Pressure sensing circuit board and method for manufacturing the same
A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.
1. A pressing sensing circuit board, comprising:
a dielectric layer;
a wiring layer stacked on the dielectric layer;
a strain layer stacked on the wiring layer; and
a protective layer stacked on the wiring layer and the strain layer;
wherein the pressing sensing circuit board comprises a first copper area, a second copper area, and a copper-free area connected in that order, the wiring layer is located in the first copper area and the second copper area; along a stacking direction of the wiring layer and the dielectric layer, a thickness of the wiring layer in the first copper area is greater than a thickness of the wiring layer in the second copper area, the wiring layer in the second copper area comprises a mesh-shaped wiring portion; the strain layer is located in the copper-free area and connected to the wiring layer; the protective layer is formed on the wiring layer in the second copper area and further covers the strain layer.
2. The pressing sensing circuit board according to claim 1 , wherein the mesh-shaped wiring portion comprises mesh-shaped wirings, corrugated wirings, and horseshoe-shaped wirings.
3. The pressure sensing circuit board according to claim 1 , wherein along the stacking direction of the wiring layer and the dielectric layer, a thickness of the strain layer is greater than a thickness of the wiring layer in the second copper area.
4. The pressure sensing circuit board according to claim 3 , wherein the strain layer is further located in the second copper area and covers a portion of the wiring layer located in the second copper area.
5. The pressure sensing circuit board according to claim 1 , further comprising three resistors with fixed resistance values, wherein the three resistors and the strain layer cooperatively form a Wheatstone bridge.
6. The pressing sensing circuit board according to claim 1 , further comprising an insulating layer covering the wiring layer in the first copper area.
7. The pressing sensing circuit board according to claim 1 , wherein the dielectric layer is flexible.
8. The pressing sensing circuit board according to claim 1 , wherein the protective layer comprises an insulating ink.
9. The pressing sensing circuit board according to claim 1 , wherein the strain layer comprises a metal or a conductive resin containing carbon.
10. A method for manufacturing a pressing sensing circuit board, comprising:
providing a copper-cladding substrate, which comprising a dielectric layer and a copper layer stacked on the dielectric layer;
partially etching the copper layer to form a second copper area and a first copper area;
partially removing the copper layer in the second copper area to form a copper-free area and to expose a portion of the dielectric layer, etching the copper layer to form a wiring layer, wherein a gridding treatment is further performed on a remaining copper layer in the second copper area to form a mesh-shaped wiring portion;
forming a strain layer on the dielectric layer in the copper-free zone; and
forming a protective layer on the wiring layer in the second copper area and further covering the strain layer, thereby obtaining the pressure sensing circuit board.
11. The method according to claim 10 , wherein along a stacking direction of the copper layer and the dielectric layer, a thickness of the strain layer is greater than a thickness of the wiring layer in the second copper area.
12. The method according to claim 11 , wherein when forming the strain layer, the strain layer further covers the wiring layer adjacent to the copper-free area.
13. The method according to claim 10 , wherein after forming the wiring layer, the method further comprising:
forming an insulating layer on the wiring layer in the first copper area.