IP Library › Granted Patent US 12,635,457
Granted Patent B2
US 12,635,457 · App. 18/012,786 · Granted May 19, 2026

Substrate processing system, substrate processing method, and map creating device

Inventor: Takeshi Akimoto (Tokyo, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/67288H01L21/67253H01L22/12
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Quick Facts
Patent No.
US 12,635,457
App. No.
18/012,786
Granted
May 19, 2026
Kind
B2
Abstract

A substrate processing system, includes: a measurement device configured to measure errors of substrates after the substrates are subjected to processing of a first process by a first processing apparatus; a transfer device configured to transfer the substrates between apparatuses including the first processing apparatus, a second processing apparatus that performs processing of a second process after the first process, and the measurement device; a map creating device configured to create an error map indicating a distribution of the errors on the substrates; and an evaluation device configured to calculate an evaluation value indicating a degree of importance of the errors based on the error map, wherein the evaluation device instructs the transfer device on a transfer destination of the substrates subjected to the first process according to a determination result as to whether or not the evaluation value is equal to or larger than a predetermined first threshold value.

Claims (27)

1 . A substrate processing system, comprising:

a measurement device configured to measure errors of substrates after the substrates are subjected to processing of a first process by a first processing apparatus that performs processing of the first process on the substrates;

a transfer device configured to transfer the substrates between apparatuses including the first processing apparatus, a second processing apparatus that performs processing of a second process on the substrates after the first process, and the measurement device;

a map creating device configured to create, for each of the substrates, an error map indicating a distribution of the errors on the substrates after each of the first process and the second process; and

an evaluation device configured to calculate, for each of the substrates, an evaluation value indicating a degree of importance of the errors based on the error map and communicates with each of the first process and the second process via a communication network,

wherein the evaluation device instructs the transfer device on a transfer destination of a first storage device or a second storage device of the substrates subjected to the first process according to a determination result as to whether or not the evaluation value is equal to or larger than a predetermined first threshold value;

wherein when the evaluation device determines that the evaluation value is equal to or larger than the predetermined first threshold value, the evaluation device instructs the transfer device to discard the substrates subjected to the first process from the first storage device without transferring the substrates to the second processing apparatus and wherein when the evaluation device determines that the evaluation value is less than the predetermined first threshold value, the evaluation device instructs the transfer device to transfer the substrates subjected to the first process from the second storage device to the second processing apparatus for the second process.

2 . The substrate processing system of claim 1 , wherein the map creating device includes: an error amount specifier configured to specify, for each of the substrates, an error amount, which is a numerical value indicating an amount of errors, with respect to each of chip regions, which are regions on the substrates where chips are arranged.

3 . The substrate processing system of claim 2 , wherein the map creating device includes:

an updater configured to update, for each of the substrates, the error amount in the chip region containing the errors to a total value of the error amount in the chip region containing the errors and error amounts in other chip regions adjacent to the chip region containing the errors; and

a creator configured to specify, for each of the substrates, a predetermined percentage of chip regions in a descending order of error amounts among the chip regions on the substrates and create an error map indicating a distribution of the specified chip regions.

4 . The substrate processing system of claim 3 , wherein the updater updates the error amounts in the chip regions for the substrates having the total value of the error amounts specified for the chip regions equal to or larger than a predetermined value.

5 . The substrate processing system of claim 4 , wherein the evaluation device includes:

a deterioration level specifier configured to refer to data in which reference maps as different predetermined error maps are respectively associated with deterioration levels, which are numerical values indicating degrees of deterioration of causes of errors constituting a distribution of the reference maps, and specify, for each of the substrates, a deterioration level associated with the reference map having the highest similarity to the error map created by the map creating device; and

an evaluation value calculator configured to calculate, for each of the substrates, a product of the deterioration level and a degree of influence of the first process as the evaluation value of the substrates subjected to the processing of the first process.

6 . The substrate processing system of claim 5 , wherein the deterioration level specifier refers to data in which the reference maps as different predetermined error maps are associated with the causes of errors in the distribution of the reference maps, and further specifies, for each of the substrates, a cause associated with the reference map having the highest similarity to the error map created by the map creating device, and

wherein the evaluation device includes an outputter configured to output the cause specified by the deterioration level specifier in association with identification information of each of the substrates.

7 . The substrate processing system of claim 6 , wherein the evaluation value calculator stops the first processing apparatus when the evaluation value is equal to or larger than a second threshold value larger than the first threshold value.

8 . The substrate processing system of claim 1 , wherein the map creating device includes:

an error amount specifier configured to specify, for each of the substrates, an error amount, which is a numerical value indicating an amount of errors, with respect to each of chip regions, which are regions on the substrates where chips are arranged;

an updater configured to update, for each of the substrates, the error amount in the chip region containing the errors to a total value of the error amount in the chip region containing the errors and error amounts in other chip regions adjacent to the chip region containing the errors; and

a creator configured to specify, for each of the substrates, a predetermined percentage of chip regions in a descending order of error amounts among the chip regions on the substrates and create an error map indicating a distribution of the specified chip regions.

9 . The substrate processing system of claim 1 , wherein the map creating device includes:

an error amount specifier configured to specify, for each of the substrates, an error amount, which is a numerical value indicating an amount of errors, with respect to each of chip regions, which are regions on the substrates where chips are arranged.

10 . The substrate processing system of claim 1 , wherein the evaluation device includes:

a deterioration level specifier configured to refer to data in which reference maps as different predetermined error maps are respectively associated with deterioration levels, which are numerical values indicating degrees of deterioration of causes of errors constituting a distribution of the reference maps, and specify, for each of the substrates, a deterioration level associated with the reference map having the highest similarity to the error map created by the map creating device; and

an evaluation value calculator configured to calculate, for each of the substrates, a product of the deterioration level and a degree of influence of the first process as the evaluation value of the substrates subjected to the processing of the first process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2026
From: AKIMOTO, TAKESHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 074384/0936 →
Priority Claims (1)
JP 2020-109003 · Jun 24, 2020 · national
Continuity (1)
Related Publication 20230253224A1 · Aug 10, 2023
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