Film-forming material
A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO X F Y (X and Y are numbers satisfying 0<X and X<Y) and YF 3 , wherein a ratio I 2 /I 1 of a peak height I 2 of the (020) plane of YF 3 to a peak height I 1 of the main peak of YO X F Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I 4 /I 1 of a peak height I 4 of the main peak of Y 2 O 3 to the peak height I 1 of the main peak of YO X F Y as analyzed by XRD is 0.01 or less.
1 . A film-forming material in powder form comprising:
an yttrium oxyfluoride represented by YO 0.8 F 1.4 and YF 3 ,
wherein a ratio I 2 /I 1 of a peak height I 2 of the (020) plane of the YF 3 to a height I 1 of a main peak of the YO 0.8 F 1.4 as analyzed by XRD is from 0.19 to 3,
and the average particle size D 50 of the film-forming material in powder form is 0.1 μm to 9 μm, and an oxygen content in the film-forming material in powder form is from 0.5 to 11.0 mass %.
2 . The film-forming material in powder form according to claim 1 , wherein a ratio I 3 /I 1 of a peak height Is of a main peak of YOF to the peak height I 1 of the main peak of the YO 0.8 F 1.4 as analyzed by XRD is 0.5 or less.
3 . The film-forming material in powder form according to claim 1 , wherein a ratio I 4 /I 1 of a peak height I 4 of a main peak of Y 2 O 3 to the peak height I 1 of the main peak of the YO 0.8 F 1.4 as analyzed by XRD is 0.01 or less.
4 . The film-forming material in powder form according to claim 1 , wherein the film-forming material in powder form is used for a thermal spraying method.
5 . The film-forming material in powder form according to claim 1 , wherein the film-forming material is used for an aerosol deposition method.
6 . The film-forming material in powder form according to claim 1 , wherein the film-forming material is used for an ion plating method.
7 . A method for producing a film, which comprises a step of thermal spraying the film-forming material in powder form according to claim 1 .
8 . A method for producing a film, which comprises a step of aerosol depositing the film-forming material in powder form according to claim 1 .
9 . A method for producing a film, which comprises a step of ion plating the film-forming material in powder form according to claim 1 .
10 . A film-forming material in slurry form which contains the film-forming material in powder form according to claim 1 .
11 . The film-forming material in slurry form according to claim 10 , wherein the film-forming material in slurry form is used for a thermal spraying method.
12 . A method for producing a film, which comprises a step of thermal spraying the film-forming material in slurry form according to claim 10 .
13 . A film-forming material in powder form according to claim 1 , which is obtained by firing a mixture obtained by grinding a powder containing Y 2 O 3 and YF 3 , and grinding the fired product.
14 . The film-forming material in powder form according to claim 1 , wherein the average particle size D 50 of the film-forming material in powder form is 0.1 μm to 8 μm.