Semiconductor device with filling layer and method for fabricating the same
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a conductive structure including a conductive concave layer positioned on the substrate and including a top surface having a V-shaped cross-sectional profile; and a conductive filling layer positioned on the conductive concave layer; and a top conductive layer positioned on the conductive structure. The conductive filling layer includes germanium or silicon germanium.
1 . A semiconductor device, comprising:
a substrate;
a conductive structure comprising:
a conductive concave layer positioned on the substrate and comprising a top surface having a V-shaped cross-sectional profile; and
a conductive filling layer positioned on the conductive concave layer; and
a top conductive layer positioned on the conductive structure;
wherein the conductive filling layer comprises germanium or silicon germanium;
wherein the conductive concave layer comprises silicon and/or germanium with substantially no oxygen and nitrogen.
2 . The semiconductor device of claim 1 , further comprising a first dielectric layer positioned on the substrate, wherein the conductive structure is positioned in the first dielectric layer.
3 . The semiconductor device of claim 2 , further comprising a barrier layer positioned between the conductive structure and the top conductive layer.
4 . The semiconductor device of claim 3 , wherein the first dielectric layer comprises a dielectric material comprising oxygen atoms and/or nitrogen atoms.
5 . The semiconductor device of claim 4 , wherein the barrier layer comprises titanium, titanium nitride, tantalum, tantalum nitride, or a combination thereof.
6 . The semiconductor device of claim 5 , wherein the top conductive layer comprises aluminum, tungsten, copper, or a combination thereof.
7 . The semiconductor device of claim 6 , wherein a width of the conductive concave layer is greater than a width of the conductive filling layer.
8 . The semiconductor device of claim 7 , wherein a top surface of the conductive filling layer is substantially coplanar with a top surface of the first dielectric layer are substantially coplanar.
9 . The semiconductor device of claim 6 , wherein a width of the conductive concave layer and a width of the conductive filling layer are substantially the same.
10 . The semiconductor device of claim 9 , wherein a top surface of the conductive filling layer and a top surface of the first dielectric layer are substantially coplanar.
11 . The semiconductor device of claim 10 , wherein a sidewall of the conductive structure is tapered.
12 . The semiconductor device of claim 9 , wherein a top surface of the conductive filling layer is convex with respect to a top surface of the first dielectric layer.
13 . The semiconductor device of claim 9 , wherein the top surface of the conductive concave layer comprises a first portion and a second portion, the first portion is convex with respect to the substrate and positioned adjacent to the first dielectric layer, and the second portion extends from the first portion and is concave with respect to the substrate.
14 . The semiconductor device of claim 13 , wherein a top surface of the conductive filling layer is convex with respect to the substrate.
15 . The semiconductor device of claim 14 , wherein the barrier layer comprises a convex portion and two flat portions, the convex portion is conformally positioned on the top surface of the conductive filling layer and is convex with respect to the substrate, and the two flat portions extend from two ends of the convex portion and is conformally positioned on a top surface of the first dielectric layer.