IP Library › Granted Patent US 12,538,780
Granted Patent B2
US 12,538,780 · App. 18/178,448 · Granted Jan 27, 2026

Isolator

Inventor: Masaki Yamada (Oita Oita, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
H01L23/5226H01F27/2804H01L21/76243H01L21/76831H01L23/5227H01L21/76224
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Quick Facts
Patent No.
US 12,538,780
App. No.
18/178,448
Granted
Jan 27, 2026
Kind
B2
Abstract

An isolator includes a substrate; a first insulating film on the substrate; a second insulating film on the first insulating film, a third insulating film on the second insulating film, a first interconnect in the second insulating film, and first and second coils. The first interconnect has a thickness equal to a film thickness of the second insulating film. The first coil extends in the first and second insulating films. The first coil has a length in the extending direction greater than the thickness of the first interconnect. The third insulating film is provided on the second insulating film, and covers the first interconnect and the first coil. The second coil is provided on the third insulating film, and faces the first coil via the third insulating film.

Claims (62)

1 . An isolator, comprising:

a substrate;

a first insulating film provided on the substrate;

a second insulating film provided on the first insulating film, the second insulating film including a back surface and a front surface, the back surface facing the first insulating film, a front surface being at a side opposite to the back surface;

a first interconnect provided in the second insulating film, a thickness of the first interconnect being equal to a film thickness of the second insulating film in a first direction directed toward the second insulating film from the substrate;

a first coil extending in the second insulating film and the first insulating film, the first coil having a length in the first direction from the front surface of the second insulating film into the first insulating film, the length in the first direction of the first coil being greater than the thickness in the first direction of the first interconnect;

a third insulating film provided on the second insulating film, the third insulating film covering the first interconnect and the first coil, the third insulating film including a back side and a front side opposite to the back side, the back side of the third insulating film facing the second insulating film;

a second coil provided at the front side of the third insulating film, the second coil facing the first coil via the third insulating film; and

a fourth insulating film provided between the first insulating film and the second insulating film,

the first interconnect extending through the second insulating film and contacting the fourth insulating film,

wherein

the fourth insulating film is provided without contacting the first coil.

2 . The isolator according to claim 1 , further comprising:

interlayer interconnects provided in the first insulating film and positioned between the substrate and the first interconnect,

the first interconnect being connected to at least one of the interlayer interconnects via a contact hole provided in the first and fourth insulating films.

3 . The isolator according to claim 2 , wherein

the interlayer interconnects are not located between the substrate and the first coil.

4 . The isolator according to claim 1 , wherein

the third insulating film is different in a composition from the second insulating film.

5 . An isolator, comprising:

a substrate;

a first insulating film provided on the substrate;

a second insulating film provided on the first insulating film, the second insulating film including a back surface and a front surface, the back surface facing the first insulating film, a front surface being at a side opposite to the back surface;

a first interconnect provided in the second insulating film, a thickness of the first interconnect being equal to a film thickness of the second insulating film in a first direction directed toward the second insulating film from the substrate;

a first coil extending in the second insulating film and the first insulating film, the first coil having a length in the first direction from the front surface of the second insulating film into the first insulating film, the length in the first direction of the first coil being greater than the thickness in the first direction of the first interconnect;

a third insulating film provided on the second insulating film, the third insulating film covering the first interconnect and the first coil, the third insulating film including a back side and a front side opposite to the back side, the back side of the third insulating film facing the second insulating film; and

a second coil provided at the front side of the third insulating film, the second coil facing the first coil via the third insulating film,

wherein

the third insulating film includes a plurality of sub-insulating films stacked in the first direction, and

one of the sub-insulating films having a film thickness in the first direction greater than film thicknesses in the first direction of other sub-insulating films, the one of the sub-insulating films being different in a composition from the first insulating film and the second insulating film.

6 . The isolator according to claim 5 , further comprising:

a fourth insulating film provided between the first insulating film and the second insulating film,

the first interconnect extending through the second insulating film and contacting the fourth insulating film,

wherein

the fourth insulating film is provided without contacting the first coil.

7 . The isolator according to claim 6 , further comprising:

interlayer interconnects provided in the first insulating film and positioned between the substrate and the first interconnect,

the first interconnect being connected to at least one of the interlayer interconnects via a contact hole provided in the first and fourth insulating films.

8 . The isolator according to claim 7 , wherein

the interlayer interconnects are not located between the substrate and the first coil.

9 . An isolator, comprising:

a substrate;

a first insulating film provided on the substrate;

a second insulating film provided on the first insulating film, the second insulating film including a back surface and a front surface, the back surface facing the first insulating film, a front surface being at a side opposite to the back surface;

a first interconnect provided in the second insulating film, a thickness of the first interconnect being equal to a film thickness of the second insulating film in a first direction directed toward the second insulating film from the substrate;

a first coil extending in the second insulating film and the first insulating film, the first coil having a length in the first direction from the front surface of the second insulating film into the first insulating film, the length in the first direction of the first coil being greater than the thickness in the first direction of the first interconnect;

a third insulating film provided on the second insulating film, the third insulating film covering the first interconnect and the first coil, the third insulating film including a back side and a front side opposite to the back side, the back side of the third insulating film facing the second insulating film;

a second coil provided at the front side of the third insulating film, the second coil facing the first coil via the third insulating film; and

a second interconnect provided in the second insulating film, the second interconnect having a thickness in the first direction equal to the film thickness of the second insulating film; and

an upper layer terminal provided on the front side of the third insulating film, the upper layer terminal being apart from the second coil,

the second interconnect being provided between the first interconnect and the first coil, the second interconnect being apart from the first interconnect and the first coil,

the first interconnect being electrically connected to the upper layer terminal via a contact plug extending in the third insulating film.

10 . The isolator according to claim 9 , further comprising:

a fourth insulating film provided between the first insulating film and the second insulating film,

the first interconnect extending through the second insulating film and contacting the fourth insulating film,

wherein

the fourth insulating film is provided without contacting the first coil.

11 . The isolator according to claim 10 , further comprising:

interlayer interconnects provided in the first insulating film and positioned between the substrate and the first interconnect,

the first interconnect being connected to at least one of the interlayer interconnects via a contact hole provided in the first and fourth insulating films.

12 . The isolator according to claim 11 , wherein

the interlayer interconnects are not located between the substrate and the first coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2023
From: YAMADA, MASAKI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 063063/0490 →
Priority Claims (1)
JP 2022-151235 · Sep 22, 2022 · national
Continuity (1)
Related Publication 20240105592A1 · Mar 28, 2024
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