IP Library Granted Patent US 12,237,871
Granted Patent B2
US 12,237,871 · App. 18/190,931 · Granted Feb 25, 2025

Photonic communication platform and related methods for increasing yield

Inventors: Mykhailo Tymchenko (Melrose, MA); Bradford Turcott (Georgetown, TX); Robert Turner (Georgetown, TX); Binoy Shah (Niskayuna, NY); Shashank Gupta (Newton, MA); James Carr (Tewksbury, MA); Ajay Joshi (Lexington, MA); Nicholas C. Harris (Boston, MA); Darius Bunandar (Boston, MA)
Assignee: Lightmatter, Inc.
H04B10/70G02B6/124G02B6/13G02B6/4215G02B6/4249G02B6/43H04B10/07953H04B10/40H04B10/50H04B10/803H04B10/808H04J14/0212
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,237,871
App. No.
18/190,931
Granted
Feb 25, 2025
Kind
B2
Abstract

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.

Claims (40)

1. A photonic device, comprising:

a photonic circuit;

a plurality of optical channels having a plurality of chip-to-fiber couplers and a plurality of waveguides coupled to respective chip-to-fiber couplers;

an optical switch coupled between the plurality of optical channels and the photonic circuit; and

a controller configured to:

determine information indicative of a performance associated with each of the plurality of optical channels;

identify a subset of the plurality of optical channels using the information indicative of the performance associated with each of the plurality of optical channels; and

control the optical switch to selectively couple the subset of the plurality of optical channels to the photonic circuit.

2. The photonic device of claim 1 , wherein the plurality of optical channels further comprise a plurality of photodetectors coupled to respective waveguides, and wherein determining the information indicative of the performance associated with each of the plurality of optical channels comprises determining an output of each of the plurality of photodetectors.

3. The photonic device of claim 2 , wherein the plurality of photodetectors are coupled to the respective waveguides via tap couplers.

4. The photonic device of claim 1 , wherein determining information indicative of the performance associated with each of the plurality of optical channels comprises determining a bit error rate (BER) associated with each of the plurality of optical channels.

5. The photonic device of claim 1 , wherein the photonic circuit comprises a plurality of tiles that are patterned in accordance with a template tile, wherein each tile comprises:

a transmitter;

a receiver;

a network of programmable optical connections; and

electrical connections configured for vertical die-to-die connection with an electronic chip, the electrical connections being coupled to the transmitter, the receiver and the network of programmable optical connections.

6. The photonic device of claim 1 , wherein identifying the subset of the plurality of optical channels using the information comprises identifying the subset of the plurality of optical channels exhibiting best performance among the optical channels.

7. The photonic device of claim 1 , wherein the chip-to-fiber couplers comprise edge couplers or grating couplers.

8. The photonic device of claim 1 , wherein the controller is further configured to control the photonic circuit to transmit data outside the photonic device using the subset of the plurality of optical channels selected by the optical switch.

9. A method for transmitting data using a photonic device comprising an optical switch and a plurality of optical channels having a plurality of chip-to-fiber couplers and a plurality of waveguides coupled to respective chip-to-fiber couplers, the method comprising:

determining information indicative of a performance associated with each of the plurality of optical channels;

identifying a subset of the plurality of optical channels using the information indicative of the performance associated with each of the plurality of optical channels;

controlling the optical switch to select the subset of the plurality of optical channels, and

transmitting the data outside the photonic device using the subset of the plurality of optical channels selected by the optical switch.

10. The method of claim 9 , wherein the plurality of optical channels further comprise a plurality of photodetectors coupled to respective waveguides, and wherein determining the information indicative of the performance associated with each of the plurality of optical channels comprises determining an output of each of the plurality of photodetectors.

11. The method of claim 9 , wherein determining information indicative of the performance associated with each of the plurality of optical channels comprises determining a bit error rate (BER) associated with each of the plurality of optical channels.

12. The method of claim 9 , wherein identifying the subset of the plurality of optical channels using the information comprises identifying the subset of the plurality of optical channels exhibiting best performance among the optical channels.

13. A photonic interposer, comprising:

a plurality of photonic tiles including a redundant tile, each photonic tile comprising:

a transmitter;

a receiver;

a network of programmable optical connections;

electrical connections configured for vertical die-to-die connection with an electronic chip, the electrical connections being coupled to the transmitter, the receiver and the network of programmable optical connections;

a monitoring photodetector; and

a controller configured to:

determine information indicative of a performance of each of the plurality of photonic tiles using an output of the respective monitoring photodetector;

identify, among the plurality of tiles, a defective tile using the information indicative of the performance of each of the plurality of photonic tiles; and

functionally swap the defective tile with the redundant tile.

14. The photonic interposer of claim 13 , wherein functionally swapping the defective tile with the redundant tile comprises redirecting, to the redundant tile, data directed to the defective tile.

15. The photonic interposer of claim 14 , wherein redirecting the data comprises programming the network of programmable optical connections.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2023
From: TYMCHENKO, MYKHAILO; TURCOTT, BRADFORD; TURNER, ROBERT; SHAH, BINOY; GUPTA, SHASHANK; CARR, JAMES; JOSHI, AJAY; HARRIS, NICHOLAS C.; BUNANDAR, DARIUS
To: LIGHTMATTER, INC.
Reel/Frame 063189/0626 →
Continuity (8)
Provisional Application 63428003 · Nov 25, 2022
Provisional Application 63397609 · Aug 12, 2022
Provisional Application 63355275 · Jun 24, 2022
Provisional Application 63332518 · Apr 19, 2022
Provisional Application 63327717 · Apr 5, 2022
Provisional Application 63325113 · Mar 29, 2022
Provisional Application 63324598 · Mar 28, 2022
Related Publication 20230388024A1 · Nov 30, 2023
References Cited (121)
US 5181134A · Fatehi · 1993 [cited by examiner]
US 5416861A · Koh et al. · 1995 [cited by applicant]
US 5771323A · Trott · 1998 [cited by applicant]
US 5930429A · Trott · 1999 [cited by applicant]
US 6202165B1 · Pine · 2001 [cited by applicant]
US 6477285B1 · Shanley · 2002 [cited by applicant]
US 7251386B1 · Dickinson et al. · 2007 [cited by applicant]
US 7310459B1 · Rahman · 2007 [cited by applicant]
US 7894699B2 · Beausoleil · 2011 [cited by applicant]
US 8450186B2 · Rong · 2013 [cited by applicant]
US 9671572B2 · Decker et al. · 2017 [cited by applicant]
US 9922887B2 · Vermeulen et al. · 2018 [cited by applicant]
US 10847467B2 · Collins et al. · 2020 [cited by applicant]
US 11036002B2 · Harris et al. · 2021 [cited by applicant]
US 11754783B2 · Harris et al. · 2023 [cited by applicant]
US 11860413B2 · Harris et al. · 2024 [cited by applicant]
US 20020028045A1 · Yoshimura et al. · 2002 [cited by applicant]
US 20040258408A1 · Ramaswami et al. · 2004 [cited by applicant]
US 20050224946A1 · Dutta · 2005 [cited by applicant]
US 20060039705A1 · Goodwill · 2006 [cited by examiner]
US 20070280585A1 · Warashina et al. · 2007 [cited by applicant]
US 20080044128A1 · Kish, Jr. et al. · 2008 [cited by applicant]
US 20080089640A1 · Beausoleil · 2008 [cited by applicant]
US 20090103345A1 · Mclaren et al. · 2009 [cited by applicant]
US 20090103855A1 · Binkert et al. · 2009 [cited by applicant]
US 20100054671A1 · Ban et al. · 2010 [cited by applicant]
US 20110052120A1 · Tan et al. · 2011 [cited by applicant]
US 20110073989A1 · Rong et al. · 2011 [cited by applicant]
US 20110128790A1 · Sarin et al. · 2011 [cited by applicant]
US 20110269456A1 · Krishnaswamy et al. · 2011 [cited by applicant]
US 20120149148A1 · Dallesasse et al. · 2012 [cited by applicant]
US 20120177381A1 · Dobbelaere · 2012 [cited by examiner]
US 20120203695A1 · Morgan et al. · 2012 [cited by applicant]
US 20130051725A1 · Shinoda et al. · 2013 [cited by applicant]
US 20130071121A1 · Sharapov et al. · 2013 [cited by applicant]
US 20130156366A1 · Raj et al. · 2013 [cited by applicant]
US 20130209112A1 · Witzens · 2013 [cited by applicant]
US 20130243429A1 · Whelihan et al. · 2013 [cited by applicant]
US 20130292840A1 · Shoemaker et al. · 2013 [cited by applicant]
US 20130308893A1 · Zuffada et al. · 2013 [cited by applicant]
US 20140040698A1 · Loh et al. · 2014 [cited by applicant]
US 20140043050A1 · Stone et al. · 2014 [cited by applicant]
US 20140264400A1 · Lipson et al. · 2014 [cited by applicant]
US 20140268980A1 · Kim et al. · 2014 [cited by applicant]
US 20140294342A1 · Offrein et al. · 2014 [cited by applicant]
US 20140300008A1 · Duan et al. · 2014 [cited by applicant]
US 20140363124A1 · Pelley et al. · 2014 [cited by applicant]
US 20140363172A1 · Pelley et al. · 2014 [cited by applicant]
US 20150381273A1 · Gloeckner et al. · 2015 [cited by applicant]
US 20160085038A1 · Decker et al. · 2016 [cited by applicant]
US 20160156999A1 · Liboiron-Ladouceur · 2016 [cited by examiner]
US 20160181322A1 · Mazed et al. · 2016 [cited by applicant]
US 20160191188A1 · Butler · 2016 [cited by applicant]
US 20160216445A1 · Thacker et al. · 2016 [cited by applicant]
US 20160252688A1 · Barwicz et al. · 2016 [cited by applicant]
US 20160334590A1 · Celo · 2016 [cited by examiner]
US 20170010414A1 · Dumais · 2017 [cited by examiner]
US 20170108655A1 · Zarbock et al. · 2017 [cited by applicant]
US 20170160474A1 · Mahmoodian et al. · 2017 [cited by applicant]
US 20170194309A1 · Evans et al. · 2017 [cited by applicant]
US 20180045885A1 · Canali et al. · 2018 [cited by applicant]
US 20190162901A1 · Yu et al. · 2019 [cited by applicant]
US 20190189603A1 · Wang et al. · 2019 [cited by applicant]
US 20190310433A1 · Yoo et al. · 2019 [cited by applicant]
US 20190335252A1 · Ryan · 2019 [cited by applicant]
US 20190363797A1 · Peterson et al. · 2019 [cited by applicant]
US 20200006304A1 · Chang et al. · 2020 [cited by applicant]
US 20200111720A1 · Wan et al. · 2020 [cited by applicant]
US 20200284981A1 · Harris et al. · 2020 [cited by applicant]
US 20210096311A1 · Yu et al. · 2021 [cited by applicant]
US 20210118853A1 · Harris et al. · 2021 [cited by applicant]
US 20210202562A1 · Chang et al. · 2021 [cited by applicant]
US 20210215897A1 · Epitaux et al. · 2021 [cited by applicant]
US 20210278590A1 · Harris et al. · 2021 [cited by applicant]
US 20210375829A1 · Or-Bach et al. · 2021 [cited by applicant]
US 20220109075A1 · Byrd et al. · 2022 [cited by applicant]
US 20220148627A1 · Meade et al. · 2022 [cited by applicant]
US 20230085268A1 · Harris et al. · 2023 [cited by applicant]
US 20230114842A1 · Harris et al. · 2023 [cited by applicant]
US 20230114847A1 · Harris et al. · 2023 [cited by applicant]
US 20230308188A1 · Dorta-Quinones et al. · 2023 [cited by applicant]
US 20230314711A1 · Eslampour et al. · 2023 [cited by applicant]
US 20230358957A1 · Harris et al. · 2023 [cited by applicant]
US 20230400632A1 · Harris et al. · 2023 [cited by applicant]
US 20230408764A1 · Harris et al. · 2023 [cited by applicant]
EP 2212887B1 · 2013 [cited by applicant]
EP 3159721A1 · 2017 [cited by applicant]
JP H0798463A · 1995 [cited by applicant]
JP 2005502127A · 2005 [cited by applicant]
JP 2011501238A · 2011 [cited by applicant]
JP 2011503760A · 2011 [cited by applicant]
JP 2015062027A · 2015 [cited by applicant]
JP 2018506072A · 2018 [cited by applicant]
JP 2018093007A · 2018 [cited by applicant]
JP 2018195723A · 2018 [cited by applicant]
KR 1020100095515A · 2010 [cited by applicant]
TW 508834B · 2002 [cited by applicant]
WO WO2011143548A2 · 2011 [cited by applicant]
WO WO2016008771A1 · 2016 [cited by applicant]
WO WO2019132970A1 · 2019 [cited by applicant]
International Search Report and Written Opinion mailed Jan. 18, 2023, in connection with International Application No. PCT/US2022/046379. [cited by applicant]
International Search Report and Written Opinion mailed Jan. 26, 2023, in connection with International Application No. PCT/US2022/043209. [cited by applicant]
International Search Report and Written Opinion for International Application No. PCT/US2020/021209, mailed Jul. 6, 2020. [cited by applicant]
International Preliminary Report on Patentability for International Application No. PCT/US2020/021209, mailed Sep. 16, 2021. [cited by applicant]
Invitation to Pay Additional Fees for International Application No. PCT/US2020/021209, mailed May 1, 2020. [cited by applicant]
Invitation to Pay Additional Fees mailed Nov. 7, 2022, in connection with International Application No. PCT/US2022/043209. [cited by applicant]
Extended European Search Report dated Nov. 4, 2022, in connection with European Application No. 20766814.6. [cited by applicant]
Beausoleil et al., Nanoelectronic and nanophotonic interconnect. Proceedings of the IEEE. Feb. 2008;96(2):230-47. doi:10.1109/JPROC.2007.911057. [cited by applicant]
Fujikata et al., LSI on-chip optical interconnection with Si nano-photonics. Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials. 2007. pp. 276-277. [cited by applicant]
Grigalunas, Tell Me—What Is Wafer Dicing? Eastern States Components, LLC. Sep. 26, 2017. 2 pages. URL:https://www.escomponents.com/blog/2017/9/26/tell-me-what-is-wafer-dicing [retrieved Jul. 13, 2020]. [cited by applicant]
Udipi et al., Combining memory and a controller with photonics through 3D-stacking to enable scalable and energy-efficient systems. 38th Annual International Symposium on Computer Architecture (ISCA). Jun. 8, 2011;425-4… [cited by applicant]
Wada, Electronics and Photonics Convergence on Si CMOS Platform. Proc. of SPIE. 2004;5357:16-24. [cited by applicant]
Young et al., Optical technology for energy efficient I/O in high performance computing. IEEE Communications Magazine. Oct. 2010;48:184-91. [cited by applicant]
International Search Report and Written Opinion dated Feb. 28, 2024, in connection with International Application No. PCT/US23/80883. [cited by applicant]
Extended European Search Report dated Feb. 19, 2024, in connection with European Application No. 21750009.9. [cited by applicant]
Bell, Shane et al., TILE64—Processor: A 64-Core SoC with Mesh Interconnect, 2008 IEEE. International Solid-State Circuits Conference—Digest of Technical Papers, Feb. 2008, pp. 1-3, DOI:10.1109/ISSCC.2008.4523070. [cited by applicant]
International Search Report and Written Opinion mailed Nov. 29, 2023, in connection with International Application No. PCT/US23/65007. [cited by applicant]
Singapore Search Report and Written Opinion dated Dec. 1, 2023, in connection with Singapore Application No. 11202108868T. [cited by applicant]
Orcutt et al., Open foundry platform for high-performance electronic-photonic integration. Optics Express. May 21, 2012;20(11).11 Pages. [cited by applicant]
PCT/US2023/065007, Aug. 25, 2023, Invitation to Pay Additional Fees. [cited by applicant]
Invitation to Pay Additional Fees dated Aug. 25, 2023, in connection with International Application No. PCT/US2023/065007. [cited by applicant]
Cited By (1)
US 12,401,427