent of a thickness of the drift layer.
23. The vertical semiconductor device of claim 11 wherein:
a doping concentration of the buffer layer is between ten and thirty times an average doping concentration of the drift layer; and
a thickness of the buffer layer is between ten and thirty percent of a thickness of the drift layer.
24. The vertical semiconductor device of claim 23 wherein the spreading layer has a doping concentration between two and one thousand times that of the average doping concentration of the drift layer.
25. The vertical semiconductor device of claim 23 wherein a thickness of the spreading layer is less than a thickness of the drift layer.
26. The vertical semiconductor device of claim 11 wherein:
the graded doping profile increases continuously through the drift layer from the spreading layer to the substrate;
a graded doping profile for the spreading layer decreases continuously through the spreading layer from a top portion of the spreading layer to the drift layer; and
a graded doping profile for the buffer layer increases continuously through the buffer layer from the spreading layer to the substrate.
27. The vertical semiconductor device of claim 26 wherein a maximum doping concentration of the spreading layer is higher than a maximum doping concentration of the drift layer.
28. The vertical semiconductor device of claim 11 wherein a doping concentration of the substrate is higher than a doping concentration of the drift layer.